JP4247623B2 - 半導体装置及びその製造方法、回路基板並びに電子機器 - Google Patents

半導体装置及びその製造方法、回路基板並びに電子機器 Download PDF

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Publication number
JP4247623B2
JP4247623B2 JP2004356786A JP2004356786A JP4247623B2 JP 4247623 B2 JP4247623 B2 JP 4247623B2 JP 2004356786 A JP2004356786 A JP 2004356786A JP 2004356786 A JP2004356786 A JP 2004356786A JP 4247623 B2 JP4247623 B2 JP 4247623B2
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Japan
Prior art keywords
substrate
semiconductor device
semiconductor
electrode
semiconductor element
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Expired - Fee Related
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JP2004356786A
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English (en)
Japanese (ja)
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JP2005123643A5 (https=
JP2005123643A (ja
Inventor
伸晃 橋元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2004356786A priority Critical patent/JP4247623B2/ja
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Publication of JP2005123643A5 publication Critical patent/JP2005123643A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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JP2004356786A 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器 Expired - Fee Related JP4247623B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004356786A JP4247623B2 (ja) 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27261398 1998-09-09
JP2004356786A JP4247623B2 (ja) 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器

Related Parent Applications (1)

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JP2000-569448A Division JPWO2000014802A1 (ja) 1998-09-09 1999-09-03 半導体装置及びその製造方法、回路基板並びに電子機器

Publications (3)

Publication Number Publication Date
JP2005123643A JP2005123643A (ja) 2005-05-12
JP2005123643A5 JP2005123643A5 (https=) 2006-10-12
JP4247623B2 true JP4247623B2 (ja) 2009-04-02

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JP2004356786A Expired - Fee Related JP4247623B2 (ja) 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器

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JP (1) JP4247623B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295763A (ja) * 2008-06-05 2009-12-17 Fujitsu Ltd 半導体実装装置及び電子機器
EP3907769A1 (en) * 2020-05-08 2021-11-10 Koninklijke Philips N.V. Sensor comprising an interconnect and an interventional medical device using the same

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Publication number Publication date
JP2005123643A (ja) 2005-05-12

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