JP4254602B2 - 二次元放射線検出器 - Google Patents
二次元放射線検出器 Download PDFInfo
- Publication number
- JP4254602B2 JP4254602B2 JP2004122806A JP2004122806A JP4254602B2 JP 4254602 B2 JP4254602 B2 JP 4254602B2 JP 2004122806 A JP2004122806 A JP 2004122806A JP 2004122806 A JP2004122806 A JP 2004122806A JP 4254602 B2 JP4254602 B2 JP 4254602B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- matrix substrate
- active matrix
- radiation detector
- light irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005855 radiation Effects 0.000 title claims description 90
- 239000000758 substrate Substances 0.000 claims description 67
- 239000011159 matrix material Substances 0.000 claims description 64
- 239000004065 semiconductor Substances 0.000 claims description 48
- 230000001678 irradiating effect Effects 0.000 claims description 13
- 239000010408 film Substances 0.000 description 30
- 238000006243 chemical reaction Methods 0.000 description 9
- 230000035945 sensitivity Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000010365 information processing Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/29—Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
- G01T1/2914—Measurement of spatial distribution of radiation
- G01T1/2921—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras
- G01T1/2928—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras using solid state detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14665—Imagers using a photoconductor layer
- H01L27/14676—X-ray, gamma-ray or corpuscular radiation imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Measurement Of Radiation (AREA)
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
3 …アクティブマトリクス基板
5 …光照射部
7 …面状導光部
9 …配電用ケーブル
10 …導電層
13 …電磁シールド
21 …フレキシブル基板
23 …増幅器
25 …ADコンバータ
41 …ゲートドライバ
Claims (3)
- 放射線の入射により、放射線情報を電荷情報に変換する半導体層と、この半導体層が表面に積層され、この半導体層から電荷情報を読み出すアクティブマトリクス基板と、光を照射する光照射手段と、前記アクティブマトリクス基板の裏面側に配設され、光照射手段からの光を端面側から受けて、前記アクティブマトリクス基板を介して前記半導体層に導く面状導光手段とを備えた二次元放射線検出器において、前記光照射手段と前記アクティブマトリクス基板との間であって、前記光照射手段が前記アクティブマトリクス基板に対向する領域に、電磁シールドを配設し、前記光照射手段は、前記アクティブマトリクス基板の裏面側、かつ、前記面状導光手段の端面側に配置されていることを特徴とする二次元放射線検出器。
- 請求項1に記載の二次元放射線検出器において、電磁シールドは、光照射手段の周囲を蔽い、かつ、光照射手段が面状導光手段の端面側へ光を照射することを許容する開口を備えることを特徴とする二次元放射線検出器。
- 請求項1または請求項2に記載の二次元放射線検出器において、さらに、前記検出器は、外部電源から光照射手段に電力を供給する配電手段を備え、配電手段は、供給される電力によって輻射されるノイズを遮蔽する導電層を有し、導電層は接地されていることを特徴とする二次元放射線検出器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004122806A JP4254602B2 (ja) | 2004-04-19 | 2004-04-19 | 二次元放射線検出器 |
US11/102,374 US7075088B2 (en) | 2004-04-19 | 2005-04-08 | Two-dimensional radiation detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004122806A JP4254602B2 (ja) | 2004-04-19 | 2004-04-19 | 二次元放射線検出器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005308440A JP2005308440A (ja) | 2005-11-04 |
JP4254602B2 true JP4254602B2 (ja) | 2009-04-15 |
Family
ID=35095355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004122806A Expired - Lifetime JP4254602B2 (ja) | 2004-04-19 | 2004-04-19 | 二次元放射線検出器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7075088B2 (ja) |
JP (1) | JP4254602B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7397503B2 (ja) | 2021-10-12 | 2023-12-13 | 株式会社Robusto | 防水塗膜形成用組成物 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007155662A (ja) * | 2005-12-08 | 2007-06-21 | Canon Inc | 放射線検出装置及びそれを用いた放射線撮像システム |
JP4911966B2 (ja) * | 2005-12-12 | 2012-04-04 | キヤノン株式会社 | 放射線検出装置および放射線撮像システム |
JP4579894B2 (ja) | 2005-12-20 | 2010-11-10 | キヤノン株式会社 | 放射線検出装置及び放射線検出システム |
JP5300216B2 (ja) | 2006-08-29 | 2013-09-25 | キヤノン株式会社 | 電子カセッテ型放射線検出装置 |
EP2137551A2 (en) * | 2007-04-12 | 2009-12-30 | Philips Intellectual Property & Standards GmbH | Reducing trap effects in a scintillator by application of secondary radiation |
JP4834614B2 (ja) * | 2007-06-12 | 2011-12-14 | キヤノン株式会社 | 放射線検出装置および放射線撮像システム |
US7658541B2 (en) * | 2007-06-26 | 2010-02-09 | General Electric Company | Apparatus for universal electromagnetic navigation target for fluoroscopic systems |
WO2018037862A1 (ja) * | 2016-08-23 | 2018-03-01 | 株式会社ニコン | 撮像素子および撮像システム |
EP3743744A4 (en) | 2018-01-25 | 2021-07-28 | Shenzhen Xpectvision Technology Co., Ltd. | RADIATION DETECTOR PACKAGING |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5401973A (en) * | 1992-12-04 | 1995-03-28 | Atomic Energy Of Canada Limited | Industrial material processing electron linear accelerator |
JP4267136B2 (ja) * | 1998-09-25 | 2009-05-27 | 富士フイルム株式会社 | 放射線画像検出読取装置 |
TW561799B (en) * | 1999-08-11 | 2003-11-11 | Fujikura Ltd | Chip assembly module of bump connection type using a multi-layer printed circuit substrate |
JP4532782B2 (ja) * | 2000-07-04 | 2010-08-25 | キヤノン株式会社 | 放射線撮像装置及びシステム |
DE10132924A1 (de) * | 2001-07-06 | 2003-01-16 | Philips Corp Intellectual Pty | Flacher dynamischer Strahlungsdetektor |
JP4211435B2 (ja) * | 2002-08-30 | 2009-01-21 | 株式会社島津製作所 | 放射線検出器 |
JP3757946B2 (ja) * | 2003-03-18 | 2006-03-22 | 株式会社島津製作所 | 放射線撮像装置 |
-
2004
- 2004-04-19 JP JP2004122806A patent/JP4254602B2/ja not_active Expired - Lifetime
-
2005
- 2005-04-08 US US11/102,374 patent/US7075088B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7397503B2 (ja) | 2021-10-12 | 2023-12-13 | 株式会社Robusto | 防水塗膜形成用組成物 |
Also Published As
Publication number | Publication date |
---|---|
US20050230629A1 (en) | 2005-10-20 |
JP2005308440A (ja) | 2005-11-04 |
US7075088B2 (en) | 2006-07-11 |
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