JP4424834B2 - Lead inspection method and apparatus - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a method and apparatus for inspecting lead deformation in an integrated circuit or the like.
[0002]
[Prior art]
Currently, with the diversification of various electronic devices, the demand for semiconductor elements tends to increase further. Since these semiconductor elements are automatically mounted on a printed circuit board, bending of the leads of the semiconductor elements and adhesion of foreign substances have a great influence on the assembly process.
[0003]
As a conventional lead inspection method and device, image processing is performed using transmitted light and reflected light from a light source using a camera, and by comparison with good lead pitch data, bending in the lead pitch direction and lead vertical warping direction, An inspection for the presence of foreign matter was performed.
[0004]
[Problems to be solved by the invention]
However, in the conventional lead bending inspection, it is necessary to inspect each bending in the lead pitch direction and the lead vertical direction, and thus it is necessary to use two inspection machines that perform inspection in each direction. For this reason, there is a problem of requiring a large space at the inspection station, and further, there are problems of inspection cost and processing speed by two inspection machines. Further, as shown in FIG. 6, since the posture of the IC main body 22 at the inspection position is uncertain, there are many variations in the lead position, which greatly affects the inspection accuracy.
[0005]
[Means for Solving the Problems]
In view of the above problems, the present inventor has achieved the present invention as a result of diligent research. The feature of the present invention is that a plurality of leads projecting from a package of electronic components A device for inspecting bending in the lead pitch direction and vertical direction based on a projected image, wherein at the lead photographing position on the transfer rail for transferring the package, an opening at the bottom of the transfer rail, and a lower portion of the opening The air blowout flow path is provided so as to communicate with the opening between the air inflow portion and the air outflow portion.
[0006]
In the invention of the method, a plurality of leads protruding from the package of electronic components are inspected for a bend in the lead pitch direction and the vertical direction by a projection image, and the package body is stopped at the photographing position on the transfer rail. Then, air was fed to the air blowing passage communicated across the opening provided at the bottom of the transfer rail at the lead photographing position, and the posture of the package body was controlled at the lead photographing position and then photographed. The determination is based on the projected image.
[0007]
Here, the transfer rail in the present specification refers to the one that positions the lead to be inspected at the inspection position by the projection image. The supply to the inspection position is performed by, for example, feeding by an air cylinder or the like, or tilting and sliding the rail. In a state where the electronic component package is held at the inspection position on the transfer rail, the lead projection image is captured by the camera, and the quality of the lead bending is determined.
[0008]
In lead inspection based on projected images, the conventional inspection method using two inspection machines is to shoot the lead pitch direction and vertical direction individually with two inspection machines, and to judge them comprehensively. There is a merit that the accuracy of the positioning of the package at the inspection position is not required. However, as described above, there are problems such as requiring a large inspection space and an increase in inspection cost. Therefore, in the present invention, it is possible to use a single inspection machine by increasing the positioning accuracy at the inspection position. Judgment is possible.
[0009]
That is, the feature of the present invention is that an opening is provided at the bottom of the transfer rail on which the package slides, and an air blowing passage is provided below the opening, and air is supplied to the air blowing passage to thereby provide the opening. The package is attracted to the bottom of the transfer rail by the generated suction force to control the posture, thereby positioning at the inspection position. The size and shape of the opening are not particularly limited. However, it is preferable that the opening is provided not only at the bottom but also from the bottom of the transfer rail to the back side wall surface so as to be attracted also to the back side and to be positioned in the front-rear direction.
[0010]
In the method and apparatus of the present invention, since it is possible to determine the quality of lead bending with a single inspection machine, by installing a camera as an inspection machine in the oblique direction of the lead, the pitch direction of the lead and the vertical direction The bending of the direction can be determined. Usually, a camera is installed 45 ° above the position where each lead is directly facing, and a transmission type illumination device is provided behind the lead on the extension line.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on embodiments of the invention shown in the drawings.
[0012]
FIG. 1 shows an example of an embodiment of a lead inspection apparatus 1 according to the present invention. In an imaging position on a transfer rail 3 to which an IC 2 is transferred, an opening 4 and an opening 4 at the bottom of the transfer rail 3 are shown. The air blowing flow path 5 is provided in the lower part of. In addition, the camera 6 is installed 45 ° above the directly facing position of the tip of the lead 21 of the IC 2 at the photographing position, and a transmissive LED illumination 61 is provided on the extended line. In this example, the SIP type is illustrated as the IC 2, but a flat package type, a transistor type, or the like may be used and is not particularly limited.
[0013]
In the method according to the present invention, the main body 22 of the IC 2 sent on the transfer rail 3 is stopped at the photographing position by the stopper 7 as shown in FIG. Then, the IC 2 is positioned at the photographing position by supplying air to the air blowing channel 5 and controlling the posture of the main body 22. In this state, the quality of the curve is determined based on the projection image of the lead 21 photographed by the camera 6. Note that a square provided on the front surface of the main body of the apparatus 1 of this example is a transmission window 62 of the LED illumination 61.
[0014]
As shown in FIG. 3, the state of posture control of the transfer rail 3 at the photographing position is such that air is supplied from the air inflow portion of the air blowing channel 5 and is sent out from the air outflow portion. As a result, a suction force is generated in the opening 4 provided at the bottom of the transfer rail 3 and communicated with the air blowing channel 5. The main body 22 that is in a position-shifted state by this suction force is attracted to the bottom of the transfer rail 3 and held at the chain line position in the figure, and a projection image at a fixed position can always be obtained.
[0015]
As shown in FIG. 4, the position of the opening 4 is provided from the bottom of the transfer rail 3 to the back side wall surface 8, so that the main body 22 can be attracted not only to the bottom but also to the back side wall surface, and positioning is more reliable. It becomes possible to. Further, as shown in FIG. 5, a tapered portion 9 may be provided at the bottom of the transfer rail 3 so that the main body 22 can be easily placed in a predetermined position.
[0016]
【The invention's effect】
As described above, the lead inspection method and apparatus according to the present invention is provided with an opening at the bottom of the transfer rail at the photographing position and a state in which the air blowing channel is communicated with the lower part of the opening. The positioning of the IC main body at the photographing position of the projected image by the camera is ensured, and an extremely accurate inspection can be performed. This also makes it possible to determine the lead pitch direction and vertical bending with only one camera, and there are advantages that a large inspection space is not required and inspection costs are reduced. In addition, the structure is extremely simple, the maintenance and management of the apparatus is easy, and it can be introduced at a low cost.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of an embodiment of a lead inspection apparatus according to the present invention.
FIG. 2 is a schematic perspective view showing an example of an embodiment of a lead inspection method according to the present invention.
FIG. 3 is a partial cross-sectional view illustrating an example of a state of posture control at a shooting position of a transfer rail.
FIG. 4 is a partial cross-sectional view showing another example of the embodiment of the opening.
FIG. 5 is a partial cross-sectional view showing another example of the embodiment of the transfer rail.
FIG. 6 is a partial cross-sectional view showing a conventional example of a transfer rail at a photographing position.
[Explanation of symbols]
1 Lead inspection device 2 IC
21 Lead 22 IC body 3 Transfer rail 4 Opening portion 5 Air blowing channel 6 Camera 61 Transmitting LED illumination 62 Transmitting window 7 Stopper 8 Back side wall surface 9 Tapered portion

Claims (5)

A device for inspecting a plurality of leads protruding from a package of electronic components by a projected image for bending in a lead pitch direction and a vertical direction, and opening at the bottom of the transfer rail at a lead photographing position on the transfer rail for transferring the package And an air blowing channel provided below the opening, and the air blowing channel communicates with the opening between the air inflow portion and the air outflow portion. apparatus. The lead inspection apparatus according to claim 1, wherein the projected image is captured by a camera installed at an angle of 45 ° above a directly facing position of each lead tip. The lead inspection apparatus according to claim 1, wherein the opening is provided from the bottom of the transfer rail to the back side wall surface. A method of inspecting a plurality of leads projecting from a package of electronic parts by a projected image for lead pitch direction and vertical bending, wherein the package body is stopped at an imaging position on a transfer rail, and the transfer rail is detected at a lead imaging position. The air is fed to an air blowing channel that is communicated across the opening provided at the bottom of the package, and the attitude of the package body is controlled at the lead imaging position, and then the projected image is used for determination. Lead inspection method. 5. The lead inspection method according to claim 4, wherein the projected image is captured by a camera installed at an angle of 45 [deg.] Above the directly facing position of each lead tip.

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