JP4307296B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP4307296B2 JP4307296B2 JP2004071296A JP2004071296A JP4307296B2 JP 4307296 B2 JP4307296 B2 JP 4307296B2 JP 2004071296 A JP2004071296 A JP 2004071296A JP 2004071296 A JP2004071296 A JP 2004071296A JP 4307296 B2 JP4307296 B2 JP 4307296B2
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- forming
- insulating film
- layer
- via hole
- wiring layer
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2004071296A JP4307296B2 (ja) | 2004-03-12 | 2004-03-12 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004071296A JP4307296B2 (ja) | 2004-03-12 | 2004-03-12 | 半導体装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005260081A JP2005260081A (ja) | 2005-09-22 |
JP2005260081A5 JP2005260081A5 (enrdf_load_stackoverflow) | 2007-04-19 |
JP4307296B2 true JP4307296B2 (ja) | 2009-08-05 |
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ID=35085499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004071296A Expired - Fee Related JP4307296B2 (ja) | 2004-03-12 | 2004-03-12 | 半導体装置の製造方法 |
Country Status (1)
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JP (1) | JP4307296B2 (enrdf_load_stackoverflow) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4403424B2 (ja) | 2006-11-30 | 2010-01-27 | ソニー株式会社 | 固体撮像装置 |
JP4765947B2 (ja) * | 2007-01-25 | 2011-09-07 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
US8749065B2 (en) | 2007-01-25 | 2014-06-10 | Tera Probe, Inc. | Semiconductor device comprising electromigration prevention film and manufacturing method thereof |
JPWO2010070826A1 (ja) * | 2008-12-17 | 2012-05-24 | パナソニック株式会社 | 貫通電極の形成方法及び半導体装置 |
JP5136515B2 (ja) * | 2009-05-27 | 2013-02-06 | ソニー株式会社 | 固体撮像装置 |
JP2011171567A (ja) * | 2010-02-19 | 2011-09-01 | Elpida Memory Inc | 基板構造物の製造方法及び半導体装置の製造方法 |
KR102031908B1 (ko) * | 2013-02-06 | 2019-10-14 | 삼성전자주식회사 | 관통 전극을 갖는 반도체 소자 및 그 형성 방법 |
KR101520433B1 (ko) | 2013-07-08 | 2015-05-14 | 주식회사 레이언스 | 이미지센서 및 이의 제조방법 |
JP7395302B2 (ja) * | 2019-09-30 | 2023-12-11 | 株式会社ジャパンディスプレイ | 表示装置 |
CN115701882A (zh) * | 2021-07-19 | 2023-02-14 | 福州京东方光电科技有限公司 | 阵列基板的制备方法及显示面板的制备方法 |
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2004
- 2004-03-12 JP JP2004071296A patent/JP4307296B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2005260081A (ja) | 2005-09-22 |
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