JP4488722B2 - Electronic component mounting apparatus recognition method and recognition apparatus - Google Patents

Description

  The present invention provides a substrate recognition camera that images a positioning mark on a printed circuit board provided on a mounting head and an electronic component that is sucked and held by a suction nozzle of a mounting head that can be moved in a plane direction by a driving source. The present invention relates to a recognition method for an electronic component mounting apparatus that includes a component recognition camera, performs recognition processing by a recognition processing apparatus based on the imaging results of both cameras, and mounts on a printed circuit board, and the recognition apparatus.

  In general, in order to take an image of an electronic component sucked and held by a suction nozzle with a component recognition camera, it must be temporarily stopped above the component recognition camera, but in an imaging method called a fly view method in which an image is picked up without stopping. Compared with the imaging method to be stopped, the output timing of the imaging trigger signal from the recognition processing unit to the component recognition processing unit with respect to the image capture signal to the recognition processing unit has a delay and variation.

For this reason, since the image cannot be captured at the correct position, the center position of the suction nozzle with respect to the center of the component recognition camera cannot be accurately grasped, the recognition result is shifted, and the mounting accuracy of the electronic component is simply deteriorated by the variation To do. Therefore, the present applicant has already proposed a technique for improving the mounting accuracy of the electronic component by eliminating the variation in the timing of outputting the imaging start signal to the component recognition camera in the fly-view method that captures an image while moving the electronic component. (See Patent Document 1).
Specification and drawing of Japanese Patent Application No. 2002-123915

  However, in different imaging cameras, even when the imaging start commands to both imaging cameras are simultaneous, the exposure start timing and the exposure time of both imaging cameras are different, and thus images of the same timing cannot be captured.

  Accordingly, an object of the present invention is to capture an image at the same timing so that the illumination lamp is turned on when the board recognition camera and the component recognition camera are surely in the exposure state.

For this reason, the first invention moves a board recognition camera that is provided on the mounting head and images a positioning mark on the printed board, and an electronic component that is sucked and held by the suction nozzle of the mounting head that can be moved in a plane direction by a driving source. In a method for recognizing an electronic component mounting apparatus that includes a component recognition camera that captures images while performing recognition processing by a recognition processing device based on the imaging results of both cameras and mounts on a printed circuit board, the mounting is performed above the component recognition camera. While the suction nozzle of the head is positioned, the mark attached to the apparatus main body is imaged by the substrate recognition camera, and the recognition processing device recognizes the position of the mark in advance. When the held mounting head reaches a predetermined position until it passes through the component recognition camera, the recognition processing device performs the component recognition camera. And outputs an imaging start signal to the board recognition camera to start the exposure, the recognition processor illumination lighting circuit a lighting lighting signal when the exposure is started the component recognition camera and the board recognition camera is exposed state The output lamp is turned on to illuminate the electronic component held by the suction nozzle and simultaneously illuminate the mark attached to the apparatus main body, and is held by the suction nozzle output from the component recognition camera. An exposed captured image of the electronic component and an exposed captured image of the mark attached to the apparatus main body output from the board recognition camera are taken into the recognition processing device, and the both captured images are captured by the recognition processing device. To recognize the positions of the marks attached to the electronic component and the apparatus main body, and the suction head of the mounting head is positioned above the component recognition camera. The image is taken together with the position of the mark attached to the main body of the apparatus that has been grasped in advance and the electronic component held by the suction nozzle, and is attached to the main body of the apparatus that has been recognized by the recognition processing device. Further, the positional deviation amount from the mark position is also taken into account for the correction of the position of the electronic component by the recognition processing of the recognition processing device.

According to a second aspect of the present invention, a substrate recognition camera that images a positioning mark on a printed circuit board provided on the mounting head, and an electronic component that is suctioned and held by a suction nozzle of the mounting head that can be moved in a plane direction by a drive source. An electronic component that is imaged by the component recognition camera in the recognition device of the electronic component mounting device that includes a component recognition camera that captures an image and performs recognition processing by the recognition processing device based on the imaging results of both cameras and mounts on the printed circuit board An illumination lamp for illuminating a mark attached to the apparatus body imaged by the board recognition camera, and an attachment nozzle of the mounting head positioned above the component recognition camera are attached to the apparatus body by the board recognition camera . before attached to the apparatus body by imaging the mark illuminated by said illumination lamp grasped by recognition processing by the recognition processing unit is First recognition means for storing the position of the mark, and when the mounting head in a state where the suction nozzle holds the electronic component reaches a predetermined position until it passes through the component recognition camera, the recognition processing device First control means for controlling the start of exposure by outputting an imaging start signal to the recognition camera and the board recognition camera, and the component recognition camera and the board recognition when exposure is started by the control of the first control means. When the camera is in an exposure state, the recognition processing device outputs an illumination lighting signal to an illumination lighting circuit to turn on the illumination lamp to illuminate the electronic component held by the suction nozzle, and is attached to the apparatus main body. Second control means for controlling the marks to be illuminated at the same time, and a suction nozzle that is illuminated by the control of the second control means and is output from the component recognition camera Third control is performed so that the captured captured image of the held electronic component and the captured captured image of the mark attached to the apparatus main body output from the board recognition camera are captured by the recognition processing apparatus. A second means for storing a position of the mark attached to the electronic component and the apparatus main body obtained by recognizing and processing the both captured images captured by the third control means in the recognition processing device; Deviation between the storage means and the position of the mark attached to the apparatus main body stored in the first storage means and the position of the mark attached to the apparatus main body stored in the second storage means And a fourth control means for controlling the amount so as to be added to the correction of the position of the electronic component by the recognition processing of the recognition processing device.

  In the present invention, the illumination lamp is turned on when the board recognition camera and the component recognition camera are reliably in the exposure state, and both cameras can capture images at the same timing.

  An embodiment of the present invention will be described below based on the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. On the mounting apparatus main body 2 of the apparatus 1, there are component supply units 3 that supply various electronic components one by one to their component take-out portions (component suction positions). A plurality are arranged side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the groups of opposing units 3. The supply conveyor 4 conveys the printed circuit board P received from the upstream to the positioning unit 5, and after the electronic components are mounted on the substrate P positioned by a positioning mechanism (not shown) by the positioning unit 5, the conveyance is conveyed to the discharge conveyor 6. Is done.

  Reference numerals 8 and 8 denote a pair of beams that are long in the X direction, each of which rotates a screw shaft 10 by driving a Y-axis motor 9, and along the pair of left and right guides 11 The component suction position) is individually moved in the Y direction.

  Each beam 8 is provided with a mounting head 7 that moves along a guide (not shown) by an X-axis motor 12 in the longitudinal direction, that is, in the X direction. Each mounting head 7 is equipped with a vertical axis motor 14 for moving the suction nozzle 17 up and down and a θ-axis motor 15 for rotating around the vertical axis. Therefore, the suction nozzles 17 of the two mounting heads 7 can move in the X direction and the Y direction, can rotate around the vertical line, and can move up and down.

  Reference numeral 16 denotes a part recognition camera for part position recognition. Two parts recognition cameras are provided corresponding to the respective suction nozzles 17 to determine how much the electronic parts are held by suction with respect to the suction nozzles in the XY direction and the rotation angle. In order to recognize the position, the electronic component is imaged. Nos. 18 and 18 are nozzle stockers for storing various suction nozzles, and a maximum of 10 can be stored, but 9 are stored.

  Reference numerals 19 and 19 denote board recognition cameras, which are provided on the mounting heads 7 respectively, and pick up images of the mark M1 in order to recognize the position of the mark M1 attached to the printed board P.

  Next, description will be given based on FIG. 2 which is a conceptual diagram showing various illuminations. Each suction nozzle 17 has a diffusion plate 13 and is detachably provided on the mounting head 7. A lens 20 and a half mirror 21 are disposed above the component recognition camera 16, and a hollow cylindrical illumination unit 22 is disposed above the half mirror 21.

  And it is the structure which guides the light from the strobe 24 which is a single light source controlled by the illumination lighting circuit 23 to the illumination unit 22 through each optical fiber 25. Here, if the amount of light from the light source is small, the lighting time is long and the exposure time is long, so the image captured by the component recognition camera 16 is blurred, but if the strobe 24 is used, the amount of light is large. This is suitable for fly recognition. That is, it is suitable for so-called fly recognition in which the component recognition camera 16 images and recognizes an electronic component sucked and held by the suction nozzle 17 while the mounting head 7 moves.

  Each of the optical fibers 25 is separated from a bundle of many optical fibers 25, and a plurality of optical fibers 25 are arranged at a predetermined interval on the irradiation portion 22A at the uppermost inner surface of the hollow cylindrical illumination unit 22. Is the optical fiber 25A for reflected illumination A, the optical fiber 25B for transmitted illumination is disposed in the next irradiation unit 22B, and the optical fiber 25C for reflected illumination B is disposed in the next irradiation unit 22C. In addition, an optical fiber 25D for the reflected illumination C is disposed in the irradiating unit 22D in the vicinity of the illuminating unit 22, and is disposed so as to irradiate at a predetermined angle. The optical fibers 25A, 25B, 25C, and 25D are interrupted in the middle, and shutters 27A, 27B, 27C, and 27D that are opened and closed by electromagnetic solenoids 26A, 26B, 26C, and 26D are provided at the separation positions.

  The suction nozzle 17 includes a tip nozzle portion 17A having a small diameter (small diameter) at the tip portion (lower end portion), an upper nozzle portion 17B having an upper large diameter (large diameter), and the tip nozzle portion 17A and the upper nozzle portion. An intermediate nozzle portion 17C having a truncated cone shape that has a narrow diameter toward the lower side connecting 17B. In order to recognize the attachment position of the suction nozzle 17 by performing reflected illumination A and picking up the suction nozzle 17 with the component recognition camera 16, the image of the intermediate nozzle portion 17C becomes white and is clearly identified from other parts. The intermediate nozzle portion 17C is colored black so that it can be made.

  Further, the mounting device main body 2 is provided with a mark forming body 30, and an optical fiber 25E is guided to an opening formed in the forming body 30, and a non-transparent body is painted or vapor-deposited (for example, chromium-based vapor deposition) leaving a circle. By fixing the plate 32 on the mark forming body 30, the light of the strobe 24 is irradiated onto the diffusion plate 32 from below through the optical fiber 25 </ b> E, and the circle is lifted as a white mark M <b> 2. Through the substrate recognition camera 19.

  FIG. 3 is a control block diagram of the electronic component mounting apparatus 1. For convenience, only one X-axis motor 12, Y-axis motor 9, θ-axis motor 15, and vertical axis motor 14 are illustrated and described below.

  It is composed of a CPU 41 as a control unit that performs overall control of operations related to electronic component mounting of the mounting device 1, a RAM (random access memory) 42 and a ROM (read only memory) 43 as storage devices. ing. In the RAM 42, mounting data and printed circuit boards including X direction, Y direction and angular position information in the printed circuit board P, FDR number (arrangement number of each component supply unit 3) information and the like for each electronic component mounting order. The position of the mark M1 attached to P is stored.

  Then, the CPU 41 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 43 based on the data stored in the RAM 42. That is, the CPU 41 drives the X-axis motor 12 via the drive circuit 45, drives the Y-axis motor 9 via the drive circuit 46, and drives the θ-axis motor 15 via the drive circuit 47. Further, the drive of the vertical axis motor 14 is controlled via a drive circuit 48.

  A recognition processing unit 50 is connected to the CPU 41 via the interface 49. The recognition processing unit 50 recognizes an image captured by the component recognition camera 16, and the CPU 41 receives the processing result. Is sent out. That is, the CPU 41 outputs an instruction to the recognition processing unit 50 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 16 and receives a recognition processing result from the recognition processing unit 50. It is.

  That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing unit 50, the result is sent to the CPU 41. The CPU 41 drives the Y axis motor 9 to drive the beam 8 in the Y direction, and the mounting head 7 moves to the X axis. The motor 12 is driven to move in the X direction, and the θ axis motor 15 is rotated by θ to correct the rotational angular position about the X, Y direction and the vertical axis.

  In addition, the recognition processing unit 50 performs recognition processing of an image captured by the board recognition camera 19 and the processing result is sent to the CPU 41. That is, the CPU 41 outputs an instruction to the recognition processing unit 50 so as to perform recognition processing (calculation of misalignment amount) on the image captured by the board recognition camera 19 and receives the recognition processing result from the recognition processing unit 50. It is.

  That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing unit 50, the result is sent to the CPU 41. The CPU 41 drives the Y axis motor 9 to drive the beam 8 in the Y direction, and the mounting head 7 moves to the X axis. By moving the motor 12 in the X direction, and by rotating the θ by the θ-axis motor 15, it is possible to correct the rotational angle position about the X, Y direction and the vertical axis.

  Note that the above-described substrate recognition processing operation is performed only before the first electronic component mounting by each beam 8. This is because not only the characteristics of the printed circuit board P but also the characteristics of each beam, each mounting head, etc. are reflected in the position correction for component mounting.

  Reference numeral 51 denotes a keyboard as input means connected to the CPU 41 via a keyboard driver 52 and an interface 49, and 53 is a monitor for displaying an image such as a recognition component image. Note that an input means such as a touch panel may be used instead of the keyboard 51 as the input means. 4 is a head detection sensor that outputs a mounting head detection signal when the mounting head 7 is detected, and is provided at a predetermined position of the beam 8 on the same line (Y direction) as the center position of the component recognition camera 16, for example. More specifically, one light emitting element of the head detection sensor 54 is provided at a predetermined position of the beam 8 on the same line (Y direction) as the center position of the component recognition camera 16, and the other light receiving element is provided on the mounting head 7. Therefore, when the mounting head 7 moves on the same line (Y direction) as the center position of the component recognition camera 16, a mounting head detection signal is generated from the head detection sensor 54, and the detection signal is input to the recognition processing device 50. It will be.

  Also, 55 shown in FIG. 3 is a timer. In this timer 55, after the mounting head detection signal is issued, both the component recognition camera 16 and the board recognition camera 19 start exposure and become an exposure state. For example, a delay time slightly longer than the required time is set in advance.

  With the above configuration, the operation will be described with reference to FIGS. 5 and 6. Although two mounting heads 7 are provided, for convenience of explanation, one mounting head 7 will be described below as an example. First, before starting the operation, the CPU 41 drives the X-axis motor 12 and the Y-axis motor 9 via the drive circuits 45 and 46 to move the mounting head 7 above the component recognition camera 16, as shown in FIG. As described above, the rotation center of the suction nozzle 17 is positioned, for example, above the center of the component recognition camera 16 (not necessarily the center position) (step 1).

  Next, a mark arranged on the mounting apparatus main body 2 with a distance equivalent to the distance between the rotation center of the suction nozzle 17 and the substrate recognition camera 19, for example, the camera center, from the camera recognition center of the component recognition camera 16, for example. The substrate recognition camera 19 images M2, and the CPU 41 controls the recognition processing unit 50 to recognize the position of the mark M2 (step 2).

  Then, the CPU 41 controls to store the position of the mark M2 recognized by the recognition processing unit 50 in the RAM 42 (step 3).

  In this state, the production operation is started (step 4). First, the printed circuit board P is conveyed from the upstream device to the positioning unit 5 via the supply conveyor 4 by a conveyor (not shown), and is positioned and fixed by the positioning mechanism. Then, according to the mounting data in which the XY coordinate position to be mounted on the printed circuit board P stored in the RAM 42, the rotation angle position around the vertical axis, the FDR number (arrangement number of each component supply unit 3) and the like are specified, the electronic component The electronic component to be mounted by the suction nozzle 17 corresponding to the component type is picked up and taken out from the predetermined component supply unit 3.

  That is, the suction nozzle 17 of the mounting head 7 moves so as to be positioned above the component supply unit 3 that stores the electronic component to be mounted of the mounting step number 0001, but the Y-axis motor 9 is driven by the drive circuit 46 in the Y direction. The beam 8 moves along the pair of guides 11, the X-axis motor 12 is driven by the drive circuit 45 in the X direction and the mounting head 7 moves, and the predetermined supply unit 3 has already been driven to the component suction position. Since the parts are ready to be taken out, the vertical axis motor 14 is driven by the drive circuit 48 and the nozzle 17 descends to pick up and take out the electronic parts (step 5).

  Then, the CPU 41 controls so that the mounting head 7 including the suction nozzle 17 holding the electronic component D by suction is passed above the component recognition camera 16 at a constant speed (step 6).

  During this passage, a mounting head detection signal is emitted from a head detection sensor 54 attached to a predetermined position of the beam 8 on the same line (Y direction) as the center position of the component recognition camera 16, and the CPU 41 recognizes the recognition processing device 50. (Step 7). More precisely, one light emitting element of the head detection sensor 54 is provided at a predetermined position of the beam 8 on the same line (Y direction) as the center position of the component recognition camera 16, and the other light receiving element is provided on the mounting head 7. Therefore, when the mounting head 7 moves on the same line (Y direction) as the center position of the component recognition camera 16, a mounting head detection signal is emitted from the head detection sensor 54, and the detection signal is used as a recognition processing device. 50 will be input.

  Then, upon receiving the mounting head detection signal, the imaging processing device 50 as the image processing device outputs an imaging start signal simultaneously to the component recognition camera 16 and the substrate recognition camera 19, and the component recognition camera 16 and the substrate recognition camera 19 start exposure. Then, the CPU 41 performs control (step 8).

  However, when the types of the two cameras are different, as shown in FIG. 6, the exposure start timings of the component recognition camera 16 and the board recognition camera 19 are different. The exposure start timings of the component recognition camera 16 and the board recognition camera 19 are different.

  Then, when a mounting head detection signal is issued from the head detection sensor 54 and the CPU 41 inputs it to the recognition processing device 50, the timer 55 starts measuring time and a predetermined delay time elapses. After both of the recognition cameras 19 start exposure, that is, in FIG. 6, when the slower substrate recognition camera 19 starts exposure and both the recognition cameras 16 and 19 are in the exposure state, the CPU 41 sets the time of the timer 55. Receiving the up signal, the recognition processing device 50 outputs an illumination lighting signal to the illumination lighting circuit 23 to turn on the strobe 24 (step 9).

  Next, recognition processing is performed on the exposed captured image of the electronic component D held by the suction nozzle 17 output from the component recognition camera 16 and the exposed captured image of the mark M2 output from the substrate recognition camera 19. The CPU 41 controls to take in the device 50 (step 10).

  Then, the recognition processing device 50 performs recognition processing of both captured images, and the CPU 41 calculates the shift amount (Δx, Δy) of the mark M2 position in this step 11 and stores it in the RAM 42 (see FIG. 7). Using this, the component recognition position is corrected (step 11). That is, the electronic component D is printed by adding the amount of displacement of the positions of the marks M2 grasped in the steps 3 and 11 to the recognition result (stored in the RAM 42) of recognizing the position of the electronic component D. Mount on the substrate P.

  That is, as a result of the addition, the CPU 41 causes the beam 8 to move in the Y direction by driving the Y-axis motor 9 and the mounting head 7 to move in the X direction by driving the X-axis motor 12. Is rotated by θ, and the rotational angle position around the X and Y directions and the vertical axis is corrected and attached.

  In the present embodiment, the light from the strobe 24, which is a single light source controlled by the illumination lighting circuit 23, is guided to the illumination unit 22 via each optical fiber 25. However, the present invention is not limited to this. Alternatively, a light source may be incorporated in the illumination unit, and light may be supplied to the mark M2 using a mirror or the like.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view of an electronic component mounting apparatus. It is a conceptual diagram which shows various illuminations. It is a control block diagram of this electronic component mounting apparatus. It is a figure which shows the state which has located the rotation center of the suction nozzle above the camera center of a component recognition camera. It is a figure which shows a flowchart. It is a figure which shows the timing of imaging, etc. It is a figure which shows the picked-up image of the mark M2.

Explanation of symbols

3 Component Supply Unit 7 Mounting Head 16 Component Recognition Camera 17 Suction Nozzle 19 Substrate Recognition Camera 22 Illumination Unit 23 Illumination Lighting Circuit 24 Strobe (Light Source)
25 Optical fiber 41 CPU
42 RAM
50 Recognition processing device 54 Head detection sensor 55 Timer M2 mark

Claims (2)

A board recognition camera that images a positioning mark on a printed circuit board provided on the mounting head, and a component recognition camera that captures an image while moving an electronic component sucked and held by a suction nozzle of the mounting head movable in a plane direction by a driving source In a recognition method for an electronic component mounting device that is subjected to recognition processing by a recognition processing device based on the imaging results of both cameras and mounted on a printed circuit board,
With the suction nozzle of the mounting head positioned above the component recognition camera, the board recognition camera picks up the mark attached to the main body of the device, and the recognition processing device recognizes the mark so as to grasp the position of the mark in advance. And
The recognition processing device outputs an imaging start signal to the component recognition camera and the board recognition camera when the mounting head with the suction nozzle holding the electronic component reaches a predetermined position until it passes through the component recognition camera. To start exposure,
When the exposure is started and the component recognition camera and the board recognition camera are in an exposure state, the recognition processing device outputs an illumination lighting signal to an illumination lighting circuit to turn on the illumination lamp, and the electrons held in the suction nozzle While illuminating the parts, simultaneously illuminating the mark on the device body,
The recognition processing is performed on the exposed captured image of the electronic component held by the suction nozzle output from the component recognition camera and the exposed captured image of the mark attached to the apparatus main body output from the board recognition camera. Into the device,
Recognizing both the picked-up images with the recognition processing device to grasp the position of the mark attached to the electronic component and the device body;
The recognition processing device is imaged together with the position of the mark attached to the main body of the apparatus previously grasped in a state where the suction nozzle of the mounting head is positioned above the component recognition camera and the electronic component held by the suction nozzle. An electronic component mounting apparatus characterized in that the amount of positional deviation from the position of the mark attached to the apparatus main body recognized by the recognition processing in the above is added to the correction of the position of the electronic component by the recognition processing of the recognition processing apparatus. Recognition method. A board recognition camera that images a positioning mark on a printed circuit board provided on the mounting head, and a component recognition camera that captures an image while moving an electronic component sucked and held by a suction nozzle of the mounting head movable in a plane direction by a driving source In a recognition device for an electronic component mounting device that is subjected to recognition processing by a recognition processing device based on the imaging results of both cameras and mounted on a printed circuit board,
An illuminating lamp for illuminating an electronic component imaged by the component recognition camera and a mark attached to an apparatus main body imaged by the board recognition camera;
With the suction nozzle of the mounting head positioned above the component recognition camera, the board recognition camera picks up the mark that is attached to the main body of the apparatus and illuminated by the illuminating lamp, and performs recognition processing by the recognition processing device. First storage means for storing the position of the mark attached to the apparatus main body grasped by
The recognition processing device outputs an imaging start signal to the component recognition camera and the board recognition camera when the mounting head with the suction nozzle holding the electronic component reaches a predetermined position until it passes through the component recognition camera. First control means for controlling to start exposure,
When the exposure is started by the control of the first control means and the component recognition camera and the board recognition camera are in an exposure state, the recognition processing device outputs an illumination lighting signal to an illumination lighting circuit to turn on the illumination lamp. Illuminating the electronic component held by the suction nozzle and controlling to simultaneously illuminate the mark attached to the apparatus main body,
Illuminated by the control of the second control means, the exposed captured image of the electronic component held by the suction nozzle output from the component recognition camera and the apparatus body output from the substrate recognition camera Third control means for controlling the captured captured image of the mark to be captured by the recognition processing device;
Second storage means for storing the position of the mark attached to the electronic component and the apparatus main body obtained by recognizing and processing the both captured images captured by the third control means in the recognition processing apparatus;
Recognizing processing of the amount of deviation between the position of the mark attached to the apparatus main body stored in the first storage means and the position of the mark attached to the apparatus main body stored in the second storage means 4. A recognition device for an electronic component mounting apparatus, comprising: a fourth control unit that performs control so as to take into account the correction of the position of the electronic component by the recognition processing of the device.

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