JP4307296B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4307296B2
JP4307296B2 JP2004071296A JP2004071296A JP4307296B2 JP 4307296 B2 JP4307296 B2 JP 4307296B2 JP 2004071296 A JP2004071296 A JP 2004071296A JP 2004071296 A JP2004071296 A JP 2004071296A JP 4307296 B2 JP4307296 B2 JP 4307296B2
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Japan
Prior art keywords
forming
insulating film
layer
via hole
wiring layer
Prior art date
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Expired - Fee Related
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JP2004071296A
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English (en)
Japanese (ja)
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JP2005260081A (ja
JP2005260081A5 (enrdf_load_stackoverflow
Inventor
工次郎 亀山
彰 鈴木
芳央 岡山
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Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
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Priority to JP2004071296A priority Critical patent/JP4307296B2/ja
Publication of JP2005260081A publication Critical patent/JP2005260081A/ja
Publication of JP2005260081A5 publication Critical patent/JP2005260081A5/ja
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JP2004071296A 2004-03-12 2004-03-12 半導体装置の製造方法 Expired - Fee Related JP4307296B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004071296A JP4307296B2 (ja) 2004-03-12 2004-03-12 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004071296A JP4307296B2 (ja) 2004-03-12 2004-03-12 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005260081A JP2005260081A (ja) 2005-09-22
JP2005260081A5 JP2005260081A5 (enrdf_load_stackoverflow) 2007-04-19
JP4307296B2 true JP4307296B2 (ja) 2009-08-05

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JP2004071296A Expired - Fee Related JP4307296B2 (ja) 2004-03-12 2004-03-12 半導体装置の製造方法

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JP (1) JP4307296B2 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4403424B2 (ja) 2006-11-30 2010-01-27 ソニー株式会社 固体撮像装置
JP4765947B2 (ja) * 2007-01-25 2011-09-07 カシオ計算機株式会社 半導体装置およびその製造方法
US8749065B2 (en) 2007-01-25 2014-06-10 Tera Probe, Inc. Semiconductor device comprising electromigration prevention film and manufacturing method thereof
JPWO2010070826A1 (ja) * 2008-12-17 2012-05-24 パナソニック株式会社 貫通電極の形成方法及び半導体装置
JP5136515B2 (ja) * 2009-05-27 2013-02-06 ソニー株式会社 固体撮像装置
JP2011171567A (ja) * 2010-02-19 2011-09-01 Elpida Memory Inc 基板構造物の製造方法及び半導体装置の製造方法
KR102031908B1 (ko) * 2013-02-06 2019-10-14 삼성전자주식회사 관통 전극을 갖는 반도체 소자 및 그 형성 방법
KR101520433B1 (ko) 2013-07-08 2015-05-14 주식회사 레이언스 이미지센서 및 이의 제조방법
JP7395302B2 (ja) * 2019-09-30 2023-12-11 株式会社ジャパンディスプレイ 表示装置
CN115701882A (zh) * 2021-07-19 2023-02-14 福州京东方光电科技有限公司 阵列基板的制备方法及显示面板的制备方法

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Publication number Publication date
JP2005260081A (ja) 2005-09-22

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