JPH0685494A - Detecting method for lead floating of component and component mounting device using same - Google Patents

Abstract

PURPOSE:To provide a component mounting device which precisely detects the floating of a component lead and feeds it back to a part mounting operation. CONSTITUTION:A dummy component jig S possessed of comb-toothed horizontal projections is prepared, a horizontal reference reflecting plate 24 is provided above the tip of a suction nozzle by a certain distance, the dummy component jig S is held by sucking, and the comb-toothed horizontal projections are irradiated with slit light rays from below at an angle. Slit light images RO and RS reflected from the comb- toothed horizontal projections of the dummy component jig S and the horizontal reference reflecting plate 24 located behind the dummy component jig S are recognized, and an irradiation angle theta of slit light is obtained based upon a horizontal space X between the two reflected images RO and RS and an already-known vertical space between the horizontal projections and the reference reflecting plate 24. At sucking a component, slit light reflected images from a component lead and the horizontal reference reflecting plate 24 are recognized, the height of the component lead is calculate based upon the horizontal space between the reflected images and an irradiation angle, the height of the lead is compared with a prescribed distance by which the lead of component is located separate from the reference reflecting plate, whereby it is detected that a lead is floating or not.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting lead floating of a component held by suction and a component mounting apparatus for transferring the component held by suction and automatically mounting it on a predetermined position on a substrate.

[0002]

2. Description of the Related Art Conventionally, various methods have been proposed as a method for inspecting the leads of a suction-held component and mounting them on a substrate. Japanese Patent Laid-Open No. 1-320 listed as an example.
In Japanese Patent No. 000, a camera for picking up an image of a component gripped by a robot from below and a laser slit light source having a certain angle with respect to the optical axis of the camera are provided, and laser slit light is projected onto a component lead. A device for visually recognizing a positional deviation of reflected light from a normal lead and a raised lead is disclosed. As a result of the recognition inspection, this device mounts only non-defective parts on the board.

[0003]

In such a lead inspection method, in order to maintain the irradiation angle of the slit light at a predetermined angle, it is necessary to accurately adjust or position and fix the laser slit light source. That is, in order to position the optical axis of the laser slit light source at a predetermined angle with respect to the optical axis of the camera, it is necessary to process and assemble a stand, a holder or the like that supports them with appropriate mechanical accuracy. However, there is a limit even if the mechanical accuracy is increased, and it is unavoidable that a certain machining / assembly error occurs. In consideration of this point, the present invention provides a method for easily measuring the irradiation angle of the slit light in an actually assembled state, and even if there is a processing / assembling error of the above-mentioned optical component support tool, the accuracy is improved. The purpose is to detect well the lead floating of parts.

[0004]

SUMMARY OF THE INVENTION According to the present invention, a pseudo component jig is a rectangular plate material, and has a comb-shaped horizontal projection portion, which is spaced a certain height downward from the upper surface of the plate material, on at least one side surface thereof. Then, a horizontal reference surface is provided a certain distance above the component suction surface of the suction nozzle, and the pseudo component jig is suction-held on the component suction surface. Irradiate. Recognizing the slit light image reflected from the horizontal projection of the dummy part jig and the reference surface behind it, calculate the horizontal distance between both slit light reflection images, and calculate the distance and the known horizontal projection. The irradiation angle of the slit light is obtained from the vertical distance between the part and the reference plane. When picking up a component, the lead of the held component is irradiated with slit light having the calculated irradiation angle, and the slit light image reflected from the lead of the component and the reference surface behind it is recognized, and both slit light reflection images are detected. The lead height from the reference surface is calculated from the horizontal interval and the irradiation angle.
Lead lift-off is detected by comparing the calculated lead height from the reference surface with a predetermined calculated distance from the reference surface at which the lead of the component should be located. Further, this lead floating detection method is used in a component mounting apparatus to recognize the lead floating of the component while the sucked and held component is transferred and mounted at a predetermined position on the substrate, and the mounting operation is controlled based on the recognition result.

[0005]

In the state where the image pickup unit and the slit light source are assembled to the component mounting device or the like, the irradiation angle of the slit light with respect to the image pickup center of the camera is measured. The lead angle of the component is detected using the measured irradiation angle. The component for which lead floating is detected is not mounted on the substrate.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a lead floating detection method and a component mounting apparatus using the same according to the present invention will be described with reference to the drawings. FIG. 1 is a schematic plan view showing the main configuration of the component mounting apparatus in this embodiment. The component mounting apparatus 1 includes a rotary head unit 2 configured by disposing a plurality of component mounting heads 23 at equal intervals on the periphery of an index table that rotates intermittently around a drive shaft 21, and components to the component mounting head 23. Component supply unit 3 for supplying, component mounting head 2
3 comprises an XY table portion 4 for supporting a substrate P on which components are to be mounted horizontally, a loader 5 for feeding the substrate P to the XY table portion 4, and an unloader 6 for receiving the substrate P from the XY table portion 4 and sending it to the next step. Has been done. The component supply unit 3 is a component mounting table 3 that horizontally moves in the figure.
0, and a plurality of component supply cassettes 31 arranged and mounted on this. Then, the component mounting head 23 suction-holds the component of the component supply unit 3 and picks up the component from below at any intermittent stop position (hereinafter referred to as a station) while mounting the component on the substrate P on the XY table unit 4. The image pickup unit 7 is provided.

Here, the lead floating detection portion, which is the gist of the present invention, will be described in detail. FIG. 2 is a schematic explanatory diagram showing a slit light imaging state of the image pickup unit 7.
Comprises a camera 71 and a slit light source 72 arranged on the XY table 70. In this embodiment, the XY table 70 is arranged to position the camera 71 under the component mounting head 23 that has arrived at the station C, and its X axis is aligned with the diameter direction of the index table 22, as shown in FIG. . The camera 71 is fixed on the XY table 70 in a vertical posture, and the slit light source 72 is fixed by being tilted by a support block 73 toward the imaging center of the camera 71 as illustrated. The slit light is emitted obliquely upward at this inclination angle. Reference numeral 24 is a reference reflection plate that is detachably attached at a certain distance above the tip of the suction nozzle of the component mounting head 23, and its reflection surface is horizontal. 8 is X
A control unit that drives the Y table 70 to move the camera 71 and the slit light source 72 to a position corresponding to the size of the component Q that is sucked and held by the component mounting head in the station C. Reference numeral 9 denotes an image captured by the camera 71. An image recognition unit for recognizing. Further, the control unit 8 controls the mounting operation based on the recognition result of the image recognition unit 9 such as releasing the suction at the station I and discarding the component without mounting the component in which lead floating is detected. .

FIG. 3 is a front view of a main portion for explaining the irradiation angle measurement of slit light. S is a pseudo component jig for measuring how much the slit light emitted from the slit light source 72 is actually inclined with respect to the imaging center of the camera 71, and FIG. 4 is a plan view thereof. Is. The pseudo component jig S of the present embodiment has comb-teeth-shaped horizontal protrusions that extend horizontally from the four side surfaces of the rectangular plate member, and the lower surface of the horizontal protrusion and the upper surface of the plate member are parallel and The distance between the two is measured and known.

The operation of this embodiment will be described with reference to the drawings. After the horizontal reference reflection plates 24 are mounted above the component suction surface of the component mounting head 23 by a predetermined distance, the control unit 8
Causes the component mounting head 23 located at the station A of the rotary head unit 2 to adsorb and pick up the pseudo component jig S from the component supply cassette 31 in which the pseudo component jig S is loaded. Then, the control unit 8 intermittently rotates the index table 22 and transfers the component mounting head 23 to the station C. Before the pseudo component jig S reaches the station C, the control unit 8 sets the XY table 70
Is moved so that the camera 71 is located at the slit light imaging position below the component mounting head 23 located at the station C. FIG. 5 shows the slit light imaging state of the camera 71. When the slit light source 72 irradiates the slit light obliquely from below, the camera 71 captures the reflected light image of the slit light as shown in FIG. Rs is a slit light reflection image group reflected from the reference reflection plate 24,
R0 is a slit light reflection image group reflected from the comb-teeth-shaped protrusions of the pseudo component jig S, and these are input to the image recognition unit 9.

The image recognizing section 9 finds the center of gravity of each slit light reflection image that has been input, and of these barycentric position data, the average of the X-direction coordinate values for the image group Rs and the X for the image group R0. Calculate the average of the directional coordinate values. Then, the difference between the average values of the X-direction coordinates of the image groups Rs and R0 is set as the reference displacement x, and the distance previously input to itself from the component suction surface of the component mounting head 23 to the reflection surface of the reference reflection plate 24, The irradiation angle of the slit light is calculated by the reference interval h, which is the sum of the distance from the upper surface of the pseudo component jig S to the lower surface of the comb-shaped horizontal protrusion. That is, as shown in FIG. 3, the irradiation angle θ of the slit light is

Tan θ = h / x

There is a relation of (2) and the irradiation angle θ can be obtained, and the calculated value is stored in the image recognition section 9.

After the irradiation angle θ of the slit light is calculated in this way, the control unit 8 sucks the component Q from the component supply cassette 31 of the component supply unit and picks it up, and intermittently rotates the index table 22 while holding it by suction. And transfers the component Q to the station C. The camera 71 captures the slit light reflection image group R0 reflected from the reference reflection plate 24 and the slit light reflection image group Rn reflected from the component lead as in the case of the pseudo component jig S. Image recognition unit 9
Calculates the center of gravity of each of the input slit light reflection images, and calculates the average of the X-direction coordinate values for the image group Rs among the center of gravity position data. The difference between this average value and the coordinate value in the X direction of the individual center-of-gravity position data in the image group Rn is obtained, and from the relationship with the calculated irradiation angle θ,
It is calculated how far the leads of the component Q are from the reflecting surface of the reference reflecting plate 24. The image recognition unit 9 compares with the specified distance that the lead of the component Q should be located from the reference reflector 24, which is input in advance, and determines that the lead is floating when it is not within the allowable range.

Further, the control unit 8 rotates the component mounting head 23 by 90 ° after the image of the lead projecting from one side of the component Q is finished, and the image recognition unit 9 causes the individual slit light beams to rotate in the same manner as described above. Recognizing the position of the reflection image,
The lead floating amount on the four sides is detected and the detection result is transmitted to the control unit 8.

Based on the lead floating detection information relating to the component Q received from the image recognition means 9, the control unit 8 moves the XY table unit 4 at the station F to move the component mounting head 23 to the substrate when the lead floating does not occur. It is lowered to a predetermined position on P and the suction of the component Q is released and the component Q is mounted. When the lead floats, the component Q is transferred to the component disposal station I without moving the XY table unit 4, where it is sucked and released and the component Q is dropped into a receiving box (not shown).

In the pseudo component jig in this embodiment, all the comb-teeth-shaped horizontal projections are at the same level from the reference surface (the upper surface of the rectangular plate material) that is suction-held by the suction nozzles. The object of the present invention can be achieved by providing a certain level difference in the distance between the horizontal protrusions and the reference surface and providing a step between the horizontal protrusions. Also. In the present embodiment, the example in which the lead floating detection method is applied to the rotary head type component mounting apparatus has been described. However, even in the component mounting apparatus of the type in which the component mounting head 23 moves in XY, it is easy to set the image pickup unit as a fixed position. Is applicable to.

[0017]

As described above, it is possible to easily measure the irradiation angle of slit light with the lead floating detection portion assembled to the component mounting device and the like. Even if there is a processing / assembly error, it is possible to detect lead floating of parts with high accuracy. Further, since the above-mentioned assembly and adjustment work of the optical component support tool can be performed while measuring the irradiation angle of the slit light, there is an effect that the desired angle can be efficiently adjusted.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing a main configuration of a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic front view of an image pickup unit in the present embodiment.

FIG. 3 is a front view of relevant parts for explaining an irradiation angle calculation method according to the present embodiment.

FIG. 4 is a plan view of a pseudo component jig according to the present embodiment.

FIG. 5 is an explanatory diagram of a slit light reflection image captured by an image pickup unit in the present embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component mounting device 2 Rotary head part 23 Component mounting head 24 Reference reflector 3 Component supply part 4 XY table part 7 Imaging unit 70 XY table 71 Camera 72 Slit light source 8 Control part 9 Image recognition part Q Component S Pseudo component jig

Claims (2)

[Claims] 1. A method of irradiating a lead of a component sucked and held by a suction nozzle with slit light, capturing a reflection image of the slit light to detect floating of the lead, and at least one side surface of a rectangular plate material. In, a pseudo component jig having a comb-teeth-shaped horizontal projection portion which is separated from the upper surface of the plate member by a certain height downward, and a horizontal reference surface is provided at a certain distance above the component suction surface of the suction nozzle. The pseudo component jig is sucked and held on the component suction surface, and the slit light is radiated obliquely from below toward the horizontal projection portion of the pseudo component jig. From the horizontal projection portion of the pseudo component jig and the reference surface behind it. Recognizing the reflected slit light image, calculates the horizontal distance between both slit light reflection images, the vertical distance between the known horizontal projection and the reference plane, and the calculated both slit light Distance between reflected images Calculate the irradiation angle of the slit light, and when the component is picked up, the slit light having the calculated irradiation angle is irradiated to the lead of the held component by suction and reflected from the lead of the part and the reference surface behind it. The slit light image is recognized, and the lead height from the reference plane is calculated based on the horizontal distance between both slit light reflection images and the irradiation angle, and the calculated lead height from the reference plane is calculated in advance. A lead floating detection method for a component, which comprises detecting a lead floating by comparing a lead distance of the component located from the reference surface with a specified distance. 2. A component mounting apparatus for recognizing an image of a lead of a component while transferring the suction-held component and mounting it at a predetermined position on a substrate, and controlling the mounting operation based on the recognition result. A component mounting apparatus characterized by using the lead floating detection method for a component according to claim 1.