JP5613585B2 - Method for dividing light emitting device package substrate and supporting jig - Google Patents

Description

  The present invention relates to a method of dividing a light emitting device package substrate on which a plurality of light emitting devices and dome-shaped lenses are formed into individual light emitting devices on which dome-shaped lenses are formed, and to support the light emitting device package substrate in carrying out the method. To support jigs.

  A light emitting device such as an LED irradiates a laser beam along a planned division line after laminating an n-type semiconductor layer and a p-type semiconductor layer in a region defined by the planned division line on the surface of a sapphire substrate, a SiC substrate, or the like. It is formed by dividing.

  Thereafter, the light-emitting element is partitioned and mounted on the surface of a substrate such as alumina ceramics by a division line, and becomes a light-emitting element package substrate in which a dome-shaped lens made of a resin such as silicone protrudes from the light-emitting surface. .

  And this light emitting element package substrate is divided into individual light emitting elements having a dome-shaped lens by cutting the line to be divided by a cutting blade, and various kinds of lighting equipment, backlights of liquid crystal televisions, mobile phones, etc. It is used for equipment (see, for example, Patent Document 1).

JP 2006-106479 A

  However, if the cutting line of the light emitting device package substrate is cut using the cutting blade, the cutting dust adheres to the dome-shaped lens and becomes dirty, and the lens is damaged, resulting in a decrease in luminance as a light emitting device. .

  The light emitting element package substrate including the dome-shaped lens has a relatively large total thickness because the lens is formed in a dome shape. For example, even if the plate thickness is about 0.4 mm, the lens thickness is about 1.4 mm, and the total thickness reaches 1.8 mm. Therefore, in this case, the amount of leading edge of the cutting blade for cutting the light emitting element package substrate is required to be 2.0 mm or more. In order to set the blade tip length to 2.0 mm or more, it is necessary to make the blade thickness 0.2 mm or more. In order to enable cutting with such a cutting blade, the division line of the light emitting element package substrate is required. There is also a problem that the number of light emitting elements formed on the substrate is limited.

  The present invention has been considered in view of such problems. In dividing the light emitting element package substrate in which the dome-shaped lens is formed on the light emitting element into the individual light emitting elements in which the dome-shaped lens is formed, It is possible to cut the planned dividing line of the light emitting device package substrate without contaminating the dome-shaped lens or scratching the lens, and to further narrow the width of the planned dividing line. And

  According to a first aspect of the present invention, a light-emitting element package substrate having a surface on which light-emitting elements are formed in a plurality of regions partitioned by division-scheduled lines and a dome-shaped lens is formed on each light-emitting element is provided as a dome-shaped lens. The present invention relates to a method of dividing a light emitting device package substrate that divides the light emitting device package substrate into individual light emitting devices, a jig body, a support region that is formed on the surface of the jig body and supports the light emitting device package substrate, and a light emitting device package in the support region A cutting blade entry groove that is formed at a position corresponding to the division line of the substrate and into which the cutting blade of the cutting blade enters, a lens housing portion that houses a dome-shaped lens in a region defined by the cutting blade entry groove, and a lens housing Preparing a support jig composed of a through hole extending from the center to the back of the jig body, and a lens housing part of the support jig A mounting step in which the surface of the light emitting device package substrate is positioned and placed on the support region so as to accommodate the lens, and a dome is formed by cutting a cutting blade from the back surface of the light emitting device package substrate along the planned dividing line And a dividing step of dividing the light emitting element into individual light emitting elements provided with a lens-like shape. In this method of dividing the light emitting device package substrate, the edge of the cutting blade entrance groove is exposed from the light emitting device package substrate in a state where the light emitting device package substrate is placed on the support region. Cutting can be started by positioning the cutting blade of the cutting blade in the blade entry groove.

  According to a second aspect of the present invention, a light-emitting element package substrate having a surface in which light-emitting elements are formed in a plurality of regions partitioned by division-scheduled lines and a dome-shaped lens is formed on each light-emitting element is provided as individual dome-shaped substrates. The present invention relates to a support jig used to divide the light emitting element formed with the lens, a jig body, a support area formed on the surface of the jig body and supporting the light emitting element package board, and the light emitting element package board in the support area. A cutting blade entry groove formed at a position corresponding to the planned dividing line and into which the cutting blade of the cutting blade enters, a lens housing portion for housing a dome-shaped lens in an area defined by the cutting blade entry groove, and a lens housing portion It consists of a through hole that reaches the back of the jig body. In the state where the light emitting element package substrate is placed on the jig body, the end of the cutting blade entering groove is exposed from the light emitting element package substrate.

  In the present invention, the front surface of the light emitting device package substrate is supported using a support jig provided with a lens housing portion for housing the lens on the dome formed so as to protrude from the light emitting device package substrate, and the line to be divided is cut from the back surface by the cutting blade. In order to divide the light-emitting elements into individual light-emitting elements having a dome-shaped lens, cutting dust does not adhere to the dome-shaped lens or damage to the light-emitting elements is prevented. be able to.

  In addition, even when the light emitting element package substrate is placed on the support area of the support jig, the edge of the cutting blade entry groove is exposed on the outer peripheral side of the light emitting element package substrate. Even if the division line on the front surface cannot be detected, the cutting blade is positioned at the end of the cutting blade entry groove and cutting is performed, so that the division line is reliably cut from the back side of the light emitting device package substrate, and individual light emission is performed. It can be divided into elements.

  Furthermore, the dome-shaped lens formed on the surface of the light-emitting element package substrate is accommodated in the support jig, and cutting is performed with the back surface of the light-emitting element package substrate exposed, so that the influence of the thickness of the dome-shaped lens is reduced. Since cutting can be performed without receiving, the cutting edge of the cutting blade of the cutting blade can be made smaller than when cutting is performed with the surface of the light emitting element package substrate exposed. Therefore, the thickness of the cutting blade can be reduced, and the number of light emitting elements per light emitting element package substrate can be increased.

It is a disassembled perspective view which shows a support jig and a light emitting element package board | substrate. It is the sectional view on the AA line of FIG. It is a perspective view which shows an example of a cutting device. It is a disassembled perspective view which shows the structure of the principal part of a cutting means. It is sectional drawing which shows schematically the structure of the principal part of a cutting means. It is a disassembled perspective view which shows the state which mounts a light emitting element package board | substrate on a holding table via a support jig. It is a perspective view which shows the state which cuts a light emitting element package board | substrate. It is sectional drawing which shows schematically the state which cuts a light emitting element package board | substrate.

(1) Preparation Step First, a support jig 1 shown in FIG. 1 is prepared. The support jig 1 is a jig used when the light emitting element package substrate 2 is cut and divided into individual light emitting elements, and the jig main body 3 formed in a flat plate shape and the surface 30 of the jig main body 3 are used to emit light. And a support region 4 for supporting the element package substrate 2. A plurality of positioning holes 32 penetrating from the front surface 30 to the back surface 31 are formed in the jig body 3.

On the surface 2 a of the light emitting element package substrate 2, a plurality of light emitting elements 21 are respectively formed in a plurality of regions partitioned by division lines 20 formed in the vertical direction and the horizontal direction.
A typical example of the light emitting element 21 is an LED, but is not limited thereto. A dome-shaped lens 22 made of a resin such as silicone is formed on the top of each light emitting element 21. On the other hand, the back surface 2b is formed in a planar shape.

  As shown in FIGS. 1 and 2, the surface 4a of the support region 4 is located at a position corresponding to the planned division line 20, that is, a position directly below the planned division line 20 in a state where the light emitting element package substrate 2 is supported. A cutting blade entry groove 40 that is a groove for allowing the cutting blade of the cutting blade to enter is formed. The support region 4 is formed in a rectangular shape similarly to the light emitting element package substrate 2, but is formed larger than the light emitting element package substrate 2, and the individual cutting blade entry grooves 40 are also formed from the individual division planned lines 20. Is also formed long.

  In the support region 4, a lens housing portion 41 that houses the dome-shaped lens 22 shown in FIG. 1 is formed in each region partitioned by the cutting blade entry groove 40. As shown in FIG. 2, the lens housing portion 41 is formed in a concave shape complementary to the convex dome shape of the lens 22.

  A through hole 42 reaching the back surface 31 of the jig body 3 is formed at the bottom of the lens housing portion 41. One through hole 42 is formed for each lens housing portion 41.

  The support jig 1 shown in FIG.1 and FIG.2 is mounted and used for the cutting apparatus 5 shown, for example in FIG. The cutting device 5 is a device that cuts a workpiece held on a holding table 6 by a cutting means 7, and the holding table 6 is a light emitting element package substrate via a support jig 1 shown in FIGS. 1 and 2. 2 can be held.

  The holding table 6 is configured to be fed in the X-axis direction by the cutting feed means 8. The cutting feed means 8 includes a ball screw 80 having an axis in the X-axis direction, a pair of guide rails 81 arranged in parallel with the ball screw 80, a motor 82 connected to one end of the ball screw 80, and an internal not shown. The nut is screwed into the ball screw 80, and the lower portion is formed of a slide portion 83 that is in sliding contact with the guide rail 81. The slide portion 83 moves on the guide rail 81 as the ball screw 80 is rotated by being driven by the motor 82. The holding table 6 is configured to slide in the X axis direction by sliding in the X axis direction.

  The cutting means 7 includes a spindle 70 extending in the Y-axis direction, a housing 71 that rotatably supports the spindle 70, a motor 72 that rotates the spindle 70, and a cutting blade 73 attached to the tip of the spindle 70. ing. The housing 71 is provided with an alignment unit 74 that picks up an image of the position to be cut of the workpiece by the image pickup unit 740.

  The cutting means 7 is supported by the index feeding means 9 so as to be movable in the Y-axis direction. The index feeding means 9 includes a ball screw 90 having an axis in the Y-axis direction, a pair of guide rails 91 arranged in parallel to the ball screw 90, a motor 92 connected to one end of the ball screw 90, and an internal not shown. The nut is screwed into the ball screw 90, and the lower part is constituted by a base 93 which is in sliding contact with the guide rail 91. The index feeding means 9 is driven by a motor 92 and the ball screw 90 is rotated, so that the base 93 slides on the guide rail 91 in the Y-axis direction and moves the cutting means 7 in the Y-axis direction. It has a configuration.

  The cutting means 7 is supported by the cutting feed means 10 so as to be movable in the Z-axis direction. The cutting feed means 10 includes a ball screw 100 having an axis in the Z-axis direction, a pair of guide rails 101 arranged in parallel to the ball screw 100, a motor 102 connected to one end of the ball screw 100, and an internal not shown. A nut is screwed into the ball screw 100, and a side portion is constituted by a support portion 103 that is in sliding contact with the guide rail 101. The cutting feed means 10 is driven by the motor 102 and as the ball screw 100 rotates, the support portion 103 is guided by the guide rail 101 and slides in the Z-axis direction to move the cutting means 7 in the Z-axis direction. It is configured to move.

  As shown in FIG. 4, a mount 75 is attached to the spindle 70. The mount 75 includes a flange portion 750 that protrudes in the radial direction and a shaft portion 751 that protrudes in the rotational axis direction. The shaft portion 751 has a male screw portion 751a.

  The cutting blade 73 includes a ring-shaped base 730 having a through-hole 730a formed in the center, and a cutting blade that is fixed to the outer periphery of the base 730 by electrodeposition or the like and slightly protrudes radially outward from the base 730 731. The thickness of the cutting blade 731 is usually about several tens of μm.

  As shown in FIG. 5, the protruding amount of the cutting blade 731 protruding from the base 730 to the outer peripheral side in the radial direction is represented by a blade tip protruding amount D. In FIG. 5, the blade tip protrusion amount D is exaggerated in order to give priority to easy understanding.

  When the cutting blade 73 is attached to the spindle 70, as shown in FIG. 5, the through hole 730a is inserted into the shaft portion 751 of the mount 75 from the cutting blade 731 side, and the cutting blade 731 side is connected to the end surface 750a of the flange portion 750. Press against. Then, the cutting blade 73 is fixed to the mount 75 by screwing and fastening the nut 76 to the male screw portion 751a.

  Although not shown, instead of the cutting blade 73 shown in FIGS. 4 and 5, a cutting blade made of only a cutting blade and not having a base can be used. In this case, the cutting blade is mounted on the spindle 70 by being sandwiched between two flanges. Also in this case, the cutting blade slightly protrudes on the outer peripheral side of the flange.

(2) Placement Step As shown in FIG. 6, the light emitting element package substrate 2 is positioned so that the dome-shaped lens 22 is turned over so that the dome-shaped lens 22 faces downward, and the dome-shaped lens 22 is accommodated in the lens accommodating portion 41. To be placed on the support area 4. In this state, the back surface 2b is exposed.

  A plurality of positioning projections 61 projecting upward are formed on the surface 60 of the holding table 6, and the positioning holes 32 formed in the jig body 3 of the support jig 1 are inserted into the positioning projections 61 on the holding table 6. The support jig 1 is fixed to the holding table 6 by placing the support jig 1.

  A recess 62 is formed at the center of the surface 60 of the holding table 6, and a suction hole 63 communicating with a suction source (not shown) provided in the cutting device 5 is formed at the bottom 620. When the support jig 1 is placed on the holding table 6 and a suction force is applied to the suction hole 63, the support jig 1 is sucked and held by the suction force acting on the recess 62. Further, since the suction force acting on the concave portion 62 also acts on the lens housing portion 41 via the through hole 42 shown in FIG. 2, the light emitting element package substrate 2 is also sucked and held by the suction force acting on the lens housing portion 41. The

(3) Dividing Step When the light emitting element package substrate 2 is held on the holding table 6 via the support jig 1 in this way, the planned dividing line 20 formed on the surface 2a of the light emitting element package substrate 2 becomes the support region. It will be in a hidden state facing 4. If the light emitting device package substrate 2 is placed on the support region 4 with the front surface 2a facing upward, the planned dividing line 20 is imaged by the imaging 740 shown in FIG. Although the planned dividing line 20 is detected by image processing such as pattern matching by the alignment means 74, the planned dividing line 20 cannot be detected when the back surface 2b of the light emitting element package substrate 2 is exposed upward.

  However, since the support region 4 is formed larger than the light emitting element package substrate 2, and the individual cutting blade entry grooves 40 are also formed longer than the individual division lines 20, the light emitting element package substrate 2 is attached to the support region. Even in the state of being placed and held on 4, the end of the cutting blade entry groove 40 is exposed to the outside of the light emitting device package substrate 2 as shown in FIG. Further, the cutting blade entry groove 40 is formed corresponding to the planned division line 20, and the cutting blade entry groove 40 is located immediately below the planned division line 20. Therefore, the imaging unit 740 shown in FIG. 1 images the cutting blade entry groove 40, and the alignment means 74 detects the cutting blade entry groove 40 by image processing such as pattern matching, thereby indirectly dividing the line. 20 can be detected.

  When the division line 20 is thus detected, the cutting blade 73 is positioned on the extension of the division line 20 in the X-axis direction. Then, the cutting means 7 descends while the cutting blade 73 rotates at a high speed, and the holding table 6 moves in the X-axis direction, thereby dividing the cutting blade 731 of the cutting blade 73 from the back surface 2b side of the light emitting element package substrate 2. Cutting is started by cutting along the planned line 20, and the cutting groove 23 is formed.

  When one division line 20 is cut in this way, the cutting blade 73 is indexed and fed in the Y-axis direction, and the division lines 20 are cut one after another. Further, when all the planned dividing lines 20 in the same direction are cut, by rotating the holding table 6 by 90 degrees and then performing the same cutting, all the planned dividing lines 20 are cut vertically and horizontally, and the cutting grooves 23 are formed. Once formed, it is divided into individual light emitting device devices with formed lenses 22 on the dome.

  When cutting the planned dividing line 20, as shown in FIG. 8, the cutting blade 731 of the cutting blade 73 is cut so as to be accommodated in the cutting blade entry groove 40. Since the lens 22 is accommodated in the lens accommodating portion 41 by placing the back surface of the light emitting element package substrate 2 facing upward, the lens 22 is accommodated in the lens accommodating portion 41, so that cutting is not affected by the thickness of the lens 22. Can do. In other words, if the cutting blade 731 of the cutting blade 73 is cut by the thickness of the light emitting element package substrate 2, the planned dividing line 20 can be cut regardless of the thickness of the lens 22, so that the lens 22 is turned up. The cutting edge amount D of the cutting blade 731 from the base 730 shown in FIG. Specifically, the cutting edge amount D of the cutting blade 731 can be set to about 0.5 mm. And the thickness of the cutting blade 731 can be made thin with 0.1 mm because the cutting edge amount D of the cutting blade 731 shall be about 0.5 mm. Therefore, since the division line 20 of the light emitting element package substrate 2 can be formed with a narrow width and cut, the number of light emitting elements per light emitting element package substrate can be increased.

1: Support jig 2: Light-emitting element package substrate 2a: Front surface 20: Divided line 21: Light-emitting element 22: Dome-shaped lens 2b: Back surface 3: Jig body 30: Front surface 31: Back surface 32: Positioning hole 4: Support region 4a : Surface 40: Cutting blade entry groove 41: Lens housing portion 42: Through hole 5: Cutting device 6: Holding table 60: Surface 61: Positioning protrusion 62: Recess 63: Suction hole 7: Cutting means 70: Spindle 71: Housing 72 : Motor 73: Cutting blade 730: Base 731: Cutting blade 74: Alignment means 740: Imaging part 75: Mount 750: Flange part 751: Shaft part 751 a: Male screw part 8: Cutting feed means 80: Ball screw 81: Guide rail 82 : Motor 83: Slide part 9: Indexing feeding means 90: Ball screw 91: Guide rail 92: Motor 93: Base 10: Ball screw 100: Ball screw 101: Guide rail 102: Motor 103: Support part

Claims (2)

A light emitting element package substrate having a surface in which a light emitting element is formed in a plurality of regions partitioned by the planned dividing lines and a dome shaped lens is formed on each light emitting element is formed on each light emitting element package substrate. A method of dividing a light emitting device package substrate to be divided into light emitting devices,
A jig body, a support area formed on the surface of the jig body for supporting the light emitting device package substrate, and a cutting blade of the cutting blade that is formed at a position corresponding to the division line of the light emitting device package substrate in the support region A cutting blade entry groove, a lens housing portion that houses the dome-shaped lens in a region defined by the cutting blade penetration groove, and a through hole that extends from the lens housing portion to the back surface of the jig body. A preparation step of preparing a support jig;
A mounting step of positioning the surface of the light emitting element package substrate so that a dome-shaped lens is stored in the lens storage portion of the support jig and mounting the surface on the support region;
A dividing step of cutting the cutting blade from the back surface of the light emitting element package substrate along the planned dividing line to divide the light emitting element into individual light emitting elements provided with dome-shaped lenses;
At least it consists of,
In the state where the light emitting device package substrate is placed on the support region, the edge of the cutting blade entry groove is exposed from the light emitting device package substrate, and the cutting blade entry groove is exposed to the exposed cutting blade entry groove in the dividing step. A method for dividing a light emitting device package substrate, wherein the cutting blade of the cutting blade is positioned to start cutting . Light-emitting elements are formed in a plurality of regions divided by the planned dividing lines, and light-emitting element package substrates each having a surface on which a dome-shaped lens is formed above each light-emitting element are formed with individual dome-shaped lenses. A support jig used to divide the light emitting device,
A jig body, a support area formed on the surface of the jig body for supporting the light emitting device package substrate, and a cutting blade of the cutting blade that is formed at a position corresponding to the division line of the light emitting device package substrate in the support region A cutting blade entry groove, a lens housing portion for housing the dome-shaped lens in a region defined by the cutting blade entry groove, and a through hole extending from the lens housing portion to the back surface of the jig body ,
The support jig , wherein the edge of the cutting blade entry groove is exposed from the light emitting element package substrate in a state where the light emitting element package substrate is placed on the jig body .

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