JP2003209398A - Electronic component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To ease the indication procedures and improve accuracy by realizing low cost through substrate recognition and position recognition of electronic component with only one recognition camera and by simplifying offset of camera position. <P>SOLUTION: The recognition camera 14 is moved up to the upper part of a positioning mark M of a positioned printed circuit board P, and the recognition camera 14 picks up an image by irradiating the mark M with the light beam from a lighting source 30. Next, an attracting nozzle 13 extracts an electronic component D from a supply unit 3, the component D stops at the upper position of one reflection member 16 in the course of movement up to the upper position of the substrate P. In the case of the transmission recognition type electronic component, a diffusing plate 15 is irradiated with the light from the lighting source 19 and a transmitting image of the electronic component D after irradiation is picked up via a lens 22 with a camera 14 via the reflection members 16, 17. In the case of the reflection recognition type electronic component, a reflection image of the electronic component D after irradiation of the electronic component D attracted by the nozzle 13 with the light beam from the lighting source 20 is picked up with the camera 14 via the reflection members 16, 17. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention recognizes the position of an electronic component on a printed circuit board before mounting the electronic component on the printed circuit board, and sucks and holds it on a suction nozzle provided on a mounting head that is movable in a plane direction by a moving mechanism. The present invention relates to an electronic component mounting device that recognizes the position of an electronic component that has been removed.

[0002]

2. Description of the Related Art A conventional electronic component mounting apparatus of this type is provided with a board position recognizing camera and an electronic component position recognizing camera separately, as disclosed in JP-A-11-214900. Was there.

[0003]

Therefore, two recognition cameras are required, one for recognizing the position of the printed circuit board and the other for recognizing the position of the electronic component, which is expensive. Further, there is a problem that the offset of the camera position becomes complicated, which makes it difficult to teach and it is difficult to improve accuracy.

Therefore, in the present invention, the cost is reduced by recognizing the board and the position of the electronic component with one recognition camera.
Moreover, it is an object of the present invention to simplify the offset of the camera position, reduce the trouble of teaching, and improve the accuracy.

[0005]

Therefore, the first invention is
An electronic component for recognizing the position of the electronic component before mounting the electronic component on the printed circuit board and for recognizing the position of the electronic component sucked and held by the suction nozzle provided on the mounting head movable in the plane direction by the moving mechanism. In the mounting device,
A recognition camera is provided so as to be movable in the plane direction together with the mounting head by the moving mechanism, and two reflecting members are provided in the main body of the apparatus, and the recognition camera is moved above the printed board by the moving mechanism for board recognition. The positioning mark attached to the substrate is irradiated with light from an illumination source to image the mark, and the mounting head moves above the one reflecting member by the moving mechanism, so that the component recognition transmitting illumination source The recognition camera captures a transmission image of the electronic component after irradiating the diffuser plate provided on the suction nozzle with the transmission light from the one reflection member via the other reflection member.

According to a second aspect of the invention, before the electronic component is mounted on the printed circuit board, the position of the circuit board is recognized and it is held by suction by a suction nozzle provided on a mounting head which is movable in the plane direction by a moving mechanism. In the electronic component mounting apparatus for recognizing the position of the electronic component, a recognition camera is provided so as to be movable in the plane direction together with the mounting head by the moving mechanism, and two reflecting members are provided in the apparatus body, and the recognition camera is moved by the movement. By moving the printed circuit board above the printed circuit board by a mechanism, the positioning mark provided on the circuit board is irradiated with light from the board recognition illumination source to image the mark, and the mounting head is moved by the moving mechanism to the one reflecting member. By moving the light from the illumination source for component recognition and reflection to the electronic component sucked and held by the suction nozzle by moving above The recognition camera reflection image of goods from the one of the reflective member through the other of the reflection member is characterized in that the imaging.

Further, a third invention is characterized in that, in the first and second inventions, a switching mechanism for switching a plurality of lenses is provided in order to change an image pickup area by the recognition camera.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. A plurality of component supply units 3 are provided on a base 2 of the apparatus 1 for supplying various electronic components to the component unloading portion (component suction position), respectively. It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing supply unit groups 3. The supply conveyor 4 receives the printed circuit board P received from the upstream side device from the positioning unit 5
After the electronic component is mounted on the substrate P positioned by the positioning unit 5 by a positioning mechanism (not shown), the electronic component is transferred to the discharge conveyor 6 and transferred to the downstream side device.

Reference numeral 8 is a pair of beams long in the X direction, and Y
The screw shaft 10 is rotated by the drive of the shaft motor 9 and individually moved in the Y direction along the pair of left and right guides 11 above the printed circuit board P and the component pick-up portion (component suction position) of the component supply unit 3.

Each beam 8 is provided with a head mounting body 12 which moves along a guide by an X-axis motor (not shown) in the longitudinal direction, that is, the X direction, and the mounting body 12 has a suction nozzle 13. A mounting camera 7 is provided and a recognition camera 14 is provided. A vertical axis motor for moving the suction nozzle 13 up and down is mounted on the mounting head 7, and a θ axis motor for rotating around the vertical axis is mounted on the mounting head 7. Therefore, the suction nozzle 13 of the mounting head 7 can move in the X direction and the Y direction,
It can rotate around a vertical axis and can move up and down.

The recognition camera 14 includes the mounting head 7
The positioning marks M provided on the board P are imaged in order to recognize how much the printed board P positioned by the positioning mechanism is displaced. The electronic component is imaged in order to recognize the position according to the XY direction and the rotation angle of how much is displaced and held with respect to the suction nozzle 13 by suction. The recognition mark M may be used to grasp the positional deviation of the entire printed circuit board P,
Further, it may be for grasping the positional deviation in area (block) units, or for grasping the positional deviation for mounting individual electronic components.

The suction nozzle 13 has a diffusion plate 15,
The mounting head 7 is detachably provided. Reference numeral 16 shown in FIG. 2 is a reflecting member such as one mirror or prism.
Is a reflecting member such as the other mirror or prism, and a connecting plate member 18 for connecting the two is fixed on the base 2 of the electronic component mounting apparatus 1. That is, the two reflecting members 16 and 17 are arranged so as to face the connecting plate member 18 while being inclined by 45 degrees.

Reference numeral 19 denotes a component recognition / transmission illumination source, which is arranged in a ring shape, of the electronic component D after the light from the component recognition / transmission illumination source 19 is applied to the diffusion plate 15 provided in the suction nozzle 13. The recognition camera 14 is configured to capture a transmission image through the reflection members 16 and 17. Reference numeral 20 denotes a component recognition reflection illumination source, which is arranged in a ring shape and is irradiated with light from the component recognition reflection illumination source 20 to the electronic component D sucked and held by the suction nozzle 13. D
The recognition camera 14 takes an image of the reflection image of the above through the reflection members 16 and 17.

Reference numeral 21 denotes a plurality of lenses 22 having different magnifications in order to change the image pickup area of the recognition camera 14.
With a switching mechanism capable of switching 23, lens barrels 26, 27 having lenses 22, 23 are provided inside a rotating member 25 fixed to the drive shaft of a drive motor 24 and having a cylindrical outer shape. In the present embodiment, the number of lenses is two, but the number is not limited to this, and it is possible to provide any number of lenses having different magnifications.

A substrate recognition illumination source 30 is arranged in a ring shape, and the light from the substrate recognition illumination source 30 is applied to each positioning mark M attached to the printed circuit board P so that each of the marks M is described above. The recognition camera 14 takes an image. Reference numeral 31 is a nozzle stocker for accommodating the suction nozzles 13, which can accommodate a maximum of 10, but 9 of them.

The operation of the above structure will be described. First, the printed circuit board P is conveyed from the upstream side device to the positioning unit 5 via the supply conveyor 4 by a conveyor (not shown), and is positioned and fixed by the positioning mechanism.

Next, the control device (not shown) confirms the mounting data stored in the storage device, that is, the XY coordinate position to be mounted on the printed circuit board P stored for each step number, and the rotation angle position around the vertical axis. The suction nozzle 13 corresponding to the component type of the electronic component D having the mounting step number 001 has the mounting head 7 according to the mounting data in which the arrangement number and the arrangement number are designated.
First, the recognition camera 14 is moved above one of the positioning marks M of the printed circuit board P which is positioned and fixed by the positioning mechanism.

That is, the screw shaft 1 is driven by driving the Y-axis motor 9.
0 to rotate the beam 8 along the pair of left and right guides 11.
Is moved in the Y direction, and the head mounting body 12 is moved in the X direction along the guide by an X-axis motor (not shown) to move the recognition camera 14 above one of the positioning marks M (FIG. 3).

Then, light from the illumination source 30 for recognizing the board is applied to one of the positioning marks M attached to the printed board P so that the recognition camera 14 takes an image of the mark M, and then in the XY directions as described above. Move and move the board recognition illumination source 3
Light from 0 is applied to the other positioning mark M provided on the printed circuit board P, and the recognition camera 14 takes an image of the mark M. Then, how much the printed circuit board P positioned by the positioning mechanism is displaced,
A recognition processing device (not shown) performs recognition processing based on the images of the two marks M captured by the recognition camera 14.

Then, the electronic component D to be mounted is picked up by the suction nozzle 13 from a predetermined component supply unit 3 and taken out. That is, each suction nozzle 13 moves so as to be positioned above the component supply unit 3 that houses the electronic component D to be mounted, and the component extraction unit (component suction unit) of the component supply unit 3 that has already supplied the electronic components D one by one (component suction unit). (Position) Moves upward, and the suction nozzle is lowered by driving the vertical axis motor to suck and take out the electronic component D.

Next, the vertical axis motor is driven to raise the suction nozzle 13, the Y axis motor 9 drives the beam 8 along the pair of guides 11 in the Y direction, and the X axis motor in the X direction. When the mounting head 7 moves along the guide 11 by the driving of the mounting head 7, the mounting head 7 moves to a position above the printed circuit board P, but during the movement, it stops at a position above one of the reflecting members 16, If the electronic component D is a transmission recognition type electronic component, light from the component recognition transmission illumination source 19 is provided on the suction nozzle 13 for the diffusion plate 1.
5, the recognition camera 14 picks up a transmission image of the electronic component D sucked and held by the suction nozzle 13 after the irradiation through the lens 22 through the reflection members 16 and 17. If the electronic component D is a reflection recognition type electronic component, the reflection of the electronic component D after irradiating the electronic component D sucked and held by the suction nozzle 13 with light from the component recognition reflection illumination source 20. The recognition camera 14 takes an image through the reflection members 16 and 17.

In this way, the recognition camera 14 images the electronic component D, and how much the electronic component D is misaligned with respect to the suction nozzle 13 and suction-held is imaged in the XY direction and the rotation angle. Recognition processing is performed by a recognition processing device (not shown) based on the image.

Therefore, as described above, based on the recognition processing result for the positioning mark M and the recognition processing result for the electronic component D, the control device causes the X-axis motor, Y
By controlling the axis motor 9 and the θ-axis motor, the electronic component D is mounted at a predetermined position on the printed board P.

That is, the beam 8 and the mounting head 7 are moved, and the suction nozzle 13 mounts each electronic component D on the printed circuit board P while correcting the positional deviation in consideration of the recognition result. In this case, the control is performed. The device has a beam 8 for a Y-axis motor 12
By moving the mounting head 7 in the Y direction by driving the X-axis motor, and by rotating the mounting head 7 in the X direction by driving the X-axis motor, and by rotating the mounting head 7 in the X-direction by the θ-axis motor. After this correction, the vertical axis motor is driven and the suction nozzle 13 descends to mount the electronic component D at a predetermined position on the printed board P. Similarly, a predetermined number of electronic components D will be mounted.

The image pickup area of the recognition camera 14 needs to be changed depending on the type of the electronic component D or the type of the positioning mark M. In this case, the other lens 23 having a different magnification is driven by the switching mechanism 21 to drive the drive motor 24 to rotate the rotary member 25 by 180 degrees.
The lens 23 is positioned immediately below the recognition camera 14, and an image is captured through this lens 23. Therefore, the imaging area can be easily changed, and various types of the electronic component D or the positioning mark M can be easily dealt with.

Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention includes various modifications described above without departing from the spirit of the invention. It is intended to cover alternatives, modifications or variations.

[0027]

As described above, according to the present invention, the recognition of the board and the position of the electronic component can be made inexpensive with one recognition camera, and the offset of the camera position can be simplified to reduce the trouble of teaching. In addition, the accuracy can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting device.

FIG. 2 is a schematic diagram showing an imaging operation of an electronic component.

FIG. 3 is a schematic diagram showing an image pickup operation of a recognition mark on a printed circuit board.

[Explanation of symbols]

1 Electronic component mounting device 7 mounting head 13 Suction nozzle 14 recognition camera 16, 17 Reflective member 19 Illumination source for component recognition transmission 20 Illumination source for component recognition reflection 21 Switching mechanism 22, 23 lens 30 Illumination source for board recognition

Claims (3)

[Claims] 1. A position of an electronic component sucked and held by a suction nozzle provided on a mounting head which is capable of recognizing the position of the substrate before mounting the electronic component on a printed circuit board and moving in a plane direction by a moving mechanism. In the electronic component mounting apparatus for recognizing the above, a recognition camera is provided so as to be movable in the plane direction together with the mounting head by the moving mechanism, and two reflecting members are provided in the apparatus body, and the recognition camera is configured to move the printed circuit board by the moving mechanism. By moving upward, the light from the illumination source for recognizing the substrate is radiated to the positioning mark attached to the substrate to image the mark, and the mounting head is moved above the one reflecting member by the moving mechanism. As a result, the transmitted image of the electronic component after irradiating the diffuser plate provided on the suction nozzle with the light from the component recognition transmission illumination source is reflected on the one side. An electronic component mounting apparatus, wherein the recognition camera takes an image from a member via the other reflecting member. 2. A position of an electronic component sucked and held by a suction nozzle provided on a mounting head which is capable of recognizing a position of the substrate before mounting the electronic component on a printed circuit board and movable in a plane direction by a moving mechanism. In the electronic component mounting apparatus for recognizing the above, a recognition camera is provided so as to be movable in the plane direction together with the mounting head by the moving mechanism, and two reflecting members are provided in the apparatus body, and the recognition camera is configured to move the printed circuit board by the moving mechanism. By moving upward, the light from the illumination source for recognizing the substrate is radiated to the positioning mark attached to the substrate to image the mark, and the mounting head is moved above the one reflecting member by the moving mechanism. As a result, the reflection image of the electronic component after irradiating the electronic component sucked and held by the suction nozzle with light from the component recognition reflection illumination source is displayed. An electronic component mounting apparatus, wherein the recognition camera takes an image from one reflecting member via the other reflecting member. 3. The electronic component mounting apparatus according to claim 1, further comprising a switching mechanism capable of switching a plurality of lenses in order to change an image pickup area by the recognition camera.