JP4444486B2 - 半導体ウェハの周縁微小領域におけるマーク読取方法 - Google Patents

半導体ウェハの周縁微小領域におけるマーク読取方法 Download PDF

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Publication number
JP4444486B2
JP4444486B2 JP2000364357A JP2000364357A JP4444486B2 JP 4444486 B2 JP4444486 B2 JP 4444486B2 JP 2000364357 A JP2000364357 A JP 2000364357A JP 2000364357 A JP2000364357 A JP 2000364357A JP 4444486 B2 JP4444486 B2 JP 4444486B2
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Japan
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mark
wafer
reading
semiconductor wafer
minute
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Expired - Fee Related
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JP2000364357A
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Japanese (ja)
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JP2002170863A (ja
JP2002170863A5 (enExample
Inventor
悦郎 佐藤
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Komatsu Ltd
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Komatsu Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2000364357A 2000-11-30 2000-11-30 半導体ウェハの周縁微小領域におけるマーク読取方法 Expired - Fee Related JP4444486B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000364357A JP4444486B2 (ja) 2000-11-30 2000-11-30 半導体ウェハの周縁微小領域におけるマーク読取方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000364357A JP4444486B2 (ja) 2000-11-30 2000-11-30 半導体ウェハの周縁微小領域におけるマーク読取方法

Publications (3)

Publication Number Publication Date
JP2002170863A JP2002170863A (ja) 2002-06-14
JP2002170863A5 JP2002170863A5 (enExample) 2007-11-08
JP4444486B2 true JP4444486B2 (ja) 2010-03-31

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JP2000364357A Expired - Fee Related JP4444486B2 (ja) 2000-11-30 2000-11-30 半導体ウェハの周縁微小領域におけるマーク読取方法

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JP (1) JP4444486B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7479764B2 (ja) * 2020-08-07 2024-05-09 株式会社ディスコ 切削装置

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JP2002170863A (ja) 2002-06-14

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