JP4369401B2 - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法 Download PDF

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Publication number
JP4369401B2
JP4369401B2 JP2005187517A JP2005187517A JP4369401B2 JP 4369401 B2 JP4369401 B2 JP 4369401B2 JP 2005187517 A JP2005187517 A JP 2005187517A JP 2005187517 A JP2005187517 A JP 2005187517A JP 4369401 B2 JP4369401 B2 JP 4369401B2
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Japan
Prior art keywords
bonding
wire
capillary
bond point
bond
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JP2005187517A
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English (en)
Japanese (ja)
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JP2007012642A (ja
Inventor
竜成 三井
俊彦 富山
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Shinkawa Ltd
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Shinkawa Ltd
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Priority to JP2005187517A priority Critical patent/JP4369401B2/ja
Priority to TW095112353A priority patent/TW200703529A/zh
Priority to KR1020060039512A priority patent/KR100808510B1/ko
Publication of JP2007012642A publication Critical patent/JP2007012642A/ja
Application granted granted Critical
Publication of JP4369401B2 publication Critical patent/JP4369401B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
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    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85186—Translational movements connecting first outside the semiconductor or solid-state body, i.e. off-chip, reverse stitch
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Wire Processing (AREA)
JP2005187517A 2005-06-28 2005-06-28 ワイヤボンディング方法 Active JP4369401B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005187517A JP4369401B2 (ja) 2005-06-28 2005-06-28 ワイヤボンディング方法
TW095112353A TW200703529A (en) 2005-06-28 2006-04-07 Wire bonding method
KR1020060039512A KR100808510B1 (ko) 2005-06-28 2006-05-02 와이어 본딩 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005187517A JP4369401B2 (ja) 2005-06-28 2005-06-28 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JP2007012642A JP2007012642A (ja) 2007-01-18
JP4369401B2 true JP4369401B2 (ja) 2009-11-18

Family

ID=37750799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005187517A Active JP4369401B2 (ja) 2005-06-28 2005-06-28 ワイヤボンディング方法

Country Status (3)

Country Link
JP (1) JP4369401B2 (ko)
KR (1) KR100808510B1 (ko)
TW (1) TW200703529A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100932680B1 (ko) 2007-02-21 2009-12-21 가부시키가이샤 신가와 반도체 장치 및 와이어 본딩 방법
WO2013049965A1 (en) * 2011-10-08 2013-04-11 Sandisk Semiconductor (Shanghai) Co., Ltd. Dragonfly wire bonding
TWI585927B (zh) 2014-02-21 2017-06-01 新川股份有限公司 半導體裝置的製造方法、半導體裝置以及打線裝置
JP2014140074A (ja) * 2014-04-17 2014-07-31 Toshiba Corp 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3854232B2 (ja) * 2003-02-17 2006-12-06 株式会社新川 バンプ形成方法及びワイヤボンディング方法
JP2005159267A (ja) * 2003-10-30 2005-06-16 Shinkawa Ltd 半導体装置及びワイヤボンディング方法

Also Published As

Publication number Publication date
TWI332243B (ko) 2010-10-21
JP2007012642A (ja) 2007-01-18
KR20070000976A (ko) 2007-01-03
TW200703529A (en) 2007-01-16
KR100808510B1 (ko) 2008-02-29

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