JP4286284B2 - 多層プリント回路を形成する層の電磁誘導溶接用機械の電極 - Google Patents
多層プリント回路を形成する層の電磁誘導溶接用機械の電極 Download PDFInfo
- Publication number
- JP4286284B2 JP4286284B2 JP2006508158A JP2006508158A JP4286284B2 JP 4286284 B2 JP4286284 B2 JP 4286284B2 JP 2006508158 A JP2006508158 A JP 2006508158A JP 2006508158 A JP2006508158 A JP 2006508158A JP 4286284 B2 JP4286284 B2 JP 4286284B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- multilayer printed
- induction
- circuit
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 title claims description 17
- 230000005674 electromagnetic induction Effects 0.000 title claims description 7
- 230000006698 induction Effects 0.000 claims description 48
- 230000004888 barrier function Effects 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000004804 winding Methods 0.000 claims description 3
- 238000005485 electric heating Methods 0.000 claims 3
- 238000001816 cooling Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0205—Non-consumable electrodes; C-electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K13/00—Welding by high-frequency current heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/36—Coil arrangements
- H05B6/365—Coil arrangements using supplementary conductive or ferromagnetic pieces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Induction Heating (AREA)
- Resistance Welding (AREA)
- Coils Of Transformers For General Uses (AREA)
- Manufacture Of Motors, Generators (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
Claims (4)
- 磁気回路(2)の各アームの外側の端部に、両方の電極が多層プリント回路に対して垂直に配置され、互いに同軸であり、両方向に垂直に移動することができるそれぞれ1つの誘導電極(5s、5i)を含む、界磁巻線(3)が取り付けられたU形状の前記磁気回路(2)を備える少なくとも1つの誘導装置(1)が取り付けられた機械に適用可能な、多層プリント回路を形成する層の電磁誘導溶接用機械の電極であって、前記多層プリント回路と接触するようになっている前記誘導電極(5s、5i)の前記端部が、溶接中に溶接領域から前記電極への熱伝導による熱伝達を防止するために、電気加熱回路(8s−8i、9s−9i、10s−10i)を含む加熱素子から作られている熱障壁を備えることを特徴とする電極。
- 請求項1に記載の電極であって、前記電気加熱回路が、短絡モードの少なくとも1つのターン(8s−8i、9s−9i)を含むことを特徴とする電極。
- 請求項1に記載の電極であって、前記電気加熱回路が、電極外部のエネルギー源によって給電される少なくとも1つの電気抵抗器(10s−10i)を含むことを特徴とする電極。
- 磁気回路(2)の対応するアームに磁気的に接続され、互いに同軸に配置され、両方向に垂直に移動可能である上方誘導電極(5s)および下方誘導電極(5i)を備える磁気回路(2)を含む、多層プリント回路の層の電磁誘導溶接用機械の誘導装置(1)であって、前記多層プリント回路と接触するようになっている各誘導電極(5s、5i)の前記端部が、溶接中に溶接領域から前記電極への熱伝導による熱伝達を防止するために、電気加熱回路(8s−8i、9s−9i、10s−10i)を含む加熱素子から作られている熱障壁を備えることを特徴とする誘導装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES200301285A ES2221569B1 (es) | 2003-05-30 | 2003-05-30 | Electrodo para maquinas para la soldadura por induccion electromagnetica de las capas constitutivas de un circuito impreso multicapa. |
PCT/EP2004/004668 WO2004105993A1 (en) | 2003-05-30 | 2004-05-03 | Electrode for machine for electromagnetic induction welding of the layers forming a multi-layer printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006526282A JP2006526282A (ja) | 2006-11-16 |
JP4286284B2 true JP4286284B2 (ja) | 2009-06-24 |
Family
ID=33484260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006508158A Expired - Lifetime JP4286284B2 (ja) | 2003-05-30 | 2004-05-03 | 多層プリント回路を形成する層の電磁誘導溶接用機械の電極 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7675009B2 (ja) |
EP (1) | EP1628799B1 (ja) |
JP (1) | JP4286284B2 (ja) |
CN (1) | CN100443235C (ja) |
AT (1) | ATE367235T1 (ja) |
DE (1) | DE602004007650T2 (ja) |
ES (1) | ES2221569B1 (ja) |
TW (1) | TWI322055B (ja) |
WO (1) | WO2004105993A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITMI20072150A1 (it) * | 2007-11-12 | 2009-05-13 | Cedal Equipment Srl | Dispositivo per la generazione di una barriera termica a temperatura controllata ai poli d'induzione magnetica di una testa di saldatura |
ITGE20130058A1 (it) * | 2013-06-13 | 2014-12-14 | Cedal Equipment S R L | Testa miniaturizzata di giunzione ad induzione di circuiti stampati |
CN110170775B (zh) * | 2019-06-13 | 2021-03-02 | 国网山东省电力公司青州市供电公司 | 一种焊接用磁吸式辅助加热装置及焊接方法 |
CN110405333B (zh) * | 2019-07-09 | 2020-12-18 | 武汉大学 | 一种用于箔片微型件的涡流电阻焊装置及其焊接方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3467806A (en) * | 1968-04-25 | 1969-09-16 | Westinghouse Electric Corp | Induction heating device |
FR2416078A2 (fr) * | 1976-10-05 | 1979-08-31 | Tocco Stel | Presse a braser par induction des pieces metalliques comportant des portions peripheriques incurvees ou relevees |
US4359620A (en) * | 1977-12-06 | 1982-11-16 | Amp Incorporated | Induction heating apparatus |
US4528057A (en) * | 1983-09-08 | 1985-07-09 | The Taylor-Winfield Corporation | Adhesive spot curing press and method for metallic parts |
SU1337217A1 (ru) * | 1985-01-14 | 1987-09-15 | Всесоюзный Научно-Исследовательский,Проектно-Конструкторский И Технологический Институт Электросварочного Оборудования | Устройство дл индукционного нагрева |
SE464019B (sv) * | 1989-03-13 | 1991-02-25 | Tetra Pak Holdings & Finance | Anordning foer kontinuerlig induktionssvetsning av foerpackningsmaterial |
CN2107972U (zh) * | 1991-11-08 | 1992-06-24 | 机械电子工业部哈尔滨焊接研究所 | 一种高频电阻焊翅片管用电极 |
US5483043A (en) * | 1993-11-29 | 1996-01-09 | General Electric Company | Induction heating of polymer matrix composites in a mold press |
US6271507B2 (en) * | 1999-10-08 | 2001-08-07 | Molex Incorporated | Apparatus and method for bonding conductors |
DE19950083C2 (de) * | 1999-10-18 | 2002-12-19 | Hermsdorfer Inst Tech Keramik | Vorrichtung zur Stabilisierung eines ferroelektrischen Plasmareaktors |
AU2002212963A1 (en) * | 2000-10-25 | 2002-05-06 | Tokyo Electron Limited | Method of and structure for controlling electrode temperature |
ES2190757B1 (es) * | 2001-12-28 | 2005-07-16 | Chemplate Materials, S.L. | Procedimiento para la soldadura de las capas constitutivas de un circuito impreso multicapa y maquina para el mismo. |
US6573477B1 (en) * | 2002-05-13 | 2003-06-03 | Welcome Company Ltd. | Safety electric sealer having a safety gate |
-
2003
- 2003-05-30 ES ES200301285A patent/ES2221569B1/es not_active Expired - Fee Related
-
2004
- 2004-05-03 JP JP2006508158A patent/JP4286284B2/ja not_active Expired - Lifetime
- 2004-05-03 AT AT04725629T patent/ATE367235T1/de not_active IP Right Cessation
- 2004-05-03 DE DE602004007650T patent/DE602004007650T2/de not_active Expired - Lifetime
- 2004-05-03 WO PCT/EP2004/004668 patent/WO2004105993A1/en active IP Right Grant
- 2004-05-03 US US10/557,488 patent/US7675009B2/en active Active
- 2004-05-03 EP EP04725629A patent/EP1628799B1/en not_active Expired - Lifetime
- 2004-05-03 CN CNB2004800148592A patent/CN100443235C/zh not_active Expired - Lifetime
- 2004-05-13 TW TW093113511A patent/TWI322055B/zh active
Also Published As
Publication number | Publication date |
---|---|
ES2221569B1 (es) | 2006-03-16 |
TWI322055B (en) | 2010-03-21 |
CN1809439A (zh) | 2006-07-26 |
CN100443235C (zh) | 2008-12-17 |
DE602004007650T2 (de) | 2008-06-05 |
DE602004007650D1 (de) | 2007-08-30 |
EP1628799A1 (en) | 2006-03-01 |
WO2004105993A8 (en) | 2005-05-26 |
JP2006526282A (ja) | 2006-11-16 |
US20070045296A1 (en) | 2007-03-01 |
ATE367235T1 (de) | 2007-08-15 |
WO2004105993A1 (en) | 2004-12-09 |
US7675009B2 (en) | 2010-03-09 |
EP1628799B1 (en) | 2007-07-18 |
TW200510101A (en) | 2005-03-16 |
ES2221569A1 (es) | 2004-12-16 |
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