JP4344674B2 - プラズマ処理装置 - Google Patents
プラズマ処理装置 Download PDFInfo
- Publication number
- JP4344674B2 JP4344674B2 JP2004303161A JP2004303161A JP4344674B2 JP 4344674 B2 JP4344674 B2 JP 4344674B2 JP 2004303161 A JP2004303161 A JP 2004303161A JP 2004303161 A JP2004303161 A JP 2004303161A JP 4344674 B2 JP4344674 B2 JP 4344674B2
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- Prior art keywords
- processing
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- plasma
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- Drying Of Semiconductors (AREA)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004303161A JP4344674B2 (ja) | 2004-10-18 | 2004-10-18 | プラズマ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004303161A JP4344674B2 (ja) | 2004-10-18 | 2004-10-18 | プラズマ処理装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001198830A Division JP3708031B2 (ja) | 2001-06-29 | 2001-06-29 | プラズマ処理装置および処理方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005323794A Division JP2006074067A (ja) | 2005-11-08 | 2005-11-08 | プラズマ処理装置および処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005033228A JP2005033228A (ja) | 2005-02-03 |
| JP2005033228A5 JP2005033228A5 (https=) | 2005-12-22 |
| JP4344674B2 true JP4344674B2 (ja) | 2009-10-14 |
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ID=34214527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004303161A Expired - Lifetime JP4344674B2 (ja) | 2004-10-18 | 2004-10-18 | プラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4344674B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4772401B2 (ja) * | 2005-07-06 | 2011-09-14 | 株式会社東芝 | 最適化方法、最適化システム、及び、装置を製造する方法 |
| JP2009290150A (ja) * | 2008-06-02 | 2009-12-10 | Renesas Technology Corp | 半導体装置の製造システムおよび製造方法 |
| JP5200687B2 (ja) * | 2008-06-18 | 2013-06-05 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
| US10269545B2 (en) * | 2016-08-03 | 2019-04-23 | Lam Research Corporation | Methods for monitoring plasma processing systems for advanced process and tool control |
| CN115804249B (zh) | 2020-08-18 | 2025-08-22 | 株式会社富士 | 基于等离子体的处理的处理条件决定方法及处理条件决定装置 |
-
2004
- 2004-10-18 JP JP2004303161A patent/JP4344674B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005033228A (ja) | 2005-02-03 |
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