JP3054497B2 - Component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for transferring a component held by suction and automatically mounting the component at a predetermined position on a substrate.

[0002]

2. Description of the Related Art Conventionally, various types of component mounting apparatuses have been proposed which recognize the holding position and shape of a component held by suction and do not mount the component on a board with high accuracy or mount a component in which a defect is detected. I have. For example, JP-A-2-336
According to the “electronic component recognition method” of JP-A No. 70, an electronic component held by suction is irradiated with a slit light having a fixed inclination angle from obliquely below. In this state, the electronic component and the slit light are relatively moved, the slit image of the electronic component is scanned from below, and the inflection point of the slit image is recognized to grasp the shape and the holding position of the electronic component. . In addition, the slit image is similarly scanned for a lead of an IC or the like, and the floating of the lead can be detected.

[0003]

According to such a recognition method, the holding position can be grasped by recognizing the planar shape of the component, and the floating of the lead positioned in the direction orthogonal to the slit light can be detected with high accuracy. However, regarding the floating of the lead in the direction parallel to the slit light, the surface condition of the back surface of the lead affects the reflection image of the slit light, and the recognition accuracy is reduced. That is, in order to accurately detect the floating of a lead such as a QFP type IC having leads in four directions in a horizontal plane, the recognition station rotates the suction nozzle or turns the slit light source to rotate each lead in the four directions. , It is necessary to irradiate the slit light from a direction perpendicular to the slit light.

[0004]

According to the present invention, there is provided an image pickup means for picking up an image of a component held by suction from below, an illumination means surrounding the image pickup means for illuminating the component held by suction from below, A pair of slit light sources for irradiating slit light in two directions orthogonal to each other in a horizontal plane from the diagonally downward direction toward the held component, and an illumination switch and an illumination switching unit for selecting one of the illumination light from each slit light source. Install on an XY table. The XY table is moved to hold the imaging unit and each slit light source at a position corresponding to the size of the component, and the illumination switching unit is controlled, and the holding state of the component is recognized by the reflected light image of the illumination unit, and the component is recognized. (Particularly the lead shape) is recognized by the reflected light image from the pair of slit light sources. Based on the two recognition results, position correction of the XY table at the time of component shape recognition and component mounting operation are controlled.

[0005]

When the suction-held QFP type IC is transferred to the recognition station, first, the reflected light image of the whole part is taken in to recognize the holding position, and the slit light irradiation position is corrected based on the recognition result. . The slit light is applied to each of the leads projecting in four directions in the horizontal plane so as to be orthogonal to each other in the horizontal plane, and the reflected light image is captured to recognize the floating state of the component leads. Based on the two recognition results, the mounting position of the component is corrected, or the component for which the lead is detected is discarded without mounting.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the component mounting apparatus according to the present invention will be described with reference to the drawings. FIG. 1 is a schematic plan view showing a main configuration of the component mounting apparatus in the present embodiment. The component mounting apparatus 1 supplies a component to the rotary head unit 2 composed of a plurality of component mounting heads 23 provided at equal intervals on the periphery of an index table that rotates intermittently around the drive shaft 21 as a rotation center, and to the component mounting head 23. Component supply unit 3, component mounting head 23 supports XY table 4, which horizontally supports substrate P on which components are to be mounted, loader 5 which feeds substrate P to XY table 4, and substrate P from XY table 4. It comprises an unloader 6 for receiving and sending it to the next process. The component supply unit 3 includes a component mounting table 30 that horizontally moves left and right in the figure and a plurality of component supply cassettes 31 arranged and mounted thereon. And the component mounting head 2
An image pickup unit 7 that picks up and holds the components of the component supply unit 3 and captures the components from below at any one of the intermittent stop positions (hereinafter, referred to as stations) while the components are mounted on the substrate P on the XY table unit 4. Provide.

[0007] The configuration of the imaging unit 7 which is the gist of the present invention will be described in detail. 2 is a schematic front view of the imaging unit 7, and FIG. 3 is a plan view thereof.
A camera 71 arranged on a table 70, an illumination unit 72,
It comprises a shutter 73 and slit light sources 74 and 75. In this embodiment, the XY table 70 is arranged so as to position the camera 71 directly below the station C as shown in FIG. The camera 71 is fixed on the XY table 70 in a vertical posture, and a ring-shaped illumination unit 72 for illuminating the back surface of the component Q is provided around the lens at the upper end. Reference numeral 73 denotes a shutter provided directly above the illumination unit 72 for blocking or passing the irradiation light, and a pair of half-ring-shaped plate members capable of covering the illumination unit 72 is horizontally moved by a pair of forward movement mechanisms (not shown). The shutter operation is performed by moving the shutter. That is,
When blocking the irradiation light, the two plate members are brought into close contact with each other as shown in FIG. 3, and when the irradiation light is allowed to pass, the two plate members are moved away from each other as shown in FIG.

As shown in FIG. 3, the slit light sources 74 and 75 are directed toward the imaging center of the camera 71 and are orthogonal to each other in a horizontal plane.
2 and the support block 7 as shown in FIG.
It is fixed at a fixed inclination angle by 41 to 751. Each slit light is radiated obliquely upward at this inclination angle, and a shutter 74 attached to the upper end of each slit light is emitted.
With 2 to 752, each slit light is blocked or projected at a desired timing.

Reference numeral 8 denotes driving the XY table 70 to move the camera 71 directly below the station C or to move the slit light source to a position corresponding to the size of the component Q sucked and held by the component mounting head. It is a control unit. The control unit 8 includes an illumination switching control unit 81 that drives the shutter 73 and the shutter units 742 and 752 for the slit light sources.
And irradiates the component Q with any one of the illumination unit 72 and the illumination light from each of the slit light sources 74 and 75 depending on the type of image captured by the camera 71. 9
Denotes an image recognition unit for recognizing an image captured by the camera 71. The illumination unit 7 of the component Q transferred to the station C position.
2, the holding state of the component Q is recognized, and similarly, the lead shape of the component Q is recognized from the reflected light images of the slit light sources 74 and 75 of the component Q. Further, the control unit 8
Corrects the movement stop position of the XY table 70 to the XY table unit 4 based on the recognition result of the image recognition unit 9 or cancels the suction at the station I without mounting the component for which the lead float is detected. It also controls the mounting operation such as discarding.

The operation of this embodiment will be described with reference to the drawings. The control unit 8 causes the component mounting head 23 located at the station A of the rotary head unit 2 to pick up and pick up the component Q from the predetermined component supply cassette 31, and rotates the index table 22 intermittently while holding the sucked and held station. The part Q is transferred to C. Before the part Q reaches the station C, the control unit 8
0 is moved so that the camera 71 is located directly below the component mounting head 23 of the station C.

The control unit 8 instructs the illumination switching control unit 81 to first drive the slit light source shutter units 742 and 752 to interrupt the slit light irradiation of the slit light sources 74 and 75, and at the same time, a forward movement mechanism (not shown). To drive the lighting unit 7
The shutter 73 is removed from the space above (FIG. 4). Thus, only the irradiation light from the illumination unit 72 illuminates the back surface of the component Q, and the camera 71 captures the reflected light image of the component lead as shown in the upper part of FIG. The reflected light image is input to the image recognition unit 9, and the image recognition unit 9 recognizes the holding position of the component by a known method, for example, as disclosed in Japanese Patent Application Laid-Open No. 62-87989, and determines the position where the component Q should be. Is calculated. This calculation result is transmitted to the control unit 8.

Next, the control unit 8 instructs the illumination switching control unit to cancel the driving of the slit light source shutter units 742 and 752, and irradiates the slit light of the slit light sources 74 and 75 toward the component Q. At the same time, a forward movement mechanism (not shown) is driven to position the shutter 73 in the space above the illumination section 72 (FIG. 3). At this time, the control unit 8 corrects the above-described suction-held positional deviation amount so that the predetermined position on the lead back surface of the component Q is irradiated with both slit lights, and
Move 0. Thus, only the slit light from the slit light sources 74 and 75 illuminates the predetermined position of the lead, and the camera 71 captures a reflected light image of the slit light as shown in the lower part of FIG. This reflected light image is input to the image recognizing unit 9, which recognizes the position of each slit light reflected image and calculates the amount of lead floating on two sides on one side of the component Q.

Further, the control unit 8 is provided with two adjacent units shown in FIG.
After the image capturing of the lead projecting from the side is completed, the component mounting head 23 is rotated by 180 ° after correcting the above-described positional shift amount held by suction. Then, the XY table 70 is moved by moving the XY table 70 by correcting the misalignment amount held by suction similarly so that both slit lights are emitted to the predetermined positions for the leads protruding from the two sides opposite to the two sides described above. A reflected light image of light is captured. As described above, the image recognition unit 9 recognizes the position of each slit light reflection image, calculates the lead floating amount on the other two sides of the component Q, and sends the calculation results for the four sides to the control unit 8. introduce.
That is, as shown in FIG. 6, when there is a lead R2 that is raised from the normal lead R1, the slit light reflected from the lead R2 is captured as an image shifted leftward from the normal one in the figure. The displacement amount h is used as a judgment index as the lead floating amount.

The control unit 8 compares the lead floating amount h for the component Q received from the image recognizing unit 9 with the lead floating allowable amount for the component Q stored in advance and falls within the allowable range. In this case, the XY table unit 4 is moved so as to correct the positional deviation amount with respect to the holding position of the component Q received from the image recognizing unit 9 and accurately position the component Q on a predetermined position of the substrate P. And
The controller 8 lowers the component mounting head 23 onto the substrate P, releases the component Q, and mounts the component Q. If it is not within the allowable range, the component Q is transferred to the component disposal station I without moving the XY table section 4, where it is sucked and released, and the component Q is dropped into a receiving box (not shown).

In this embodiment, the case where the component Q falls within the field of view of the camera 71 has been described.
The image may be taken in such a manner that the component is rotated one by one and the part is divided into four parts.

[0016]

As described above, one work station can share the image pickup means for sequentially capturing the whole image of the component and the reflected image of the slit light. Further, since the slit light is irradiated on each of the component leads projecting in four directions at right angles in the horizontal plane, the lead floating can be detected with high accuracy. Further, a slit light source is arranged on the XY table,
In order to adjust the position of the slit light source according to the suction holding state of the parts and always irradiate the slit light to the predetermined position of the lead,
The accuracy of determination of the lead floating amount is improved.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a main configuration of a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic front view of the imaging unit according to the embodiment.

FIG. 3 is a schematic plan view of an imaging unit according to the present embodiment.

FIG. 4 is a schematic plan view showing different operation states of the imaging unit in the present embodiment.

FIG. 5 is an explanatory diagram of a component image captured by an imaging unit in the embodiment.

FIG. 6 is a side view of an essential part for explaining detection of floating of a lead in the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Rotary head part 23 Component mounting head 3 Component supply part 4 XY table part 7 Imaging unit 70 XY table 71 Camera 72 Illumination part 73 Shutter 74, 75 Slit light source 8 Control part 81 Lighting switching control part 9 Image recognition part

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/08 H05K 13/04

Claims (1)

(57) [Claims] While transferring a component held by suction and mounting it at a predetermined position on a substrate, the shape and the holding state of the component are image-recognized and a mounting operation is controlled based on the recognition result. Component mounting equipment. Imaging means for imaging the suction-held component from below. Illuminating means for illuminating the suction-held component from below, around the imaging means; 2 which is orthogonal to the suction-held component in the horizontal plane
A pair of slit light sources for irradiating the slit light in the diagonal direction from below, and an illumination switching unit for selecting one of the irradiation light emitted from the illumination unit and the illumination light emitted from the pair of slit light sources. The imaging unit, the illumination unit, the slit light source,
An XY table for arranging the illumination switching means at a predetermined position thereof and horizontally moving them. Image recognition means for recognizing a holding state of the component by a reflected light image by the lighting means and recognizing a shape of the component by a reflected light image by the pair of slit light sources. The XY table is moved to hold the image pickup means and the slit light source at a position corresponding to the size of the component, control the illumination switching means, and correct the position of the XY table based on the recognition result of the image recognition means. And control means for controlling the mounting operation of components.