JP4274348B2 - プロセスの予測方法及び処理装置並びにプロセス予測プログラム - Google Patents

プロセスの予測方法及び処理装置並びにプロセス予測プログラム Download PDF

Info

Publication number
JP4274348B2
JP4274348B2 JP2002193624A JP2002193624A JP4274348B2 JP 4274348 B2 JP4274348 B2 JP 4274348B2 JP 2002193624 A JP2002193624 A JP 2002193624A JP 2002193624 A JP2002193624 A JP 2002193624A JP 4274348 B2 JP4274348 B2 JP 4274348B2
Authority
JP
Japan
Prior art keywords
detection data
processing
processing apparatus
residual
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002193624A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004039805A5 (https=
JP2004039805A (ja
Inventor
智 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2002193624A priority Critical patent/JP4274348B2/ja
Priority to PCT/JP2003/005782 priority patent/WO2003098677A1/ja
Priority to AU2003235901A priority patent/AU2003235901A1/en
Priority to CN038103559A priority patent/CN1653598B/zh
Priority to TW092112846A priority patent/TWI272462B/zh
Publication of JP2004039805A publication Critical patent/JP2004039805A/ja
Priority to US10/984,932 priority patent/US7689028B2/en
Publication of JP2004039805A5 publication Critical patent/JP2004039805A5/ja
Application granted granted Critical
Publication of JP4274348B2 publication Critical patent/JP4274348B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Testing And Monitoring For Control Systems (AREA)
  • Drying Of Semiconductors (AREA)
JP2002193624A 2002-05-16 2002-07-02 プロセスの予測方法及び処理装置並びにプロセス予測プログラム Expired - Fee Related JP4274348B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002193624A JP4274348B2 (ja) 2002-07-02 2002-07-02 プロセスの予測方法及び処理装置並びにプロセス予測プログラム
AU2003235901A AU2003235901A1 (en) 2002-05-16 2003-05-08 Method of predicting processing device condition or processed result
CN038103559A CN1653598B (zh) 2002-05-16 2003-05-08 处理装置状态或处理结果的预测方法
PCT/JP2003/005782 WO2003098677A1 (en) 2002-05-16 2003-05-08 Method of predicting processing device condition or processed result
TW092112846A TWI272462B (en) 2002-05-16 2003-05-12 Method of predicting processing device condition or processed result
US10/984,932 US7689028B2 (en) 2002-05-16 2004-11-10 Method and apparatus for evaluating processing apparatus status and predicting processing result

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002193624A JP4274348B2 (ja) 2002-07-02 2002-07-02 プロセスの予測方法及び処理装置並びにプロセス予測プログラム

Publications (3)

Publication Number Publication Date
JP2004039805A JP2004039805A (ja) 2004-02-05
JP2004039805A5 JP2004039805A5 (https=) 2005-09-15
JP4274348B2 true JP4274348B2 (ja) 2009-06-03

Family

ID=31702548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002193624A Expired - Fee Related JP4274348B2 (ja) 2002-05-16 2002-07-02 プロセスの予測方法及び処理装置並びにプロセス予測プログラム

Country Status (1)

Country Link
JP (1) JP4274348B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006350698A (ja) * 2005-06-16 2006-12-28 Taiyo Nippon Sanso Corp 異常診断装置、異常診断方法、異常診断プログラム
US7625824B2 (en) * 2005-06-16 2009-12-01 Oerlikon Usa, Inc. Process change detection through the use of evolutionary algorithms
JP4643392B2 (ja) * 2005-08-24 2011-03-02 東京エレクトロン株式会社 プラズマ処理装置の運転状態判定方法、運転状態判定装置、プログラム及び記憶媒体
US8101906B2 (en) 2008-10-08 2012-01-24 Applied Materials, Inc. Method and apparatus for calibrating optical path degradation useful for decoupled plasma nitridation chambers
JP6643202B2 (ja) * 2016-07-21 2020-02-12 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理データを解析する解析方法
WO2018038892A1 (en) * 2016-08-26 2018-03-01 Applied Materials, Inc. Self-healing semiconductor wafer processing
CN115828098B (zh) * 2022-11-30 2026-04-14 国网上海市电力公司 一种基线负荷预测方法、装置、电子设备和存储介质
CN118625862B (zh) * 2024-08-12 2024-11-08 深圳捷工科技股份有限公司 一种电子特气气体流量智能控制系统

Also Published As

Publication number Publication date
JP2004039805A (ja) 2004-02-05

Similar Documents

Publication Publication Date Title
US20250293062A1 (en) Adaptive control of variability in device performance in advanced semiconductor processes
TWI772325B (zh) 電漿處理狀態的控制方法與系統
JP4448335B2 (ja) プラズマ処理方法及びプラズマ処理装置
JP4464276B2 (ja) プラズマ処理方法及びプラズマ処理装置
TWI683333B (zh) 電漿處理裝置及電漿處理裝置狀態預測方法
CN1653598B (zh) 处理装置状态或处理结果的预测方法
KR20230031925A (ko) 프로세싱 장비의 제어
JP4317701B2 (ja) 処理結果の予測方法及び予測装置
US7389203B2 (en) Method and apparatus for deciding cause of abnormality in plasma processing apparatus
WO2022132704A1 (en) Machine-learning in multi-step semiconductor fabrication processes
JP7646289B2 (ja) その場でのリアルタイムのプラズマチャンバ条件監視
JP4274348B2 (ja) プロセスの予測方法及び処理装置並びにプロセス予測プログラム
JP2025500425A (ja) デジタルツインを構築するための基板支持体の特徴付け
Baek et al. An effective procedure for sensor variable selection and utilization in plasma etching for semiconductor manufacturing
JP4220378B2 (ja) 処理結果の予測方法および処理装置
JP4173311B2 (ja) シーズニング終了検知方法及びプラズマ処理方法並びにプラズマ処理装置
JP4048319B2 (ja) 処理装置の異常検知方法
WO2024181164A1 (ja) 基板処理システム及び基板処理方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050329

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050329

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080304

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080430

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080826

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081024

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090224

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090225

R150 Certificate of patent or registration of utility model

Ref document number: 4274348

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120313

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120313

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150313

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees