JP4426799B2 - Substrate cutting method and apparatus - Google Patents

Description

  The present invention includes a step of cutting individual molded substrates with a dicer mechanism provided in a substrate cutting device to form individual packages, and a method for combining the molded substrates and individual packages described above with a handler mechanism provided in the device. The present invention relates to a transporting process, and a substrate cutting method performed using a package housing jig and an improvement of the apparatus.

  Conventionally, a dicer mechanism that cuts a molded substrate, a molded substrate, and a molded substrate in which a plurality of electronic components are collectively molded by cutting a molded substrate and transporting each cut package. A substrate cutting device provided with at least a handler mechanism for conveying individual packages (dies) is used.

  The dicer mechanism and the handler mechanism in the cutting device are constituted by, for example, a nest that accommodates each package cut in a housing portion that is a lattice-shaped holding wall, and an upper cover that is placed on the nest that houses the package. It has been carried out using a package receiving jig.

  In the dicer mechanism using the package accommodation jig described above, the nest and the vacuum block table are used together, and the nest is fitted to the pedestal (suction part) of the vacuum block table, and the molded substrate is transferred to the pedestal. The molded substrate is cut while being adsorbed and fixed to the upper surface. In addition, after the molded substrate is cut into individual packages, the handler mechanism first waits for the upper cover on the cut individual packages and the nest, and then the package in which the upper cover and the nest match. The housing jig is lifted from the vacuum block table, and the cut package is pushed downward and held by the upper cover. At this time, the cut individual packages are accommodated in a horizontal state in the accommodating portion in the holding wall of the nest. The upper cover has, for example, a plurality of contact posts in order to push the cut individual packages downward, and these contact posts are in contact with the four corners which are predetermined places of the cut packages. However, each package can be pressed downward by the weight of the upper cover.

In addition, the dicer mechanism and the handler mechanism in the above-described cutting apparatus are provided with independent control mechanisms, and each of the control mechanisms is configured to control the dicer mechanism and the handler mechanism separately. In order to carry out the type exchange operation corresponding to the type of the various molded substrates, the operator sets the type information separately for each independent control mechanism.
JP 11-330007 A

  However, as a trend in recent years, the number of electronic components mounted on a single board increases, the board itself becomes larger, the thickness of the board or the electronic part itself becomes thinner, or the package cut from the molded board Since the size (width) of the resin is very thin, the molded substrate is cut because a large number of electronic components are molded at once in the resin molding process, which is the previous process. Each package formed in this manner is required to be compatible with small-volume production of various products using the above-described package housing jig and a substrate cutting device provided with independent dicer mechanisms and handler mechanisms. .

However, a molded substrate in which a large number of electronic components are collectively molded may be molded in a curved state, and when the curved substrate is cut using the above-described substrate cutting device, The cut package attracts the package in a state of being slightly shifted from a predetermined position in the pedestal top surface portion of the vacuum block. When the nest is lifted from the vacuum block table, the package that has been sucked in the shifted state is mounted on the top surface portion of the holding wall that forms the accommodating portion of the nest. When the upper cover is placed with this package on board, a contact post provided on the upper cover presses a place different from a predetermined place where the normal package is pressed.
Furthermore, in order to resin-mold a large number of electronic components at a time, mounting between electronic components at a narrow interval is performed on a substrate. In the case of the substrates mounted at this narrow pitch, the package is frequently sucked in a state of being deviated from a predetermined position on the pedestal top surface portion of the vacuum block, so that the top of the holding wall in the nest housing portion is absorbed. There was a case where a lot of packages got on the surface.
Therefore, between the holding wall top surface, which is the housing part of the nest, and the upper cover, the package is pressed and sandwiched by the package housing jig while the package is tilted. There was a problem that the package was scattered from the package housing jig, that is, the package could not be securely housed in the housing portion of the nest.
In addition, the weight of the upper cover and the contact post alone can be used to hold the inclined package and guide the package from the inclined state to the horizontal state in the holding wall, which is the housing part of the nest, without being accommodated. Since the nest and the upper cover do not match well, each time the entire cutting device is stopped, the operator places the package in the nest so that it is in a horizontal state, and it is very laborious to match the nest and the upper cover It took a lot of work.

Therefore, the problem to be solved is that, in the conventional package receiving jig and the substrate cutting apparatus provided with the independent dicer mechanism and the handler mechanism, the entire cutting apparatus is stopped and the operator can level the package. Since it is necessary to accommodate in the nest so as to be in a state, the operation state of the entire cutting device described above is significantly reduced.

A substrate cutting method according to the present invention for solving the technical problem described above includes a step of cutting individual molded substrates by a dicer mechanism provided in a substrate cutting device to form individual packages, and a cutting device . The molded handler and the individual package are transported by the provided handler mechanism, and are placed on the nest and the nest for housing the individual packages constituting the package housing jig provided in the cutting device. A substrate cutting method for performing each process using a nest cover that holds the package and accommodating each package in a package housing jig by elastically pressing each package using an elastic pressing means. When, along with and a step of holding the individual packages are elastically pressed against the package housing jig, the elastic pressing means, it into individual packages In the process of having a tip member and an elastic member that elastically presses the tip member, the tip of the tip member has a rounded shape and is housed in a package housing jig. The package in an inclined state among the individual packages is guided in a horizontal state .

In addition, a substrate cutting apparatus according to the present invention for solving the above technical problem includes a dicer mechanism that cuts a molded substrate to form individual packages, and a handler that conveys the molded substrates and the individual packages. And a package housing jig comprising a nest for housing individual packages and a nest cover for holding the packages by being placed on the nests and used for the dicer mechanism and the handler mechanism. a cutting apparatus, a nested cover, in correspondence with the individual packages, with elastic pushing means for housing the nest with each elastic pushing the individual package is provided, the elastic pressing means and the distal end member An elastic member that elastically presses the tip member, the tip of the tip member has a rounded shape, By guiding the horizontal state packages on inclined state of Kkeji, characterized in that they contain the nested package.

The substrate cutting apparatus according to the present invention for solving the above technical problem is characterized in that the elastic member is a spring.

According to the cutting method and cutting apparatus of substrate according to the present invention, even in a state in which the package 2 is riding on top portion of the retaining wall 26, by the elastic pressing means 41 provided in the nest cover 22, the package 2 It can be guided in a horizontal state on the shelf 29 of the nest 21. Thereby, the package 2 in the state of riding on the top surface portion of the holding wall 26 can be accommodated and securely held. Therefore, the present invention can produce the package 2 (product) efficiently and has the effect of improving the productivity of the product .

Using the substrate cutting apparatus according to the present invention, the individual packages 2 cut from the molded substrate 1 are elastically pressed by the elastic pressing means 41 provided on the nest cover 22 in the package housing jig (the nest 21 and the nest cover 22). A step of elastically pressing and accommodating the individual packages 2 in the contact state, and in addition, a package holding portion provided on the nest cover 22 with the individual packages 2 elastically pressed in the contact state by the elastic pressing means 41 And a step of holding in a non-contact state at 33 and a two-step process . Here, the elastic pressing means 41 is provided corresponding to each package 2, and has a tip member 42 and an elastic member 43 that elastically presses the tip member 42. The tip of the tip member 42 has a rounded shape. By these things, in the process of accommodating in a package accommodation jig (the nest 21 and the nest cover 22), it is possible to guide the package 2 in an inclined state among the individual packages 2 in a horizontal state. Accordingly, the individual packages 2 can be reliably accommodated and held between the package accommodation jigs (nest 21 and nest cover 22) .

  FIG. 1 is a schematic plan view schematically showing a substrate cutting apparatus according to the present invention.

  That is, in the substrate cutting apparatus shown in FIG. 1, at least a dicer mechanism 6 that cuts the molded substrate 1 (molded product) to form individual packages 2 and the individual packages 2 are conveyed from the dicer mechanism 6. A handler mechanism 7 and control mechanisms 8 and 9 for controlling the mechanisms 6 and 7 independently are provided.

With respect to the dicer mechanism 6, the substrate cutting unit 10 that cuts the molded substrate 1 transferred from the nest loading unit 14 of the handler mechanism 7, and the individual packages accommodated in the nest 21 after completion of cutting in the substrate cutting unit 10. 2, a nest cover loading unit 11 for loading the nest cover 22 is provided.
The nest cover loading unit 11 is configured to be provided at substantially the same location as the substrate fixing position 23 a in the substrate cutting unit 10.
Further, the substrate cutting unit 10 includes an appropriate carriage 24 that reciprocates within the substrate cutting unit 10 and a carriage 24 that reciprocates between the substrate fixing position 23 a and the substrate cutting position 23 b in the substrate cutting unit 10. Appropriate reciprocating means (not shown) for movement is provided and configured.

  As for the handler mechanism 7, a substrate loading unit 12 to be loaded into the apparatus main body, a substrate alignment unit 13 for aligning the molded substrate 1 transferred from the substrate loading unit 12, and the molded substrate 1 transferred from the substrate alignment unit 13. Is washed from the nest loading unit 14 for loading the nest 21 and the substrate cutting unit 10 of the dicer mechanism 6, and the individual package 2 accommodated and held in the nest 21 and the nest cover 22 is washed and dried. The drying unit 15 and the nest cover 22 to be loaded on the washed and dried package 2 from the package washing and drying unit 15 are removed, or all the washed and dried packages 2 are transferred to the package inspection unit 17 and the nest 21 is removed. Package receiving jig removing unit 16 and a package for inspecting the cleaned and dried package 2 transferred from the package receiving jig removing unit 16 Di inspection unit 17, a package accommodating portion 18 for accommodating the package inspection unit 17 the inspected packages 2 in the tray 25 of the package housing, is configured provided.

  The molded substrate 1 and the package 2, or the package housing jig (the nest 21 and the nest cover 22), the tray 25, or other appropriate jigs / members are not illustrated, but are appropriately transferred. -It is comprised by the transfer means so that it can move suitably between each mechanism and each part in an above-described cutting device.

That is, as shown in FIG. 1, in the above-described cutting apparatus, first, the molded substrate 1 is transferred from the substrate loading unit 12 to the substrate alignment unit 13 and aligned, and then the substrate loading unit 13 and the nest loading unit 14 are aligned. The molded substrate 1 aligned with the nest 21 is transferred and loaded into the nest 21. Next, the molded substrate 1 loaded in the nest 21 is transferred from the nest loading unit 14 to the substrate fixing position 23a in the substrate cutting unit 10. At the same time, the molded substrate 1 is mounted and fixed at a predetermined position of the carriage 24 at the substrate fixing position 23a, and then molded by the carriage 24 from the substrate fixing position 23a to the substrate cutting position 23b in the substrate cutting unit 10. Next, the substrate 1 is transferred, and then the molded substrate 1 mounted and fixed at a predetermined position of the carriage 24 is cut and separated into individual packages 2 at the substrate cutting position 23b. Within The individual packages 2 cut by the carriage 24 are moved from the board cutting position 23b to the board fixing position 23a, and then the nest cover 22 is moved by the nest cover loading section 11 at substantially the same place as the board fixing position 23a. It will be loaded onto individual packages 2.
Next, the individual packages 2 housed and held between the package housing jigs 21 and 22 are transferred from the nest cover loading unit 11 to the package washing / drying unit 15 to perform appropriate washing / drying means (not shown). Then, it will be washed and dried.
Next, the cleaned and dried package 2 accommodated and held between the package accommodation jigs 21 and 22 is transferred from the package washing and drying unit 15 to the package accommodation jig removing unit 16.
Next, the package housing jig removing unit 16 removes the nest cover 22, and the nest cover 22 itself moves to the nest cover loading unit 11 and returns.
Next, after the nest cover 22 is removed in the package housing jig removing section 16, almost simultaneously with the transfer of all the individual packages 2 housed in the nest 21 to the package inspection section 23 described later, , Move back to the nest loading unit 14.
Next, the individual packages 2 housed in the nest 21 after the nest cover 22 is removed are transferred from the package housing jig removing unit 16 to the package inspecting unit 17 to the package inspecting unit 17, and the individual packages 2. Are inspected by an appropriate inspection means (not shown), and the individual packages 2 are sorted into acceptable products and unacceptable products.
Further, the acceptable product package 2 is transferred from the package inspection unit 17 to the tray 25 in the package storage unit 18, and the unacceptable product package 2 is transferred and stored in an appropriate storage member (not shown).
Accordingly, the molded substrate 1 can be cut and separated into individual packages 2 (including cleaning, drying, and inspection) by the substrate cutting device.

  Here, FIGS. 2 and 3 are schematic perspective views showing the substrate cutting part 10 of the dicer mechanism 6 in the cutting apparatus shown in FIG. 1, and the molded substrate 1 and the package used in the present invention are shown in FIGS. The housing jig (nest 21 and nest cover 22) and other components used in combination with the package housing jigs 21 and 22 will be described in detail below.

  As shown in FIG. 2, the molded substrate 1 includes a substrate 3 and a resin molded body 4 in which a plurality of electronic components mounted on the substrate 3 are collectively molded with a resin material. A required cutting part (assumed cutting line 5 in the illustrated example) is set at a required portion of the molded substrate 1, and the molded substrate 1 is cut by cutting along the required cutting part. The individual packages 2 can be formed separately.

  As shown in FIGS. 2 and 3, the nest 21 includes a nest outer peripheral frame 28, a lattice-like holding wall 26 provided in the nest outer peripheral frame 28, and a package accommodating container surrounded by the holding wall 26. The space 27 is provided, and the top surface portion of the holding wall 26 and the upper surface of the nest outer peripheral frame 28 (surface on the side of the nest outer peripheral frame 28 substrate) are configured on the same plane. At the base of the holding wall 26, there is provided a shelf portion 29 that holds the individual packages 2 and holds them by the holding wall 26 so as not to move greatly in the horizontal direction. The shelf 29 is omitted in FIGS. 2 and 3, but will be described later with reference to FIGS.

  As shown in FIG. 3, the nest cover 22 is a member that covers the nest 21 and suppresses large movement of the individual packages 2, and is detachable from the nest cover outer frame 30 and the nest cover outer frame 30. A package holding member 31 that can be attached and detached and is provided at a portion corresponding to the upper side of each package 2 is provided. At the four corners of the outer frame 30 of the nest cover, there are provided nest matching portions 32 that match the outer periphery frame 28 of the nest, and the package holding member 31 is formed of lattice-shaped ribs and the top surface of the package 2 Package holding portions 33 for holding the package 2 protruding above the four corners of the (electronic component non-mounting surface) are provided. The nest cover outer frame 30 is provided so that a portion corresponding to the upper part of each package 2 penetrates completely, and the nest matching part 32 projects below the package holding part 33. Note that the package holding portion 33 protruding downward from the package holding member 31 is omitted in FIG. 3, but will be described later with reference to FIGS.

Further, as shown in FIG. 3, the package holding member 31 of the nest cover 22 is elastically pressed at the center of the top surface of the required number of packages 2 and is detachably attached to and removed from the package holding member 31. The elastic pressing means 41 is provided above at least one, and in the illustrated example, above the top surface of all the packages 2 that can pass through the package holding member 31 in the vertical direction in the drawing.
The elastic pressing means 41 elastically presses the top surface of the package 2 to guide the package 2 and accommodates the package 2 in a horizontal state, and always elastically presses the package 2 in a horizontal state, so It is comprised so that it can accommodate in the shelf part 29 in.
The elastic pressing means 41 that elastically presses the package 2 includes, for example, an appropriate resin tip member 42 that comes into contact with the package 2 so that the package 2 is not damaged, and the tip member 42 includes the package 2. And an elastic member 43 such as a spring having an appropriate elastic force for elastically supporting the spring.
Furthermore, the implementation method of this elastic press means 41 is later mentioned using FIG. 5 and FIG.

As other components used in combination with the package receiving jigs 21 and 22, as shown in FIGS. 1 to 3, the carriage 24 described above includes the molded substrate 1 loaded in the nest 21. A platform 34 for adsorbing and fixing, and a turntable 35 that rotates with the platform 34 placed thereon are provided.
Further, an appropriate cutting means such as a blade 36 (rotary cutting blade) for cutting the molded substrate 1 that is sucked and fixed to the platform 34 of the carriage 24 at the substrate cutting position 23b is provided at a predetermined position of the substrate cutting unit 10. It is provided and configured.
In addition, the suction fixing surface (substrate mounting surface) for attracting the package 2 in the platform 34 is provided with a relief groove 37 of the blade 36 corresponding to the assumed cutting line 5 of the molded substrate 1. The suction part 38 corresponding to the planar shape of the package 2 is partitioned and configured, and the suction part 38 is configured with a suction hole 40 provided with a package suction pad 39 (concave part).
As shown in FIGS. 2 and 3, the turntable 35 and the reciprocating part main body 24 have an appropriate vacuum path (not shown) such as a vacuum pipe communicating with an appropriate vacuuming mechanism (not shown). It is provided and configured.
As shown in FIGS. 2 and 3, the outer peripheral portion of the accommodation space 27 of the nest 21 is not formed as the package 2 and is also cut and discarded as the outer peripheral portion of the molded substrate 1. The opening portion 44 and the platform 34 are provided with a fixing portion 45 that does not form the pad 39 (suction hole 40) on the outer peripheral portion of the suction portion 38 corresponding to the opening portion 44. Similar to the suction portion 38 and the accommodation space portion 27, the outer peripheral portion of the molded substrate 1 can be mounted and fixed by the combination of 44 and the fixing portion 45.
In other words, the vacuum suction mechanism is operated so that air can be forcibly sucked and discharged from the suction fixing surface (pad 39 side) of the platform 34 through the vacuum path 26 from the suction hole 40 (pad 39). ing.
Accordingly, as described above, the molded substrate 1 or individual packages 2 can be fixed to the suction portion 38 of the platform 34 by suction, and the molded substrate 1 or individual can be fixed to the suction portion 38 of the platform 34. The reciprocating part 24 is configured to be able to reciprocate between the substrate fixing position 23a and the substrate cutting position 23b in a state in which the package 2 is attracted and fixed. It is comprised so that it can cut | disconnect in the state which 1 fixed by adsorption.
At this time, the lower end position of the blade 36 is located in the escape groove 37 beyond the lower surface of the molded substrate 1 in the downward direction, so that the molded substrate 1 can be fully diced. .

Further, the package housing jig (nest 21 / nest cover 22), in particular, the elastic pressing means 41 provided on the nest cover 22 will be described in detail below with reference to FIGS.
4 shows a step of cutting the molded substrate 1 into individual packages 2 in the substrate cutting unit 10 (substrate cutting position 23a, substrate fixing position 23b, nest cover loading unit 11) of the dicer mechanism 6. FIG. FIG. 3 shows an enlarged partial cross-sectional view of the cutting apparatus corresponding to FIGS. 1 to 3 described above, and the process of loading the nest cover 22 into each cut package 2.
Further, in the package accommodation jig removing portion 16 of the handler mechanism 7, FIG. 6 shows the nest cover from the package 2 accommodated and held between the package accommodation jigs 21 and 22 constituted by the nest 21 and the nest cover 22. The process of removing 22 is shown in the enlarged partial sectional view of the cutting device corresponding to the above-described FIGS.

That is, as shown in FIG. 4A, first, the resin molding 4 side is placed on the top surface portion of the holding wall 26 in the nest 21 from the nest loading portion 14 of the handler mechanism 7 to the substrate fixing position 23a of the dicer mechanism 6. The nest 21 loaded with the molded substrate 1 facing downward moves. Next, the nest 21 loaded with the molded substrate 1 moves downward above a predetermined position of the suction portion 38 of the platform 34 placed on the turntable 35 on the carriage 35.
At this time, in order to load the molded substrate 1 into the nest 21, for example, an appropriate positioning means (not shown) is provided on the top surface portion of the nest outer peripheral frame 28 of the nest 21. You may implement by the structure which can be loaded in the nest 21 reliably. Alternatively, the molded substrate 1 may be loaded on the top surface portion of the nest 21 with the resin molded body 4 side facing upward.

Next, as shown in FIG. 4B, the nest 21 loaded with the molded substrate 1 is moved downward so that the upper surface of the turntable 35 and the lower surface of the nest outer peripheral frame 28 come into contact with each other. 21, the suction portion 38 and the fixing portion 45 of the platform 34 are fitted into the accommodation space portion 27 and the opening portion 44, and the top surface portion of the adsorption portion 38 and the fixing portion 45 is connected to the accommodation space portion 27 and the opening portion 44. The nest holding wall 26 protrudes upward from the top surface portion, and is placed and fitted in the escape groove 37 of the platform 34.
As a result, the molded substrate 1 is mounted and fixed on the top surface portion of the fixing portion 45 of the platform 34 protruding from the top surface portion of the nest 21, and at the same time, the molded substrate 1 is packaged on the top surface portion of the adsorption portion 38 of the platform 34. 2 is cut and separated along the virtual cutting line 5 in the molded substrate 1 by the blade 36 in a state of being adsorbed and fixed through the pad 39 (suction hole 40), and the lower position of the blade 36 is the clearance groove 37 of the blade 36. The molded substrate 1 is cut so as not to collide with the top surface portion of the holding wall 26 fitted in the escape groove 37.
At this time, in order to cut the molded substrate 1 with the blade 36, a plurality of blades 36 may be used instead of a single blade 36. Further, the cutting sequence for cutting the molded substrate 1 by an appropriate cutting means such as the blade 36 is not limited to the illustrated example, and the cutting is performed from the portion that is the outer peripheral portion of the molded substrate that is not attracted and fixed. May be.
Further, in the required portion for fixing and supporting the suction portion 38 of the platform 34 in the state shown in FIG. 4B, it is completely covered with the nest 21, but the nest 21 itself is placed on the platform 34. You may carry out in a state.
In the package portion to be cut and discarded, the fixing portion 45 of the platform 34 is also provided with a pad 39 (suction hole 40) that is a component of the suction portion 38, or the opening portion of the nest 21 is provided. 44 or the fixing part 45 of the platform 34 may be omitted.

Next, as shown in FIG. 5A, the top surface of the suction portion 38 of the platform 34 is moved from the substrate cutting position 23b in the substrate cutting portion 10 of the dicer mechanism 6 to the nest cover loading portion 11 which is the substrate fixing position 23a. The package 2 sucked and fixed by the portion moves and returns by the carriage 24 and is elastically pressed by the elastic pressing means 41 of the nest cover 22 at an upper position in the substantially central portion of the top surface of the package 2 sucked and fixed by the suction portion 38. In the state where the tip member 42 is directed downward.
At this time, an appropriate elastic member 43 including a spring or the like of the elastic pressing means 41 elastically supports the tip member 42 in a state where the tip member 42 is located at the lowest position, and the nest cover 22 in this state is used for the top surface of the package 2. On the other hand, the first is the lower surface of the nest mating portion 32 of the outer frame 30 of the nest cover, the second is the tip member 42 of the elastic pressing means 41, and the third is the lower surface of the package holding portion 33 of the package holding member 31. It will wait in the state which protruded below in order.

Next, as shown in FIG. 5B, in the nest cover loading unit 11 at the substrate fixing position 23 a in the substrate cutting unit 10 of the dicer mechanism 6, the pad 39 (suction hole 40) in the suction unit 38 of the platform 34. The nest 21 is moved upward almost simultaneously (or after the suction is released) when the individual packages 2 that have been sucked and fixed via the suction are released.
Next, when the nest 21 is further moved upward and the shelf portion 29 of the nest 21 is moved upward to the same position as the top surface portion of the suction portion 38, the individual packages 2 are stored in the respective accommodation space portions 27 of the nest 21. In this case, the rack 29 is once locked (accommodated).
Further, the nest 21 moves upward, and the tip member 42 of the elastic pressing means 41 provided on the nest cover 22 (package holding member 31) comes into contact with the package 2 once locked to the shelf 29.
At this time, the top surface of the nest outer peripheral frame 28 of the nest 21 and the bottom surface of the nest mating portion 32 of the nest cover 22 are separated from each other, and in this state, the nest 21 and the nest cover 22 can be surely matched. In order to be able to do so, for example, it protrudes downward from the lower surface of the nest mating portion 32, or protrudes upward from the top surface of the nest outer peripheral frame 28, and protrudes to one side of the package receiving jigs 21 and 22. An appropriate positioning member (not shown) such as a positioning pin is provided, and an appropriate positioning space (not shown) such as a positioning hole for loose insertion corresponding to this positioning member is provided on the other side as appropriate. Therefore, the nest 21 and the nest cover 22 may be surely matched with each other.

Next, as shown in FIG. 6A, in the nest cover loading unit 11 at the substrate fixing position 23a in the substrate cutting unit 10 of the dicer mechanism 6, the shelf 29 in the state of FIG. The nest 21 containing the locked package 2 is further moved upward, so that the nest outer peripheral frame 28 and the nest matching portion 32 are completely abutted and matched.
In this way, the package 2 in an inclined state should be horizontal by taking advantage of the rounded shape of the distal end portion of the distal end member 42 so that each package 2 is in a horizontal state on the shelf 29 of the accommodating space portion 27 in the nest 21. Guide and hold the condition. Then, with all the packages 2 being elastically pressed by the elastic pressing means 41, the package holding portions 33 of the nest cover 22 are further spaced apart from each other by a predetermined gap above the four corners of the package 2. The package 2 is securely held in a state in which it does not move greatly from the shelf 29 of the accommodation space 27 in the vertical direction in the figure.
At this time, the appropriate elastic member 43 including the spring of the elastic pressing means 41 in a state in which the nest 21 and the nest cover 22 are completely matched moves the tip member 42 upward and the spring or the like is contracted. It will be elastically supported.
Therefore, the elastic pressing means 41 provided on the nest cover 22 of the package housing jig (the nest 21 and the nest cover 22), each package 2 cut from the molded substrate 1 using the substrate cutting device according to the present invention. In the step of elastically pressing and accommodating the individual packages 2 in the contact state, in addition, the individual packages 2 elastically pressed and accommodated in the contact state by the elastic pressing means 41 are stored in the package holding portion 33. In this way, the individual packages 2 can be securely received and held between the package receiving jigs 21 and 22, that is, FIG. This is the state shown in (A).

Next, in the state of FIG. 6A, the package 2 is received and held from the nest cover loading unit 11 which is the substrate fixing position 23a in the substrate cutting unit 10 of the dicer mechanism 6 to the package cleaning / drying unit 15. The package receiving jigs 21 and 22 thus moved (see FIG. 1).
Next, in the state of FIG. 6 (A), the washed and dried package 2 is washed and dried by the package washing / drying unit 15, and then in this state, the package receiving jig removing unit 16 receives the package. The process of removing the nest cover 22 is performed by moving the package receiving jigs 21 and 22 that hold and hold 2.

That is, as shown in FIG. 6B, the package housing jigs 21 and 22 moved in the state shown in FIG. 6A in the package housing jig removing unit 16 do not move the nest cover 22. Further, the nest 21 is moved downward in a state where the package 2 is accommodated in the shelf 29 in the accommodation space 27 of the nest 21. Then, the same state as in FIG. 5B described above is obtained, and the nest matching portion 32 and the nest outer peripheral frame 28 are separated from each other while the packages 2 remain in contact with the elastic pressing means 41.
At this time, an appropriate elastic member 43 including a spring or the like of the elastic pressing means 41 is elastically supported with the tip member 41 positioned at the lowest position.

Next, as shown in FIG. 6C, the tip member 42 of the elastic pressing means 41 that has been in contact with each package 2 is separated from the top surface portion of the package 2, and the package 2 accommodates the nest 21. While the nest cover 22 itself is in a state of being horizontally accommodated in the shelf portion 29 which is the space portion 27, the nest cover 22 itself is the substrate fixing position in the substrate cutting portion 10 of the dicer mechanism 6 as described with reference to FIG. And move to the nest cover loading section 11 at substantially the same location.
At this time, similarly to the state shown in FIG. 5A described above, the nest cover 22 is first with respect to the top surface of the package 2, firstly on the lower surface of the nest mating portion 32 of the nest cover outer frame 30, and secondly. Returning to the state of projecting downward in the order of the tip member 42 of the elastic pressing means 41, and thirdly, the lower surface of the package holding portion 33 of the package holding member 31, will wait.

That is, even if the nest cover 22 is loaded on the package 2 on the top surface portion of the holding wall 26, the elastic pressing means 41 provided on the nest cover 22 causes the shelf of the nest 21 to be loaded. Since it can guide to the part 29 in a horizontal state, the package 2 can be reliably accommodated and held.
Further, a large number of electronic components are molded at once, for example, individual packages 2 obtained by cutting and separating the substrate 3 on which the electronic components are mounted at a narrow pitch interval are predetermined on the top surface of the suction portion 38 of the platform 34. Even if the package 2 is adsorbed in a state shifted from the position, or a large amount of the package 2 rides on the top surface portion of the holding wall 26 in the accommodation space 27 of the nest 21, as described above, Since the elastic pressing means 41 can guide the package 2 in a horizontal state, it can be reliably accommodated and held.
Accordingly, the package 2 is pressed and sandwiched by the package housing jigs 21 and 22 while the package 2 is inclined between the top surface of the holding wall 26 that is the housing space 27 of the nest 21 and the nest cover 22. The problem is efficiently prevented and the package 2 is not subjected to extreme stress or damage, or the package 2 is not scattered from the package receiving jigs 21 and 22. The package 2 can be reliably accommodated and held in 27.
Further, instead of pressing the inclined package only by the weight of the nest cover 22 and the package holding part 32, the elastic pressing means 41 firstly puts the package 2 into the holding wall 26 which is the accommodation space part 27 of the nest 21. Since the nest 21 and the nest cover 22 can be smoothly aligned with each other while being guided from the inclined state to the horizontal state, the entire cutting device is stopped each time, and the operator holds the package 2 in a horizontal state. Thus, it is possible to efficiently prevent a conventional and time-consuming operation of accommodating the nest 21 and the nest cover 22 so as to be accommodated in the nest 21.

Further, as shown in FIG. 1, corresponding to various types of molded substrates 1 to be cut, the control mechanism 9 of the handler mechanism 7 sets the type information of the currently manufactured molded substrates 1. Thus, the product type information is automatically provided to the control mechanism 8 of the dicer mechanism 6 to exchange the product information between the control mechanisms 8 and 9 (indicated by broken arrows in the upward direction in FIG. 1). It is configured so that it can be automatically controlled (indicated by a broken-line double-pointed arrow in FIG. 1).
In addition, you may implement by the structure which sets the kind information of each control mechanism in the dicer mechanism 6 side, and provides to the handler mechanism 7 side.
Accordingly, since the entire cutting apparatus can be controlled simply by setting the type information in the control mechanism 9 of the handler mechanism 7 corresponding to various types of molded substrates 1, human error by the operator is efficient. It can be well prevented. Furthermore, even when different product information is set in each control mechanism 8 and 9 in each mechanism 6 and 7, since each mechanism 6 and 7 does not operate independently, It is possible to prevent damage to each mechanism, each part, etc., and to efficiently prevent defects in the molded substrate 1 and the package 2. Even in the product exchange operation, a significant time reduction can be realized.

  That is, the above-described cutting apparatus 21 and 22 and the substrate cutting apparatus provided with the independent dicer mechanism 6 and the handler mechanism 7 can be used for multi-product small-volume production, and the above-described cutting apparatus. The package 2 (product) can be efficiently produced without significantly reducing the overall operation status, and the productivity of the product can be improved.

As another embodiment, the elastic pressing means 41 provided on the nest cover 22 in the package housing jig corresponds to various molded substrates 1 (or packages 2) without being provided on all the packages 2. Thus, the required elastic pressing means 41 may be provided only at an appropriate predetermined location. The package holding member 31 of the nest cover 22 includes only the package holding portion 33, only the elastic pressing means 41, or a combination of the package holding portion 33 and the elastic pressing means 41 as in the present embodiment. May be selected according to various molded substrates 1 (or packages 2) and appropriately provided.

  In another embodiment, the nest cover 22 as shown in FIGS. 5 and 6 is not moved, and only the nest 21 is moved up and down to match the nest 21 and the nest cover 22, or The process of removing the nest cover 22 from the nest 21 has been described. For example, in the state shown in FIG. 5A, the nest cover 22 is first moved downward to move the tip member 42 of the elastic pressing means 41. The nest 22 below the package 2 may be moved upward in a state in which the nest 21 is in contact with the nest 21 and the nest cover 22. In other words, both the nest 21 and the nest cover 22 may be moved up and down appropriately.

  Further, as other embodiments, a substrate cutting apparatus as shown in FIG. 1 (each mechanism, each part, each member, each means, etc. provided in this apparatus) and various molded substrates 1 ( Without being limited to the layout and implementation method of the package 2), it can be selected and implemented as appropriate. Further, the configuration may be such that the dicer mechanism 6 and the handler mechanism 7 in the substrate cutting apparatus are connected to each other via an appropriate conveying means (not shown) in a completely separated state.

  Further, as another embodiment, the resin molded body 4 portion of the molded substrate 1 is described as one object, but the molded substrate 1 formed by molding a plurality of resin molded bodies 4 is adopted. May be. Further, the shape of the substrate 3 itself is not a quadrangle, but may be adopted for a substrate having an appropriate shape such as a circle or a polygon. Furthermore, in the present embodiment, the description is made on the molded substrate 1 in which the semiconductor chip (electronic component) and the wire are mounted on the substrate 3, but the other molded substrate 1 includes, for example, bumps. It can also be used for flip-chip substrates or wafer level packages.

  For example, a molded product that is housed and held in package housing jigs 21 and 22 constituted by a nest 21 used in the substrate cutting apparatus according to the present invention and a nest cover 22 provided with elastic pressing means 41 is, for example, It becomes possible to carry out with a wafer substrate. In other words, the present invention can be applied to other cutting devices that are formed as products by cutting and separating a molded product having a planar shape.

It is a schematic plan view which shows the cutting device of a board | substrate. It is a schematic perspective view which shows the board | substrate and apparatus principal part in the apparatus of FIG. It is a schematic perspective view which shows the package and apparatus principal part in the apparatus of FIG. It is an expanded sectional view which shows the board | substrate cutting method in the apparatus of FIG. It is an expanded sectional view which shows the package accommodation method in the apparatus of FIG. It is an expanded sectional view which shows the package accommodation jig | tool removal method in the apparatus of FIG.

DESCRIPTION OF SYMBOLS 1 Molded board | substrate 2 Package 3 Board | substrate 4 Resin molding 5 Assumed cutting line 6 Dicer mechanism 7 Handler mechanism 8. 9 Control mechanism 10 Board | substrate cutting part 11 Nest cover loading part 12 Substrate loading part 13 Substrate aligning part 14 Nest loading part 15 Package Cleaning and drying unit 16 Package receiving jig removing unit 17 Package inspection unit 18 Package receiving unit 21 Nest 22 Nest cover 23a Substrate fixing position 23b Substrate cutting position 24 Carriage table 25 Tray 26 Holding wall 27 Storage space 28 Nest outer peripheral frame 29 Shelf 30 Nest cover outer frame 31 Package holding member 32 Nest mating part 33 Package holding part 34 Platform 35 Turntable 36 Blade 37 Escape groove 38 Adsorbing part 39 Pad 40 Suction hole 41 Elastic pressing means 42 Tip member 43 Elastic member 44 Open Part 45 fixed portion

Claims (3)

Forming individual packages by cutting the molded pre substrate at dicer mechanism provided in the cutting device for the substrate, a step of conveying the molded pre substrate and individual packages at the handler mechanism provided in the cutting device with implementing, by using the nesting cover for holding the package is placed on the nest and the nest for accommodating the individual packages comprising a package accommodating jig provided in the cutting device, wherein the step A method of cutting a substrate,
A step of accommodating into the package housing jig by each elastic pushing the individual package using the elastic pressing means,
Together and a step of holding the individual packages above is elastically pressed against the package receiving jig,
The elastic pressing means is provided corresponding to each of the individual packages, and has a tip member and an elastic member that elastically presses the tip member,
The tip of the tip member has a rounded shape,
In the step of accommodating in the package accommodating jig, a package in an inclined state among the individual packages is guided in a horizontal state . Accommodating a dicer mechanism to form individual packages by cutting the molded pre substrate, a handler mechanism for transporting the molding pre substrate and individual packages, used with the dicer mechanism and handler mechanism, the individual packages A substrate cutting device comprising: a nest and a nest cover that is placed on the nest and holds a package;
The nest cover is provided with elastic pressing means for elastically pressing the individual packages to accommodate the individual packages, respectively, corresponding to the individual packages .
The elastic pressing means has a tip member and an elastic member that elastically presses the tip member,
The tip of the tip member has a rounded shape,
The substrate cutting apparatus according to claim 1, wherein the elastic pressing means guides a package in an inclined state among the individual packages to a horizontal state, thereby accommodating the package in the nest . The substrate cutting device according to claim 2,
The substrate cutting apparatus according to claim 1, wherein the elastic member comprises a spring.

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