JP4335066B2 - 通信端末 - Google Patents
通信端末 Download PDFInfo
- Publication number
- JP4335066B2 JP4335066B2 JP2004134711A JP2004134711A JP4335066B2 JP 4335066 B2 JP4335066 B2 JP 4335066B2 JP 2004134711 A JP2004134711 A JP 2004134711A JP 2004134711 A JP2004134711 A JP 2004134711A JP 4335066 B2 JP4335066 B2 JP 4335066B2
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- communication terminal
- communication
- contact
- attachment member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 229910052751 metal Inorganic materials 0.000 description 29
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- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
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- 238000006263 metalation reaction Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Landscapes
- Support Of Aerials (AREA)
- Telephone Set Structure (AREA)
Description
2 本体上部(第1筐体)
3 本体下部(第2筐体)
5 表示画面(表示部)
7 操作ボタン(操作部)
10 アンテナ取り付け部材
11 アンテナ
12 非接触ICチップ(非接触通信用IC)
15 基板
16 貼付面(アンテナ貼付部)
18 両面テープ(接着剤)
20 接点(接続部)
21 バネ式接点
Claims (5)
- 表示部が設けられた第1筐体と、操作部が設けられた第2筐体とを備えた通信端末において、
上記第1筐体は、非接触式通信用ICが設けられた基板と、
アンテナが貼付されたほぼ矩形状のアンテナ貼付部および該アンテナを非接触式通信ICに接続する接続部が設けられたアンテナ取り付け部材とを備えており、
上記アンテナ取り付け部材は、通信端末に対して着脱可能になっていると共に、上記基板を覆うようにして取り付けられており、さらに、アンテナ貼付部を有する面の外周部分から垂直方向に伸び、アンテナ取り付け部材を上記第1筐体に対して固定するための足部を有することを特徴とする通信端末。 - 上記アンテナは、アンテナ取り付け部材の周縁部分に設けられていることを特徴とする請求項1に記載の通信端末。
- 上記接続部は、アンテナ取り付け部材の端部に設けられていることを特徴とする請求項1または2に記載の通信端末。
- 上記アンテナは、磁性体を含む接着剤を用いて貼付されていることを特徴とする請求項1ないし3のいずれか1項に記載の通信端末。
- 上記アンテナ取り付け部材は、周縁部分が湾曲していることを特徴とする請求項1ないし4のいずれか1項に記載の通信端末。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004134711A JP4335066B2 (ja) | 2004-04-28 | 2004-04-28 | 通信端末 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004134711A JP4335066B2 (ja) | 2004-04-28 | 2004-04-28 | 通信端末 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005318329A JP2005318329A (ja) | 2005-11-10 |
JP4335066B2 true JP4335066B2 (ja) | 2009-09-30 |
Family
ID=35445291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004134711A Expired - Fee Related JP4335066B2 (ja) | 2004-04-28 | 2004-04-28 | 通信端末 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4335066B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4957683B2 (ja) * | 2008-08-29 | 2012-06-20 | 株式会社村田製作所 | アンテナ装置 |
JP5306840B2 (ja) * | 2009-01-22 | 2013-10-02 | 京セラ株式会社 | 携帯電子機器 |
JP5771350B2 (ja) * | 2009-04-28 | 2015-08-26 | レノボ・イノベーションズ・リミテッド(香港) | 携帯型電子機器のケース構造、携帯型電子機器及びその製造方法 |
JP5424341B2 (ja) * | 2010-05-18 | 2014-02-26 | Necカシオモバイルコミュニケーションズ株式会社 | 携帯通信端末 |
CN103814477B (zh) | 2011-11-08 | 2016-11-16 | 株式会社村田制作所 | 天线装置及通信装置 |
KR102562631B1 (ko) * | 2018-11-26 | 2023-08-02 | 삼성전자 주식회사 | 안테나 및 그것을 포함하는 전자 장치 |
CN112993525B (zh) * | 2021-02-03 | 2024-03-19 | 维沃移动通信有限公司 | 显示装置及电子设备 |
-
2004
- 2004-04-28 JP JP2004134711A patent/JP4335066B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005318329A (ja) | 2005-11-10 |
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