JP4340745B2 - レーザースポットを拡大するワークピースのレーザー加工方法 - Google Patents

レーザースポットを拡大するワークピースのレーザー加工方法 Download PDF

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Publication number
JP4340745B2
JP4340745B2 JP2003559716A JP2003559716A JP4340745B2 JP 4340745 B2 JP4340745 B2 JP 4340745B2 JP 2003559716 A JP2003559716 A JP 2003559716A JP 2003559716 A JP2003559716 A JP 2003559716A JP 4340745 B2 JP4340745 B2 JP 4340745B2
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Japan
Prior art keywords
laser
primary
workpiece
positioning system
relative movement
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Expired - Lifetime
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JP2003559716A
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English (en)
Japanese (ja)
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JP2005532908A (ja
JP2005532908A5 (enExample
Inventor
アール カトラー ドナルド
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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Publication of JP2005532908A publication Critical patent/JP2005532908A/ja
Publication of JP2005532908A5 publication Critical patent/JP2005532908A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
JP2003559716A 2002-01-11 2003-01-10 レーザースポットを拡大するワークピースのレーザー加工方法 Expired - Lifetime JP4340745B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34861302P 2002-01-11 2002-01-11
PCT/US2003/000686 WO2003059568A1 (en) 2002-01-11 2003-01-10 Method for laser machining a workpiece with laser spot enlargement

Publications (3)

Publication Number Publication Date
JP2005532908A JP2005532908A (ja) 2005-11-04
JP2005532908A5 JP2005532908A5 (enExample) 2008-04-17
JP4340745B2 true JP4340745B2 (ja) 2009-10-07

Family

ID=23368777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003559716A Expired - Lifetime JP4340745B2 (ja) 2002-01-11 2003-01-10 レーザースポットを拡大するワークピースのレーザー加工方法

Country Status (9)

Country Link
JP (1) JP4340745B2 (enExample)
KR (1) KR100982677B1 (enExample)
CN (1) CN1299873C (enExample)
AU (1) AU2003214818A1 (enExample)
CA (1) CA2469520A1 (enExample)
DE (1) DE10392185T5 (enExample)
GB (1) GB2397545B (enExample)
TW (1) TW564196B (enExample)
WO (1) WO2003059568A1 (enExample)

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DE102004059721A1 (de) * 2004-12-11 2006-05-04 Carl Baasel Lasertechnik Gmbh & Co. Kg Bewässerungsschlauch und Verfahren zu seiner Herstellung
CN100462181C (zh) * 2006-10-30 2009-02-18 西安交通大学 飞秒激光真三维微纳加工中心
US7663269B2 (en) * 2006-12-13 2010-02-16 A-Tech Corporation High bandwidth linear actuator for steering mirror applications
DE102007012815B4 (de) 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
US20090312859A1 (en) * 2008-06-16 2009-12-17 Electro Scientific Industries, Inc. Modifying entry angles associated with circular tooling actions to improve throughput in part machining
TWI523720B (zh) 2009-05-28 2016-03-01 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
DE102009044316B4 (de) 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
US8338745B2 (en) * 2009-12-07 2012-12-25 Panasonic Corporation Apparatus and methods for drilling holes with no taper or reverse taper
CN103338891B (zh) * 2010-10-22 2016-03-02 伊雷克托科学工业股份有限公司 用于光束抖动和刮削的镭射加工系统和方法
CN102069298A (zh) * 2010-12-20 2011-05-25 珠海市铭语自动化设备有限公司 一种板材激光切割系统及其切割加工方法
CN102566590B (zh) * 2011-03-14 2014-03-26 北京国科世纪激光技术有限公司 光学元件智能调整系统及方法
CN103100797B (zh) * 2013-01-23 2015-09-09 刘茂珍 基于自适应光学的激光微细加工设备和方法
CN104981318B (zh) * 2013-02-13 2017-03-08 住友化学株式会社 激光照射装置及光学构件贴合体的制造装置
GB2511064A (en) 2013-02-21 2014-08-27 M Solv Ltd Method of forming electrode structure for capacitive touch sensor
GB2514084B (en) 2013-02-21 2016-07-27 M-Solv Ltd Method of forming an electrode structure for capacitive touch sensor
CN105163897A (zh) * 2013-03-15 2015-12-16 伊雷克托科学工业股份有限公司 锥度控制的射束角协调及工件运动
IT201600070259A1 (it) * 2016-07-06 2018-01-06 Adige Spa Procedimento di lavorazione laser di un materiale metallico con controllo della posizione dell'asse ottico del laser rispetto ad un flusso di gas di assistenza, nonché macchina e programma per elaboratore per l'attuazione di un tale procedimento.
CN107876981B (zh) * 2017-11-20 2019-08-20 张家港初恒激光科技有限公司 一种改进型的激光焊接加工工作站
CN109579690A (zh) * 2018-12-04 2019-04-05 天津津航技术物理研究所 一种用于快反镜稳像系统的高精度角位移检测装置
CN112122776A (zh) * 2020-09-23 2020-12-25 苏州科韵激光科技有限公司 基于高速旋转反射镜的非线性形状加工系统及方法
KR102497645B1 (ko) * 2021-06-23 2023-02-08 인하대학교 산학협력단 금형 표면 레이저 가공하는 방법
EP4137263A1 (de) * 2021-08-20 2023-02-22 Bystronic Laser AG Halterung für ein transmissives optisches element, laserbearbeitungvorrichtung mit einer solchen halterung und verfahren zum verstellen der position eines transmissiven optischen elements unter verwendung einer solchen halterung
CN113897608A (zh) * 2021-10-23 2022-01-07 河南省锅炉压力容器安全检测研究院 一种用于阀门密封面的激光表面强化加工设备

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JP3060813B2 (ja) * 1993-12-28 2000-07-10 トヨタ自動車株式会社 レーザ加工装置
JPH0885866A (ja) * 1994-09-16 1996-04-02 Sumitomo Metal Mining Co Ltd Ｉｔｏ焼結体の製造方法
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WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces

Also Published As

Publication number Publication date
AU2003214818A1 (en) 2003-07-30
CA2469520A1 (en) 2003-07-24
GB0412827D0 (en) 2004-07-14
GB2397545B (en) 2005-05-11
JP2005532908A (ja) 2005-11-04
GB2397545A (en) 2004-07-28
WO2003059568A1 (en) 2003-07-24
KR20040073542A (ko) 2004-08-19
TW200301718A (en) 2003-07-16
DE10392185T5 (de) 2004-12-02
TW564196B (en) 2003-12-01
KR100982677B1 (ko) 2010-09-17
CN1612793A (zh) 2005-05-04
CN1299873C (zh) 2007-02-14

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