JP4416233B2 - 半導体露光装置の架台支持方法 - Google Patents
半導体露光装置の架台支持方法 Download PDFInfo
- Publication number
- JP4416233B2 JP4416233B2 JP32631899A JP32631899A JP4416233B2 JP 4416233 B2 JP4416233 B2 JP 4416233B2 JP 32631899 A JP32631899 A JP 32631899A JP 32631899 A JP32631899 A JP 32631899A JP 4416233 B2 JP4416233 B2 JP 4416233B2
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- JP
- Japan
- Prior art keywords
- gantry
- exposure apparatus
- support means
- vibration
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Vibration Prevention Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32631899A JP4416233B2 (ja) | 1999-11-17 | 1999-11-17 | 半導体露光装置の架台支持方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32631899A JP4416233B2 (ja) | 1999-11-17 | 1999-11-17 | 半導体露光装置の架台支持方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001144005A JP2001144005A (ja) | 2001-05-25 |
| JP2001144005A5 JP2001144005A5 (enExample) | 2006-12-28 |
| JP4416233B2 true JP4416233B2 (ja) | 2010-02-17 |
Family
ID=18186437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32631899A Expired - Fee Related JP4416233B2 (ja) | 1999-11-17 | 1999-11-17 | 半導体露光装置の架台支持方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4416233B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004286099A (ja) * | 2003-03-20 | 2004-10-14 | Yaskawa Electric Corp | 制振装置 |
| JP5191945B2 (ja) * | 2009-04-27 | 2013-05-08 | 株式会社Ihiインフラシステム | 制振装置の制御方法及び装置 |
| JP7766443B2 (ja) * | 2021-09-28 | 2025-11-10 | 東京応化工業株式会社 | エッチング液、金属含有層のエッチング方法、及び金属配線の形成方法 |
-
1999
- 1999-11-17 JP JP32631899A patent/JP4416233B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001144005A (ja) | 2001-05-25 |
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