JP4388576B2 - 形状測定装置 - Google Patents

形状測定装置 Download PDF

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Publication number
JP4388576B2
JP4388576B2 JP2007312034A JP2007312034A JP4388576B2 JP 4388576 B2 JP4388576 B2 JP 4388576B2 JP 2007312034 A JP2007312034 A JP 2007312034A JP 2007312034 A JP2007312034 A JP 2007312034A JP 4388576 B2 JP4388576 B2 JP 4388576B2
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JP
Japan
Prior art keywords
light
parallel
wafer
measurement object
measurement
Prior art date
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Active
Application number
JP2007312034A
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English (en)
Japanese (ja)
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JP2009133799A (ja
Inventor
勝 赤松
英久 橋爪
康秀 中井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobelco Research Institute Inc
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Kobelco Research Institute Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobelco Research Institute Inc filed Critical Kobelco Research Institute Inc
Priority to JP2007312034A priority Critical patent/JP4388576B2/ja
Priority to PCT/JP2008/071902 priority patent/WO2009072500A1/fr
Priority to TW097146803A priority patent/TWI395921B/zh
Priority to US12/745,546 priority patent/US8228509B2/en
Publication of JP2009133799A publication Critical patent/JP2009133799A/ja
Application granted granted Critical
Publication of JP4388576B2 publication Critical patent/JP4388576B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2007312034A 2007-12-03 2007-12-03 形状測定装置 Active JP4388576B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007312034A JP4388576B2 (ja) 2007-12-03 2007-12-03 形状測定装置
PCT/JP2008/071902 WO2009072500A1 (fr) 2007-12-03 2008-12-02 Appareil de mesure de forme
TW097146803A TWI395921B (zh) 2007-12-03 2008-12-02 Shape measuring device
US12/745,546 US8228509B2 (en) 2007-12-03 2008-12-02 Shape measuring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007312034A JP4388576B2 (ja) 2007-12-03 2007-12-03 形状測定装置

Publications (2)

Publication Number Publication Date
JP2009133799A JP2009133799A (ja) 2009-06-18
JP4388576B2 true JP4388576B2 (ja) 2009-12-24

Family

ID=40717678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007312034A Active JP4388576B2 (ja) 2007-12-03 2007-12-03 形状測定装置

Country Status (4)

Country Link
US (1) US8228509B2 (fr)
JP (1) JP4388576B2 (fr)
TW (1) TWI395921B (fr)
WO (1) WO2009072500A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6591762B2 (ja) 2015-02-27 2019-10-16 三菱重工業株式会社 摩耗検査装置、摩耗検査方法及びプログラム
CN105222727B (zh) * 2015-09-25 2018-01-05 深圳大学 线阵ccd相机成像平面与工作台平行度的测量方法和系统
US10446423B2 (en) * 2016-11-19 2019-10-15 Applied Materials, Inc. Next generation warpage measurement system
TWI636234B (zh) * 2016-12-13 2018-09-21 由田新技股份有限公司 外形量測方法、外形量測設備及形變檢測設備
EP3502615A1 (fr) * 2017-12-21 2019-06-26 EpiGan NV Systeme pour determiner la curvature d'une tranche de semiconducteur
EP3764165A1 (fr) * 2019-07-12 2021-01-13 ASML Netherlands B.V. Dispositif de mesure de forme de substrat
CN112344879B (zh) * 2020-09-29 2022-03-25 联想(北京)有限公司 一种胶路的检测方法、装置及设备
CN113916157B (zh) * 2021-09-30 2022-06-14 广州思拓力测绘科技有限公司 一种环形电极倾角测量方法及其测量装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2874795B2 (ja) * 1990-09-19 1999-03-24 株式会社ニデック オリエンテーションフラット検出装置
JP3035690B2 (ja) * 1994-01-27 2000-04-24 株式会社東京精密 ウェーハ直径・断面形状測定装置及びそれを組み込んだウェーハ面取り機
JPH09229638A (ja) * 1996-02-26 1997-09-05 Daido Steel Co Ltd 断面矩形材の厚み，傾き角測定方法および測定装置
JP3058615B2 (ja) * 1998-04-10 2000-07-04 株式会社山武 ウエハ検出装置
JP2000084811A (ja) * 1998-09-16 2000-03-28 Tokyo Seimitsu Co Ltd ウェーハ面取り装置
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP4251980B2 (ja) * 2003-12-24 2009-04-08 株式会社椿本チエイン 形状計測装置
WO2005106385A1 (fr) * 2004-04-27 2005-11-10 Sumitomo Heavy Industries, Ltd. Detecteur et dispositif a platine
JP2006112530A (ja) 2004-10-15 2006-04-27 Ttk:Kk 樹脂バネ、この樹脂バネを用いたスライド機構及びこのスライド機構を用いた戸用ストッパ
JP4500157B2 (ja) * 2004-11-24 2010-07-14 株式会社神戸製鋼所 形状計測装置用光学系
US9287158B2 (en) * 2005-04-19 2016-03-15 Ebara Corporation Substrate processing apparatus
JP2007240264A (ja) * 2006-03-07 2007-09-20 Olympus Corp 観察装置及び端面欠陥検査装置
TWI287614B (en) * 2006-08-16 2007-10-01 Univ Nat Formosa System and method is used with theory of optical aberration for measuring free camber
JP4128605B1 (ja) 2007-03-29 2008-07-30 あいおい損害保険株式会社 倒産確率予測装置及び倒産確率予測システム

Also Published As

Publication number Publication date
US8228509B2 (en) 2012-07-24
US20100302551A1 (en) 2010-12-02
TWI395921B (zh) 2013-05-11
JP2009133799A (ja) 2009-06-18
WO2009072500A1 (fr) 2009-06-11
TW200928290A (en) 2009-07-01

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