JP4371656B2 - 電子部品の樹脂封止方法 - Google Patents
電子部品の樹脂封止方法 Download PDFInfo
- Publication number
- JP4371656B2 JP4371656B2 JP2002505672A JP2002505672A JP4371656B2 JP 4371656 B2 JP4371656 B2 JP 4371656B2 JP 2002505672 A JP2002505672 A JP 2002505672A JP 2002505672 A JP2002505672 A JP 2002505672A JP 4371656 B2 JP4371656 B2 JP 4371656B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- squeegee
- stencil
- recess
- filling opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 title claims description 158
- 229920005989 resin Polymers 0.000 title claims description 158
- 238000007789 sealing Methods 0.000 title claims description 49
- 238000000034 method Methods 0.000 title claims description 11
- 238000007790 scraping Methods 0.000 claims description 19
- 230000001737 promoting effect Effects 0.000 claims description 13
- 239000000758 substrate Substances 0.000 description 26
- 238000003825 pressing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 description 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 description 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Screen Printers (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
(a)基板:ICチップの16個が格子状に搭載された基板。
(b)孔版:
厚み:0.9mm
樹脂充填用開口の大きさ:50mm×50mm(基板1枚を樹脂封止可能)
樹脂充填用開口の数:格子状に8個
樹脂掻き出し助長用凹部の幅:8mm
前記凹部に対する樹脂充填用開口の一端の食い込み幅:3mm
前記凹部の深さ:0.15mm
前記凹部の全長:280mm
(c)スキージ幅:270mm
(d)封止用樹脂:
粘度:100Pa・S(25℃)
チクソ指数:1.2(25℃)
(e)スキージ速度:5mm/sec
2 孔版
3 電子部品
4 樹脂充填用開口
5 樹脂
6 樹脂掻き出し助長用凹部
6a、6b 傾斜側壁
7 孔版上面
8 スキージ
9 スキージ
10 シリンダー
10a ピストンロッド
11 シリンダー
11a ピストンロッド
Claims (4)
- 孔版上でスキージを移動させながら該孔版の樹脂充填用開口に樹脂を充填するようにした孔版印刷による電子部品の樹脂封止方法において、仕上げ印刷時に、前記樹脂充填用開口のスキージ移動終点側端部に接近した位置で、前記樹脂充填用開口から充填樹脂の余剰分を掻き出すように前記スキージの昇降制御を行うことを特徴とする電子部品の樹脂封止方法。
- 前記樹脂充填用開口のスキージ移動終点側端部に連接された樹脂掻き出し助長用凹部を設けた孔版を用い、仕上げ印刷時に、前記樹脂掻き出し助長用凹部内に前記スキージを落とし込むことを特徴とする請求項1に記載の電子部品の樹脂封止方法。
- 前記樹脂掻き出し助長用凹部が、前記樹脂充填用開口の複数個と連接されていることを特徴とする請求項2に記載の電子部品の樹脂封止方法。
- 前記樹脂掻き出し助長用凹部が、前記スキージの幅より長いことを特徴とする請求項2又は3に記載の電子部品の樹脂封止方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000195747 | 2000-06-29 | ||
PCT/JP2001/005588 WO2002001625A1 (fr) | 2000-06-29 | 2001-06-28 | Procede pour l'obturation par resine de pieces electroniques, et plaque d'impression par stencil utilisee a cet effet |
Publications (1)
Publication Number | Publication Date |
---|---|
JP4371656B2 true JP4371656B2 (ja) | 2009-11-25 |
Family
ID=18694356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002505672A Expired - Fee Related JP4371656B2 (ja) | 2000-06-29 | 2001-06-28 | 電子部品の樹脂封止方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6810797B2 (ja) |
JP (1) | JP4371656B2 (ja) |
KR (1) | KR100732650B1 (ja) |
CN (1) | CN1221019C (ja) |
DE (1) | DE10196330T1 (ja) |
TW (1) | TW492115B (ja) |
WO (1) | WO2002001625A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100817639B1 (ko) * | 2004-03-19 | 2008-03-27 | 에스에무케이 가부시키가이샤 | 스크린 프린팅 금속 마스크 판 및 진동부를 수지-밀봉하는방법 |
JP4744573B2 (ja) * | 2008-01-23 | 2011-08-10 | サンユレック株式会社 | 電子装置の製造方法 |
CN101661896B (zh) * | 2008-08-25 | 2011-06-29 | 南茂科技股份有限公司 | 溢胶去除机构及其方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0939198A (ja) | 1995-07-25 | 1997-02-10 | Nec Kansai Ltd | スクリーン印刷機 |
JP3128612B2 (ja) | 1996-06-05 | 2001-01-29 | 日本レック株式会社 | 半導体製造装置 |
JP3163418B2 (ja) | 1997-07-02 | 2001-05-08 | 日本レック株式会社 | 電気部品の樹脂印刷封止用孔版 |
US6319851B1 (en) * | 1999-02-03 | 2001-11-20 | Casio Computer Co., Ltd. | Method for packaging semiconductor device having bump electrodes |
JP3721982B2 (ja) * | 2000-12-04 | 2005-11-30 | 松下電器産業株式会社 | 回路形成基板の製造方法および回路形成基板の製造装置 |
-
2001
- 2001-06-28 US US10/258,020 patent/US6810797B2/en not_active Expired - Fee Related
- 2001-06-28 WO PCT/JP2001/005588 patent/WO2002001625A1/ja active Application Filing
- 2001-06-28 CN CNB018121470A patent/CN1221019C/zh not_active Expired - Fee Related
- 2001-06-28 JP JP2002505672A patent/JP4371656B2/ja not_active Expired - Fee Related
- 2001-06-28 KR KR1020027014482A patent/KR100732650B1/ko not_active IP Right Cessation
- 2001-06-28 DE DE10196330T patent/DE10196330T1/de not_active Withdrawn
- 2001-06-29 TW TW090115924A patent/TW492115B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE10196330T1 (de) | 2003-05-15 |
CN1221019C (zh) | 2005-09-28 |
US6810797B2 (en) | 2004-11-02 |
CN1440567A (zh) | 2003-09-03 |
WO2002001625A1 (fr) | 2002-01-03 |
KR20030019363A (ko) | 2003-03-06 |
US20030106443A1 (en) | 2003-06-12 |
KR100732650B1 (ko) | 2007-06-28 |
TW492115B (en) | 2002-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4371656B2 (ja) | 電子部品の樹脂封止方法 | |
US6911167B2 (en) | Method for loading ceramic tile forming moulds, relative means for its implementation, and tiles obtained thereby | |
US6553905B2 (en) | Screen printing method | |
CN1727145A (zh) | 一种陶瓷砖坯成型技术 | |
CN114228314A (zh) | 丝网印刷机上的一种浆料的剥离角的补偿机构 | |
DE60222501D1 (de) | Verfahren zum Füllen der Fliesenpressformen, Vorrichtung zum Durchführen des Verfahrens und so hergestellte Fliesen | |
CN208277137U (zh) | 一种陶瓷砖平板印花机 | |
US20050183592A1 (en) | Screen printing apparatus and screen printing method | |
EP1331094A1 (en) | Squeeze unit and cream solder printer | |
CN1718403A (zh) | 一种仿天然石材纹理瓷砖的砖坯加工方法 | |
CN100496920C (zh) | 仿大理石陶瓷砖的生产方法及其生产设备 | |
CN209578055U (zh) | 一种定量供砂结构 | |
CN105661604A (zh) | 一种多工位食品浆全自动摊片设备及生产方法 | |
CN108544646A (zh) | 一种陶瓷砖平板印花机 | |
KR101640540B1 (ko) | 미세피치 스퀴지장치 및 이를 이용한 솔더페이스트 인쇄방법 | |
JP2002083830A (ja) | 電子部品の樹脂封止方法及びそれに用いられる孔版 | |
JP3685054B2 (ja) | スクリーン印刷方法 | |
EP1366874A2 (en) | A device for forming a soft load of ceramic powders | |
JP3835931B2 (ja) | 印刷ペースト印刷方法及び装置 | |
CN107023168A (zh) | 建筑工程3d打印机墙面打印的自动平整装置及方法 | |
JP3685055B2 (ja) | スクリーン印刷方法 | |
JP5386716B2 (ja) | 陶磁製食器の製造方法及びその装置 | |
CN109226678A (zh) | 一种定量供砂结构 | |
JP2009107232A (ja) | スクリーン印刷機 | |
JPH02299847A (ja) | スクリーン印刷装置及びスクリーン印刷方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051220 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080520 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080707 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090825 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090901 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120911 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130911 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |