JPH08162799A - Electronic part mounter - Google Patents

Abstract

PURPOSE: To stabilize the place of the vacuum-clamping of an electronic part by deciding the exchange of a cassette, in which the electronic part is stored, and changing correction when the difference sections of the quantities of a suction nozzle and the electronic part displaced for a first period and a second period reach a fixed value or more. CONSTITUTION: A suction nozzle 5 clamps an electronic part 4a stored in a supply cassette in a vacuum. The state of the clamping of the electronic part 4a is imaged by a camera 14, image data are processed, and the difference section (a difference section) of the coordinates of the center of the electronic part 4a and the coordinates of the center of the suction nozzle 5 is computer. The mean value of the difference section up to that time as the mean for a long term and the mean value of the difference section up to that time as the mean in a short period are computed. When the difference section of the mean for the prolonged term and the means in the short period is larger than a fixed value, the exchange of the supply cassette is decided, and the place of the suction of the electronic part 4a is corrected by using the means in the short period. When the difference section of the mean for the long term and the mean in the short period reaches the fixed value or less, the place of the clamping of the electronic part 4a is corrected by employing the mean for the long term.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine for mounting an electronic component at a predetermined position on a printed board, and more particularly to an electronic component mounting machine for appropriately correcting a suction position of an electronic component by a suction nozzle or the like. Regarding

[0002]

2. Description of the Related Art In automatic assembly of a printed board, an electronic component mounter is used to mount (place) electronic components such as IC devices, minute capacitors, and resistors at predetermined positions on the printed board. . The electronic component mounting machine, for example, sucks the electronic component placed in the electronic component storage, and moves to a predetermined position of the printed board on which the electronic component should be mounted,
The electronic component is placed at the predetermined position.
In order to mount the electronic parts accurately in the specified position of the printed board, it is necessary to identify the exact position of the printed board, and in order to mount the electronic part in the specified position including the direction, the suction state of the electronic parts must be identified. I have to. Regarding the latter, for example, in the case of an IC device, if there is a suction position shift or an angle shift, it will not be correctly placed on the land of the printed board and soldering failure will occur. Therefore, the suction state is imaged using a camera or the like. The pickup position or the pickup angle of the electronic component is corrected using the image pickup result, and then the electronic component is mounted on the printed board.

That is, when the suction position of the electronic component is not corrected, the position of the electronic component is biased by the movement of the depth cabinet 130, and the tape cabinet is moved from the direction of the arrow 133 as shown in FIG. 1
In both the case where the tape cabinet 130 is moved and the case where the tape cabinet 130 is moved from the direction of the arrow 134 as shown in FIG.
The suction positions 135 and 136 of the suction nozzle 5 may not be located at the center of the electronic component 4a in both the longitudinal direction and the moving direction. In this case, if the suction position of the electronic component is corrected, as shown in FIG.
In the longitudinal direction of the tape cabinet 130, the suction position of the suction nozzle 5 and the center of the electronic component 4a can be aligned with the suction positions 137 and 138.

In the conventional electronic component mounting machine, when a component or a component supply set is supplied to the mounting machine, the suction position or the suction angle of the electronic component is corrected for each of these supply positions. Further, in the conventional electronic component mounting machine, when correcting the suction position or the suction angle of the electronic component, the correction amount defined by the difference between the center (center) of the suction component and the nozzle center (center) The average is decided for a certain period of.

[0005]

However, in the above-described conventional electronic component mounting machine, when a plurality of components housed in the same supply cassette are sucked while moving the cassette during the operation, the electronic component mounting machine shown in FIG. As shown in (B), there is a problem that it is not possible to appropriately correct the deviation of the component position in the moving direction of the tape cabinet 130.
Further, in the above-described conventional electronic component mounting machine, if the period of the past correction amount that is the target of the averaging described above is short, the influence of variations in the past correction amounts on the correction amount calculated this time becomes large. Therefore, for example, when a suction error or the like occurs, the supply cassette is moved in a direction different from the normal direction to recover the error, but there is a problem that the correction position at this time tends to be inappropriate. On the other hand, if the past correction amount period that is the target of averaging is long,
When the cassette is replaced, it takes time to appropriately perform the correction according to the change in the suction component center position due to the cassette replacement, and during that time, there is a problem that the processing must be performed at a low suction rate.

An object of the present invention is to solve the above-mentioned problems and to provide an electronic component mounting machine capable of stably sucking an electronic component sucked by a suction nozzle.

[0007]

In order to achieve the above object, the electronic component mounting machine of the present invention is provided with a suction nozzle extending in the longitudinal direction for sucking an electronic component at its tip, and an optical nozzle for the electronic component. A light irradiating unit for irradiating the electronic component, an imaging unit for capturing an image of the electronic component adsorbed at the tip of the suction nozzle from a direction facing the light irradiating unit with the electronic component interposed therebetween, and a cassette accommodating the plurality of electronic components. And a correction unit that corrects the position of the suction nozzle by switching and using the history of the shift between the suction nozzle and the electronic component within a plurality of different predetermined periods based on the time of replacement.

Further, in the electronic component mounting machine of the present invention, preferably, the correction means calculates an average of deviation histories within a predetermined period between the position of the suction nozzle and the position of the electronic component, The position of the suction nozzle is corrected based on the average of the calculated shift history.

Further, in the electronic component mounting machine of the present invention, preferably, the correction means performs the correction for each step of the numerical control data.

Also, in the electronic component mounting machine of the present invention, preferably, the shift history is switched between the suction nozzles and the electronic components within the plurality of different predetermined periods. Is automatically performed when the difference of is equal to or more than a predetermined value.

Further, in the electronic component mounting machine of the present invention, preferably, the plurality of predetermined periods are the first period and the first period.
Is a second period shorter than the period, and the correction means performs the correction by using the history of the deviation of the second period within a certain period from the time of exchanging the cassette, and The correction is performed by using the history of the shift of the first period after the elapse of a certain period until the next cassette replacement.

[0012]

According to the electronic component mounting machine of the present invention, the electronic components are
The tip of the suction nozzle is sucked and gripped by, for example, a vacuum suction method. Then, the light emitted from the light emitting means is emitted to the electronic component, and the electronic component adsorbed to the tip of the suction nozzle from the direction facing the light emitting means with the electronic component sandwiched is imaged by the image capturing means. . At this time, the correction unit corrects the position of the suction nozzle, for example, using the history of the shift of the first period. After that, by the correction means, for example, the amount of deviation between the suction nozzle and the electronic component in the first period, and the amount of deviation between the suction nozzle and the electronic component in the second period. When the difference between the two is greater than or equal to a predetermined value, it is determined that the cassette containing the electronic component has been replaced. When the correction unit determines that the cassette has been replaced, the correction of the position of the suction nozzle by the correction unit is performed using the shift history of the second period shorter than the first period.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a perspective view of the entire electronic component mounting machine of an embodiment of the present invention, FIG. 2 shows a partially enlarged view of FIG. 1, and FIG. 3 shows a partially enlarged view of FIG. In FIG. 1, the electronic component mounting machine of this embodiment includes an X-axis moving mechanism 24 and Y-axis moving mechanisms 20 and 22. The electronic component mounting mechanism 1 is mounted on the X-axis moving mechanism 24, and is moved in the X-axis direction of the X-axis moving mechanism 24. The X-axis moving mechanism 24 is the Y-axis moving mechanism 2.
It is moved in the Y-axis direction along 0 and 22.

In FIG. 2, the electronic component mounting mechanism 1 includes:
The fixed mirror 2, the movable mirror 3, the half mirror block 8, the rotating mechanism 7a, the lifting mechanism 7b, the cameras 14, 15 and 16, and the movable mirror moving mechanism 9 for moving the movable mirror 3 in the horizontal direction H are mounted. As shown in FIG. 5A, the half mirror block 8 has a half mirror 30.
32 are arranged. These half mirrors 30-
32 transmits the image from the fixed mirror 2 to the cameras 14-16 above it. The cameras 14 to 16 have different magnifications, and are set to appropriate magnifications for image recognition of the suction state according to the size of the electronic component sucked by the suction nozzle 4.

In FIG. 3, a rotating unit 11 is attached to the lower portion of the rotating mechanism 7a, and the rotating unit 11 is rotated by the rotating mechanism 7a. A light emitting box 10 serving as a light irradiating means is fixedly provided below the rotating mechanism 7a, and the rotating portion 11 penetrates the light emitting box 10. The suction nozzle 5 is attached to the rotating portion 11 at the tip located below the light emitting box 10. A semitransparent plate 6 including a transparent plate 6a and a semitransparent plate 6b is fixedly attached to the suction nozzle 5 by the transparent plate 6a.

The light emitting box 10 includes light sources 10a and 10b.
Is a cylindrical container in which is provided. Light sources 10a, 10
For example, an emitting diode is used as b.
The bottom surface 10d of the light emitting box 10 is formed of a light-shielding member. For example, a light is emitted from the light sources 10a and 10d through the circular opening 10c formed in the bottom surface 10d to a region including the electronic component 4a. The light is emitted in parallel from the side opposite to 14 along the optical axis of the camera 14.

The semitransparent plate 6 includes a transparent plate 6a and a semitransparent thin plate 6
and b are bonded together. A transparent member is used as the transparent plate 6a, and for example, a transparent resin such as an acrylic resin is used. The transparent plate 6a is fixed in contact with the suction nozzle 5, has a smaller diameter than the semitransparent thin plate 6b, and has a predetermined thickness in the direction of contact with the suction nozzle 5.

A translucent member is used as the translucent thin plate 6b. For example, a milky white resin such as polyacetal known as Delrin (trade name, American EI du Pont de Nemours & Co. Inc) is used. Used. The semi-transparent thin plate 6b includes a movable mirror 3, a fixed mirror 2,
When the image of the large electronic component 4a is picked up by the camera 14 through the half mirror 30, the image of the electronic component 4a is displayed inside the background image by the light from the semitransparent plate 6,
It is formed in a circular shape having an area larger than that of the electronic component 4a.

The semitransparent plate 6 is semitransparent to the light from the light sources 10a and 10b when the image of the electronic component 4 is picked up by the camera 14 or the like via the movable mirror 3, the fixed mirror 2 and the half mirror 30. By uniformly irradiating the electronic component 4 from the position facing the tip of the suction nozzle 5 that has sucked the electronic component 4a via the plate 6, the background brightness of the image of the electronic component 4 is increased, and further, the camera 14 It is used to prevent an image of an object existing in the background of the electronic component 4a from being displayed in the image pickup.

FIG. 4A is a schematic external view of the electronic component mounting machine 1, and FIG. 4B is a diagram for explaining the equipment of the electronic component mounting machine 1. In FIG. 4B, 100 is a cassette that stores components, 101 is a rear-side component supply unit, 102 is a cutter unit, 103 is a substrate transfer unit, 104 is an operation panel, 10
Reference numeral 5 is a tool change unit, 106 is a stick cassette supply unit, 107 is a nozzle change unit, 108 is a tray supply unit (S axis), and 109 is a tray supply unit (V axis).

Hereinafter, FIGS. 1, 2, 3 and 5 (A) to (C)
The operation of the electronic component mounting machine of this embodiment for identifying and verifying the suction state of electronic components will be described with reference to FIG.
5A to 5C show the electronic component 4a on the printed circuit board 28.
It shows an example of mounting on. The suction nozzle 5 is an electronic component 4
When mounting a, the X-axis moving mechanism 24 is first positioned in the Y-axis direction by the Y-axis moving mechanisms 20 and 22, and then the electronic component mounting mechanism 1 is moved by the X-axis moving mechanism 24 to the X-axis.
Is positioned in the direction. As a result, the suction nozzle 5 mounted on the electronic component mounting mechanism 1 is positioned in the X and Y directions of the electronic component storage 26 where the electronic components to be mounted are placed. When the positioning is performed in the X and Y directions, as shown in FIG. 5 (A), the lifting mechanism 7b lowers the rotating mechanism 7a and the rotating portion 11, and the suction nozzle 5 attached to the tip of the rotating portion 11 is electronically moved. The parts are lowered to the parts position in the parts storage 26, and the electronic parts 4a are vacuum-sucked. When the suction nozzle 5 sucks the electronic component 4a, the suction nozzle 5 is moved to the mounting position of the printed circuit board 28 by the movement of the electronic component mounting mechanism 1 in the X direction and the movement of the X axis moving mechanism 24 in the Y direction.

When the electronic component 4a is vacuum-sucked by the suction nozzle 5, FIG.
As shown in FIG. 5, the movable mirror 3 is moved rightward in the figure by the movable mirror moving mechanism 9 while the suction nozzle 5 is raised by the height H1 by the elevating mechanism 7b. The movement of the movable mirror 3 is performed so as not to collide with the sucked electronic component 4a. This rise of the suction nozzle 5 causes the sucked electronic component 4a to move to the half mirror 30, as shown in FIG.
The determination is made by recognizing the electronic component 4a via the camera 14. That is, the raising of the suction nozzle 5 that has sucked the electronic component 4a is performed by the elevating mechanism 7b from a state where it is not recognized by the camera 14 to a state where it is recognized. At this raised position, the suction state of the electronic component 4a in the horizontal direction is identified, that is, the suction state of the electronic component 4a viewed from the horizontal direction is identified by an image processing unit (not shown) based on the image data from the camera 14. .

When the suction state of the electronic component 4a from the horizontal direction is further raised to a position where it can be sufficiently recognized, the raising is stopped. When the suction nozzle 5 stops rising, the camera 14 identifies the accurate suction state of the electronic component 4a by the half mirror 30 and the camera 14. In this case, the component suction state is identified by the optical system of the movable mirror 3, the fixed mirror 2, the half mirror 30, and the camera 14.

Identification by the optical system is performed by referring to FIGS.
As shown in (B), the semitransparent plate 6 is irradiated with the light from the light sources 10 a and 10 b provided in the light emitting box 10 through the opening 10 c of the light emitting box 10. Light sources 10a, 10
Among the light radiated from b to the semitransparent plate 6, the light radiated to the transparent plate 6a is the transparent plate 6a and the semitransparent thin plate 6b, and the light radiated to the semitransparent thin plate 6b is only the semitransparent thin plate 6b. Is transmitted to the electronic component 4 as background light. Since the transparent plate 6a is formed using a transparent member as described above, the light emitted to the transparent plate 6a is
The electronic component 4 is transmitted as a background light through the semitransparent thin plate 6b below the transparent plate 6a with almost no reduction in its brightness.
Is irradiated almost uniformly. Therefore, the background image 51 due to the light transmitted through the transparent plate 6a and the semitransparent thin plate 6b and the background image 50 due to the light transmitted only through the semitransparent thin plate 6b are projected in the imaging region 53 shown in FIG. 6A. It has almost the same brightness. An image 52 by the suction nozzle 5 is projected inside the background image 51 in FIG.

When the image shown in FIG. 6A is binarized, the result shown in FIG.
As in (B), the background images 50 and 51 are not identified as shadows, and only the image 52 by the suction nozzle 5 is identified as a shadow 52a and is projected on the image. The camera 1 is shown in FIG.
4B shows an image of the image of the electronic component 4 captured by FIG.
An image obtained by binarizing the image shown in FIG. As shown in FIG. 7A, in the image pickup area 53 of the camera in the state where the suction nozzle 5 has sucked the electronic component 4a,
The image 54 of the electronic component 4a and the background images 50 and 51 described above are displayed. As described above, when the image of the camera 14 is binarized, the background image 51 due to the light transmitted through the transparent plate 6a is not identified as a shadow, so the image of the camera 14 shown in FIG. Then, as shown in FIG. 7B, only the shadow 54a of the electronic component 4 is identified as a shadow, and the entire shape of the shadow 54a of the electronic component 4 is accurately projected. Then, based on the shadow 54a of the electronic component 4, the suction state of the electronic component 4 by the suction nozzle 5 is identified and verified. When the verification of the component suction state is completed, the movable mirror 3 is moved back to the original position indicated by the broken line by the movable mirror moving mechanism 9.

As described above, the lifting of the suction nozzle 5, the movement of the movable mirror 3, and the identification of the suction state of the electronic component 4a are performed by the suction nozzle 5 sucking the electronic component 4a.
In the X direction and in the Y direction of the X-axis moving mechanism 24 while the print board 28 is moved to the mounting position. When the suction nozzle 5 sucking the electronic component 4a is lowered to the upper position of the mounting position of the printed circuit board 28, the electronic component 4a is moved to the printed circuit board 2 as shown in FIG. 5C.
8 is mounted at the mounting position. That is, the suction nozzle 5 is moved up and down by the elevating mechanism 7b and the electronic component 4a is moved to the printed board
8 is lowered until it abuts the mounting position of the electronic component 4
Release the adsorption of a. As a result, the electronic component 4a is mounted at a predetermined position on the printed board 28. When the electronic component 4a is mounted on the printed board 28, the suction nozzle 5 is raised by the elevating mechanism 7b, and the electronic component mounting mechanism 1 and the X-axis moving mechanism 24 are driven again to move the suction nozzle 5 to the electronic component storage space 26. Move to.

The image processing unit for controlling the above operation and identifying the component suction state is realized by, for example, a microcomputer. That is, position control of the X-axis moving mechanism 24, Y
Position control of the axis movement mechanisms 20, 22, elevation control of the elevation mechanism 7b, rotation control of the rotation mechanism 7a, suction control of the suction nozzle 5, movement control of the movable mirror movement mechanism 9, component rising position detection, electronic component suction state. The microcomputer performs identification and rotational position adjustment of electronic components, which is performed as necessary.

As described above, in the electronic component mounting machine of the present embodiment, the transparent plate 6a of the semitransparent plate 6 is made of a transparent material, so that the brightness of the background light of the electronic component 4 can be made uniform. . Therefore, the cameras 14, 15 and 16 can accurately capture the entire image of the electronic component 4, and can accurately detect the suction state of the electronic component 4.

Next, the operation of the electronic component mounting machine 1 of this embodiment for correcting the suction position of an electronic component will be described. FIG. 8 is a flowchart of the operation when the suction position of an electronic component is corrected. The process of correcting the suction position shown in FIG. 8 is performed by using a macro computer or the like based on the position information from the X-axis moving mechanism 24 and the Y-axis moving mechanisms 22 and 20, the image information from the image processing unit, and the like. Done.

Step S1: XY coordinates (Xn, Yn) of the center of the electronic component 4a shown in FIGS. 3 and 5 are detected.

Step S2: X- at the center of the suction nozzle 5
The Y coordinate (XN, YN) is detected, and the coordinate (Xn, Yn) and the coordinate (XN, YN) detected in step S1.
And the differences ΔXn and ΔYn are calculated. At this time, the differences ΔXn and ΔYn are defined by the following equations (1) and (2), respectively.

[0032]

[Equation 1]

[0033]

[Equation 2]

Step S3: As the long-term average, averages XL_ and YL_ of the differences ΔXn and ΔYn in the past a times are calculated. At this time, XL_ and YL_ are defined by the following equations (3) and (4), respectively.

[0035]

(Equation 3)

[0036]

[Equation 4]

As a short-term average, the difference b in the past b times
Calculate the average XS and YS of Xn and ΔYn. At this time, XS and YS are respectively defined by the following equations (5) and (6).

[0038]

(Equation 5)

[0039]

(Equation 6)

The following equation (7) is satisfied between a and b.

(Equation 7)

In step S3, the differences ΔXn, ΔY
When calculating the long-term average and the short-term average of n, the data for calculating the average is not for each cassette but for each step of NC data.

Step S4: Average XL_, YL_, XS of the differences ΔXn, ΔYn calculated in step S3.
If the relationship of the following formula (8) or (9) is established for ￣ and YS￣, the process of step S5 is performed, and if not, the process of step S6 is performed.

[0043]

(Equation 8)

[0044]

[Equation 9]

Here, C is a predetermined constant value.

Step S5: The suction position of the electronic component 4a is corrected by the coordinates (XS, YS). That is, when the difference between the long-term average and the short-term average of the differences ΔXn and ΔYn is larger than the constant value C, it is determined that the cassette that houses the electronic component 4a has been replaced, and the short-term average XS−Y
Using S-, the suction position of the electronic component 4a is corrected.
FIG. 10A is a diagram for explaining a short-term average and a long-term average of the differences ΔXn and ΔYn. As shown in FIG. 10A, when the cassette is replaced, the position 122 of the electronic component 4a and the position 121 of the suction nozzle 5 when correction is performed using the long-term average for a while thereafter. The difference is larger than the difference between the position 122 of the electronic component 4a and the position 120 of the suction nozzle 5 when the correction is performed using the short-term average. Therefore, the correction position 1 shown in FIG.
As shown in 23, by correcting the position of the suction nozzle 5 using the short-term average for a while after the cassette exchange is performed, the correction can be optimized. After that, when the difference between the long-term average and the short-term average becomes equal to or smaller than the constant value C, the process of step S4 is performed after the process of step S4.

Step S6: The suction position of the electronic component 4a is corrected by the coordinates (XL-, YL-). That is, when the difference between the long-term average and the short-term average of the differences ΔXn and ΔYn is smaller than the constant value C, the long-term averages XL_ and YL_ are set in order to reduce the influence of variations in individual difference data. Then, the suction position of the electronic component 4a is corrected. That is, as shown in FIG. 10 (A), when a certain period of time has passed since the previous cassette exchange was performed, the electronic component 4a
Position 122 and the position 121 of the suction nozzle 5 when the correction is performed using the long-term average, the difference between the position 122 of the electronic component 4a and the position 120 of the suction nozzle 5 when the correction is performed using the short-term average. It is smaller than the difference between and. Therefore, as in the correction position 123 shown in FIG. 10B, after the previous cassette exchange is performed and a certain period of time has elapsed, the position of the suction nozzle 5 is corrected by using the long-term average to optimize the correction. can do.

As described above, steps S1 to S1 shown in FIG.
By correcting the suction position of the electronic component based on 6,
When the cassette moves, the minute positional deviation of the electronic component 4a in the tape cavity can be appropriately corrected. Therefore, the suction of the electronic component 4a by the suction nozzle 5 can be performed stably. For example, the case where the tape cabinet 130 is moved from the direction of the arrow 133 as shown in FIG. 11A and the case where the tape cabinet 130 is moved from the direction of the arrow 134 as shown in FIG. 11B. In each case, the suction position 131 of the suction nozzle 5,
142 can be the center of the electronic component 4a.

Further, as described above, by correcting the suction position of the electronic component based on steps S1 to 6 shown in FIG. 8, it is possible to quickly cope with a rapid change in the component supply position due to the cassette replacement. Therefore, it is possible to reduce the number of electronic components to be discarded due to a suction error by the suction nozzle 5.

The invention is not limited to the embodiments described above. For example, in the above-described embodiment, the case where the electronic component 4 is vacuum-adsorbed has been illustrated, but the same applies to the case where the electronic component 4 is magnetically adsorbed or mechanically gripped. Therefore, in the present invention, the attraction includes not only vacuum attraction and magnetic attraction but also grasping and the like. Further, the shape of the semitransparent thin plate 6b of the semitransparent plate 6 is not limited to the circular shape described above as long as the image of the electronic component is projected inside the background image by the light from the semitransparent plate 6. .

Further, in the above-mentioned embodiment, the electronic component mounting machine 1 provided with the mechanism for moving along the X-Y axis has been illustrated, but the present invention is, for example, a rotary which rotates about a predetermined rotation axis. It can be applied to a unit type high-speed electronic component mounting machine.

In addition, when the electronic component mounting machine of the present invention corrects the suction position of the electronic component, for example, as the processing of step S4 shown in FIG. It is also possible to calculate the standard deviation of the history of ΔXn and ΔYn and use a value that is several times the standard deviation.

Further, the electronic component mounting apparatus of the present invention, when correcting the suction position of the electronic component, the past when calculating the average of the differences ΔXn, ΔYn between the coordinates of the center of the electronic component and the coordinates of the center of the suction nozzle. Since it takes a long time to take the data of 1 and take the average each time, a moving average may be used.

[0054]

As described above, according to the electronic component mounting machine of the present invention, it is possible to appropriately correct the minute positional deviation of the electronic components in the tape cavity when the cassette moves. Therefore, the suction of the electronic component by the suction nozzle can be performed stably. Further, according to the electronic component mounting machine of the present invention, it is possible to promptly respond to a rapid change in the component supply position due to cassette exchange, and it is possible to reduce the number of electronic components to be discarded due to a suction error by the suction nozzle.

[Brief description of drawings]

FIG. 1 is an overall configuration perspective view of an embodiment of an electronic component mounting machine of the present invention.

FIG. 2 is an enlarged perspective view of the electronic component mounting mechanism of FIG.

3 is a partially enlarged cross-sectional view of the electronic component mounting mechanism of FIG.

FIG. 4A is an external view of an electronic component mounting machine, and FIG. 4B is a diagram for explaining the equipment of the electronic component mounting machine.

5 (A) to 5 (C) are diagrams showing an operation mode of the electronic component mounting machine according to the embodiment of the present invention.

6A is an image when the electronic component picked up by the camera is not sucked, and FIG. 6B is a binarized image of the image shown in FIG.

FIG. 7A is an image when a camera picks up an electronic component, and FIG. 7B is a binarized image of the image shown in FIG.

FIG. 8 is a flowchart of an operation when correcting a suction position of an electronic component.

FIG. 9 is a diagram for explaining differences ΔXn and ΔYn between the coordinates of the center of the suction nozzle and the coordinates of the center of the electronic component.

10A is a diagram for explaining a short-term average and a long-term average of the differences ΔXn and ΔYn, and FIG. 10B is a reference used for correcting the suction position of the electronic component in the electronic component mounting machine of the present embodiment. It is a figure for explaining quantity.

11A and 11B are views for explaining the correction of the suction position of the electronic component, which is performed by the electronic component mounting machine according to the embodiment of the present invention.

FIG. 12A illustrates a case where the electronic component mounting device corrects the suction position of the electronic component, and FIG. 12B illustrates a case where the electronic component mounting device does not correct the suction position of the electronic component. FIG.

[Explanation of symbols]

 1 ・ ・ Electronic component mounting mechanism 2 ・ ・ Fixed mirror 3 ・ ・ Movable mirror 4a ・ ・ Electronic component 5 ・ ・ Suction nozzle 6 ・ ・ Semitransparent plate 6a ・ ・ Transparent plate 6b ・ ・ Semitransparent thin plate 7a ・ ・ Rotation mechanism 7b ..Elevating mechanism 8..Half mirror block 9..Movable mirror moving mechanism 10..Light emitting box 10a, 10b..Light source 11..Rotating part 14,15,16..Camera 20,22..Y axis moving mechanism 24 ··· X-axis moving mechanism 26 · · Electronic component storage 28 · · Printed circuit board 30, 31, 32 · · Mirror

Claims (5)

[Claims] 1. An electronic component suction device for sucking an electronic component and placing it at a predetermined position, and a suction nozzle extending in the longitudinal direction for sucking the electronic component at its tip, and irradiating the electronic component with light. Light irradiating means, imaging means for picking up an image of the electronic component sucked at the tip of the suction nozzle from a direction facing the light radiating means with the electronic component interposed therebetween, and replacement of a cassette containing a plurality of the electronic components. An electronic component mounting machine having a correction unit that corrects the position of the suction nozzle by switching and using the history of displacement between the suction nozzle and the electronic component within a plurality of different predetermined periods with time as a reference. 2. The correction means calculates an average of deviation histories between a position of the suction nozzle and a position of the electronic component within a predetermined period, and based on the calculated average of deviation histories. The electronic component mounting machine according to claim 1, wherein the position of the suction nozzle is corrected. 3. The electronic component mounting machine according to claim 1, wherein the correction means performs the correction for each step of the numerical control data. 4. The shift history is automatically switched when the difference between the amounts of shift between the suction nozzle and the electronic component within the plurality of different predetermined periods becomes a predetermined value or more. The electronic component mounting machine according to claim 3, wherein the electronic component mounting machine is electrically operated. 5. The plurality of predetermined time periods are a first time period and a second time period shorter than the first time period, and the correction means is configured to perform the second time operation within a predetermined time period after replacement of the cassette. The correction is performed using the history of the shift of the period, and the correction is performed using the history of the shift of the first period after a certain period of time elapses from the time of exchanging the cassette to the time of the next cassette exchange. The electronic component mounting machine according to any one of 1 to 4.