JP4439722B2 - 吸熱器及び吸熱器の製造方法 - Google Patents

吸熱器及び吸熱器の製造方法 Download PDF

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Publication number
JP4439722B2
JP4439722B2 JP2000385663A JP2000385663A JP4439722B2 JP 4439722 B2 JP4439722 B2 JP 4439722B2 JP 2000385663 A JP2000385663 A JP 2000385663A JP 2000385663 A JP2000385663 A JP 2000385663A JP 4439722 B2 JP4439722 B2 JP 4439722B2
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heat
central member
cooling
peripheral surface
fin
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Expired - Fee Related
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JP2000385663A
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Japanese (ja)
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JP2001223490A (ja
JP2001223490A5 (enExample
Inventor
ガイ・アール・ワグナー
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アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2000385663A 1999-12-23 2000-12-19 吸熱器及び吸熱器の製造方法 Expired - Fee Related JP4439722B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/471,835 US6360816B1 (en) 1999-12-23 1999-12-23 Cooling apparatus for electronic devices
US09/471835 1999-12-23

Publications (3)

Publication Number Publication Date
JP2001223490A JP2001223490A (ja) 2001-08-17
JP2001223490A5 JP2001223490A5 (enExample) 2007-10-11
JP4439722B2 true JP4439722B2 (ja) 2010-03-24

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JP2000385663A Expired - Fee Related JP4439722B2 (ja) 1999-12-23 2000-12-19 吸熱器及び吸熱器の製造方法

Country Status (2)

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US (2) US6360816B1 (enExample)
JP (1) JP4439722B2 (enExample)

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US6987370B2 (en) * 2003-06-23 2006-01-17 Hewlett-Packard Development Company, L.P. Method and system for cooling electronic components
JP4140495B2 (ja) * 2003-09-25 2008-08-27 株式会社日立製作所 冷却モジュール
CN2694486Y (zh) * 2004-03-06 2005-04-20 鸿富锦精密工业（深圳）有限公司 散热装置
US7381129B2 (en) * 2004-03-15 2008-06-03 Airius, Llc. Columnar air moving devices, systems and methods
US20120195749A1 (en) 2004-03-15 2012-08-02 Airius Ip Holdings, Llc Columnar air moving devices, systems and methods
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
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US7524686B2 (en) * 2005-01-11 2009-04-28 Semileds Corporation Method of making light emitting diodes (LEDs) with improved light extraction by roughening
US7897420B2 (en) * 2005-01-11 2011-03-01 SemiLEDs Optoelectronics Co., Ltd. Light emitting diodes (LEDs) with improved light extraction by roughening
US7563625B2 (en) * 2005-01-11 2009-07-21 SemiLEDs Optoelectronics Co., Ltd. Method of making light-emitting diodes (LEDs) with improved light extraction by roughening
US7378288B2 (en) * 2005-01-11 2008-05-27 Semileds Corporation Systems and methods for producing light emitting diode array
US7186580B2 (en) * 2005-01-11 2007-03-06 Semileds Corporation Light emitting diodes (LEDs) with improved light extraction by roughening
US20060154393A1 (en) * 2005-01-11 2006-07-13 Doan Trung T Systems and methods for removing operating heat from a light emitting diode
US9130114B2 (en) 2005-01-11 2015-09-08 SemiLEDs Optoelectronics Co., Ltd. Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabrication
US7473936B2 (en) * 2005-01-11 2009-01-06 Semileds Corporation Light emitting diodes (LEDs) with improved light extraction by roughening
US20060215364A1 (en) * 2005-03-28 2006-09-28 Le Cuong D Heatsink for high-power microprocessors
CN100562232C (zh) * 2005-09-14 2009-11-18 富准精密工业(深圳)有限公司 热管散热装置
US20070131386A1 (en) * 2005-12-14 2007-06-14 Ming-Kun Tsai Fin unit for a cooler
US20080066898A1 (en) * 2006-09-15 2008-03-20 Foxconn Technology Co., Ltd. Heat dissipation device
US20080121369A1 (en) * 2006-11-28 2008-05-29 Foxconn Technology Co., Ltd. Heat dissipation assembly having fan duct
US8528627B2 (en) * 2007-12-12 2013-09-10 Golden Sun News Techniques Co., Ltd. Heat-dissipating device having air-guiding cover
US9151295B2 (en) 2008-05-30 2015-10-06 Airius Ip Holdings, Llc Columnar air moving devices, systems and methods
US8616842B2 (en) * 2009-03-30 2013-12-31 Airius Ip Holdings, Llc Columnar air moving devices, systems and method
US20100038060A1 (en) * 2008-08-18 2010-02-18 Asia Vital Components Co., Ltd. Heat dissipation device capable of collecting air
US7972037B2 (en) 2008-11-26 2011-07-05 Deloren E. Anderson High intensity replaceable light emitting diode module and array
US8354779B2 (en) * 2009-01-16 2013-01-15 Light Prescriptions Innovators Llc Heat sink with helical fins and electrostatic augmentation
US20100243228A1 (en) * 2009-03-31 2010-09-30 Price Richard J Method and Apparatus to Effect Heat Transfer
US20110073289A1 (en) * 2009-09-25 2011-03-31 Shah Ketan R Low profile blower radial heatsink
CA2838934C (en) 2011-06-15 2016-08-16 Airius Ip Holdings, Llc Columnar air moving devices, systems and methods
EP2721352B1 (en) 2011-06-15 2015-09-16 Airius IP Holdings, LLC Columnar air moving devices and systems
USD698916S1 (en) 2012-05-15 2014-02-04 Airius Ip Holdings, Llc Air moving device
US11604035B2 (en) * 2013-09-29 2023-03-14 Huawei Technologies Co., Ltd. Support plateheat dissipation apparatus
CA2875347C (en) 2013-12-19 2022-04-19 Airius Ip Holdings, Llc Columnar air moving devices, systems and methods
US10024531B2 (en) 2013-12-19 2018-07-17 Airius Ip Holdings, Llc Columnar air moving devices, systems and methods
CA2953226C (en) 2014-06-06 2022-11-15 Airius Ip Holdings, Llc Columnar air moving devices, systems and methods
US10103081B2 (en) * 2014-09-08 2018-10-16 Ashwin Bharadwaj Heat sink
USD820967S1 (en) 2016-05-06 2018-06-19 Airius Ip Holdings Llc Air moving device
USD805176S1 (en) 2016-05-06 2017-12-12 Airius Ip Holdings, Llc Air moving device
US10487852B2 (en) 2016-06-24 2019-11-26 Airius Ip Holdings, Llc Air moving device
USD886275S1 (en) 2017-01-26 2020-06-02 Airius Ip Holdings, Llc Air moving device
USD885550S1 (en) 2017-07-31 2020-05-26 Airius Ip Holdings, Llc Air moving device
USD987054S1 (en) * 2019-03-19 2023-05-23 Airius Ip Holdings, Llc Air moving device
USD887541S1 (en) 2019-03-21 2020-06-16 Airius Ip Holdings, Llc Air moving device
AU2020257205A1 (en) 2019-04-17 2021-11-04 Airius Ip Holdings, Llc Air moving device with bypass intake
JP7190076B1 (ja) * 2022-05-25 2022-12-14 古河電気工業株式会社 ヒートシンク

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Also Published As

Publication number Publication date
US20020038699A1 (en) 2002-04-04
US6561261B2 (en) 2003-05-13
JP2001223490A (ja) 2001-08-17
US6360816B1 (en) 2002-03-26

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