JP4243129B2 - Processing method of light guide plate mold - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to, for example, a method for processing a light guide plate molding die for resin molding a light guide plate used in a liquid crystal display device, and an improvement of the mold and a light guide plate resin-molded with the above-described die.
[0002]
[Prior art]
  Conventionally, for example, a micro lens array type light guide plate employing a side light (light source) is used in a liquid crystal display device.
  The microlens array type (hereinafter referred to as MLA type) light guide plate is configured by appropriately arranging a plurality of convex microlenses having the same shape on the light output surface (light output part) side of the light guide plate. The provided configuration is common.
  For example, as shown in FIGS. 9 (1) and 9 (2), hemispherical homogeneous convex microlenses 103 are arranged in a matrix on the light exit surface 102 side of the light guide plate 101 (see FIG. 9 (1) and FIG. 9 (2)). Hereinafter, it is referred to as an MLA type light guide plate 101 of the same type of convex lens).
  The MLA type light guide plate is different from the above-mentioned same type convex microlens 103 in that the same type concave lens MLA type light guide plate in which the same type concave microlenses are arranged in a matrix type exists.
[0003]
  Conventionally, the above-described MLA type light guide plate 101 of the same type of convex lens is resin-molded using a light guide plate molding die, but the above-described light guide plate molding die is as follows. Processed and formed.
  That is, although not shown, for example, first, a photoresist solution is applied and formed on the surface of the silicon base material substantially evenly to form a photoresist film (resist film), and the surface of the silicon base material is required. Then, a mask having the above pattern is polymerized, exposed and developed, and then a resist film forming portion and a resist film non-forming portion having a substantially uniform thickness (exposed portions on the surface of the silicon substrate) ) To form a required development pattern on the surface of the aforementioned silicon substrate.
  Note that the resist film forming portion is arranged in a matrix type.
  Next, the silicon substrate on which the resist film forming portion is formed is dry-etched.
  At this time, the resist film forming portion described above disappears, and a hemispherical shape corresponding to the hemispherical homogeneous convex microlens 103 in the MLA type light guide plate 101 is provided at the position of the disappearing resist film forming portion in the silicon base material. By forming the same kind of convex parts (those having the same shape), the dry-etched silicon base material can be formed as a light guide plate master.
  Next, nickel electroforming is performed on the above-described master and the above-described silicon base material is dissolved and removed, whereby the above-described nickel electroforming mold can be used to form a light guide plate molding die (split type).
  Therefore, the MLA type light guide plate 101 having the same kind of convex lens as described above can be obtained by resin molding using the light guide plate molding die (split type).
[0004]
  Moreover, although the patent publications etc. which described the prior art example mentioned above were investigated, it was not found.
[0005]
[Problems to be solved by the invention]
  By the way, the above-mentioned MLA type light guide plate 101 of the same type of convex lens has a necessary and sufficient luminance at present, but in recent years, due to the influence of excessive competition, improvement of the commercial value of the light guide plate is required. Yes.
  Therefore, as part of improving the commercial value of the light guide plate, it is required to efficiently improve the brightness of the light guide plate using the same sidelight (light source), for example, as shown in FIGS. 3 (1) and 3 (2). Such an MLA type light guide plate 1 has been studied.
  That is, as the distance from the side light source 3 side of the light guide plate 1 to the opposite side 20 of the light guide plate 1 increases, the convex microlens formed on the light output surface 2 side (microlens arrangement surface) of the light guide plate 1. An MLA type light guide plate 1 of a different type convex lens in which the shape of (ML: Micro Lens) 4 is sequentially increased has been studied.
  It is known that the MLA type light guide plate 1 of this different convex lens has improved luminance in terms of the optical design of the light guide plate, compared to the MLA type light guide plate 101 of the same type of convex lens.
  In the example shown in the drawing, the MLA type light guide plate 1 of the above-described different convex lens has a small convex microlens 4a and a middle convex microlens 4b as the distance from the side light source 3 of the light guide plate 1 increases. The convex ML4 (4a, 4b, 4c) is sequentially enlarged with the large convex microlens 4c, and the convex ML4 (4a, 4b, 4c) is arranged on the light output surface 2 side of the light guide plate 1 in a matrix type by optical design. Has been configured.
[0006]
  That is, in the above-mentioned MLA type light guide plate 101 of the same type of convex lens, as shown in FIG. 9 (1), light (indicated by an optical path 105) is incident on the small convex ML 103 a located closest to the light source 104. Is directly focused.
  Therefore, for example, since the energy (light quantity) of the light entering the ML 103a is attenuated, the light quantity of the emitted light that reaches the ML 103c that is the farthest from the light source 104 and exits from the light exit surface 102 side. The attenuation of is very large.
  On the other hand, in the MLA type light guide plate 1 of the above-mentioned different convex lens, as shown in FIG. 3 (1), it passes above the small convex ML4a at the shortest distance of the light source 3 described above. Since it is configured such that light (indicated by the optical path 5) is irradiated to the farthest large convex ML4c, each of the convex ML4 (4a, 4b, 4c) is directly and individually irradiated. can do.
  That is, in the above-described MLA type light guide plate 1 of different types of convex lenses, light is directly irradiated to the large convex ML4c which is the farthest from the light source 3 described above. Compared to the MLA type light guide plate 101, the amount of light emitted from the large convex ML4c is less attenuated.
  Therefore, the luminance of the MLA type light guide plate 1 of the above-mentioned different convex lens can be improved more efficiently than the luminance of the MLA type light guide plate 101 of the same type convex lens.
  The optical path 105 shown in FIG. 9 (1) and the optical path 5 shown in FIG. 3 (1) are schematically shown as model examples.
  In addition, as one of the types of the above-mentioned MLA type light guide plate, there are those of the same type or different types of concave lens, but, similar to the above-mentioned convex lens, compared to the above-mentioned MLA type light guide plate of the same type concave lens, The luminance of the MLA type light guide plate with the different concave lens is improved more efficiently.
[0007]
  However, in the processing method as described above, although the above-mentioned MLA type light guide plate (101) of the same type of lens can be processed and formed, the MLA type of the above-mentioned different convex lens can be formed. The light guide plate molding die for resin molding the light guide plate 1 could not be processed and formed.
  That is, the inventor of the present invention, for example, to process and form a light guide plate molding die for resin molding the MLA type light guide plate 1 of the different convex lens, for example, resist film forming portions of different thicknesses In the same way, when the dry etching is similarly performed on the silicon base material on which the silicon substrate is formed, when the thick resist film forming portion is eliminated, the thin resist film forming portion is already eliminated, and the silicon portion The amount of erosion (depth) with respect to the silicon substrate can be adjusted by adjusting the thickness of the resist film forming portion, which corresponds to the resist film forming portion. The present invention has been completed by paying attention to the fact that a convex portion having a required height and a required shape can be formed on a portion.
  Further, the inventor of the present invention is surrounded by, for example, a resist film non-formation part (exposed part of the silicon substrate) surrounded by a thin resist film formation part and a thick resist film formation part. Similarly, when dry etching is performed on the non-resist film forming portion, the non-resist film forming portion surrounded by the thin resist film forming portion is eroded shallower and surrounded by the thick resist film forming portion. It was experimentally recognized that the resist film non-formed part was deeply eroded.
  That is, by adjusting the thickness of the resist film forming portion surrounding the exposed portion of the silicon base material, the amount of erosion (depth from the surface of the silicon base material) of the silicon base material in the exposed portion is adjusted. Thus, the present invention has been completed by paying attention to the fact that a recess having a required depth and a required shape can be formed in the resist film non-formed portion.
[0008]
  Therefore, the present inventionIt is an object of the present invention to provide a method of processing a light guide plate molding die for resin-molding an MLA type light guide plate of a different lens.
[0009]
[Means for Solving the Problems]
  The method for processing a light guide plate molding die according to the present invention for solving the technical problem described above includes a step of forming a resist film having a substantially uniform thickness on a silicon substrate,
  Forming the inclined resist film on the silicon substrate by cutting the resist film having a substantially uniform thickness as described above;
  The resist film is exposed to a mask having a required pattern in a polymerized state, and the exposed resist film is developed to form an inclined resist film forming portion and a resist film non-forming portion on the surface of the silicon substrate. Forming a required development pattern;
  Corresponding to the disposition of different types of convex microlenses on the surface of the silicon substrate on the surface of the silicon substrate by forming different types of convex microlens patterns on the surface of the silicon substrate during the development pattern forming step described above. And a step of forming a required plurality of inclined resist film forming portions each having a required thickness,
  A step of annealing the silicon base material on which the required plurality of inclined resist film forming portions are formed, and
  In the annealing process, the required plurality of resist film forming portions are individually softened and melted to form a required shape corresponding to different types of convex microlenses in the light guide plate. Forming a light plate master;
  A step of depositing and forming a nickel electroforming mold by nickel electroforming the above-mentioned master, and a mold forming step of forming the remaining nickel electroforming mold as a light guide plate molding die by dissolving and removing the master. It is characterized by including.
[0010]
  In addition, the light guide plate molding die processing method according to the present invention for solving the technical problem described above has a substantially uniform thickness formed on the silicon substrate during the step of forming the inclined resist film. The step of forming an inclined resist film on the silicon substrate by performing elliptical vibration cutting on the resist film is included.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
  In the following, description will be made based on the example drawings.
[0012]
  That is, first, the first embodiment will be described with reference to FIGS. 1 (1) to (8) and FIGS. 2 (1) to (2).
  1 (1) to 1 (8) are detachably installed in a light guide plate molding die for resin molding the MLA type light guide plate of the different convex lens shown in FIGS. 2 (1) to 2 (2). In each step of the mold processing method for processing the divided mold, the above-described divided mold has different kinds of convex microlenses (convex shape) formed on the light output surface (light output portion) side of the light guide plate. ML) 4 is formed by processing a different type microlens molding surface (light emitting portion molding surface) for resin molding.
[0013]
  That is, FIG. 1A shows a photoresist film coating formation process.
  FIG. 1B is a resist film cutting process.
  FIG. 1 (3) shows an exposure process of different types of convex microlens patterns.
  FIG. 1 (4) shows an exposure resist film development process (different kinds of convex microlens pattern formation process).
  FIG. 1 (5) shows a dry etching process.
  FIG. 1 (6) is a master forming step of the mold manufacturing operation.
  FIG. 1 (7) is a nickel electroforming process (electroforming mold forming process).
  FIG. 1 (8) shows a silicon melting step (split type forming step).
  2 (1) to 2 (2) are light guide plate forming molds (divided molds) processed in FIGS. 1 (1) to (8).
  FIG. 2 (1) shows the mold clamping state of the above-described mold, and FIG. 2 (2) shows the mold open state of the above-mentioned mold.
[0014]
  First, a method for processing a light guide plate molding die (divided die) will be described with reference to FIGS.
  That is, as shown in FIG. 1A, first, a photoresist liquid is applied (spin coated) to the silicon base 6 (substrate), so that a photo of substantially uniform thickness is applied to the surface of the silicon base 6. A resist film (resist film) 7 is formed.
  Although not shown, when the resist film 7 formed on the silicon substrate 6 shown in FIG. 1A is viewed from above (plan view), a shape corresponding to the planar shape of the light guide plate 1 described above. For example, it is formed in a rectangular shape or a rectangular shape (hereinafter described as a rectangular resist film 7).
  Next, as shown in FIG. 1 (2), the resist film 7 on the silicon substrate 6 is cut by a normal cutting method with a cutting tool 8 such as a cutting tool to thereby obtain a resist having a required thickness pattern. The film, that is, the resist film 7 is formed by cutting into a pattern having a required shape corresponding to a required pattern on the light exit surface side of the MLA type light guide plate of the different type convex lens.
  In the illustrated example, the resist film 7 of the silicon substrate 6 is cut into a state (tapered) that is inclined from the one end side of the rectangular resist film 7 to the other end side that is oppositely disposed (hereinafter referred to as an inclined resist). Referred to as membrane 9).
  That is, the thickness of the resist film 9 is configured so that the right side is thicker and the left side is thinner as viewed in FIG. 1 (2), and the thickness is gradually decreased from the right side to the left side.
[0015]
  Next, as shown in FIG. 1 (3), a mask 10 having a required pattern (pattern for different types of convex lens MLA type) is polymerized on the inclined resist film 9 on the silicon substrate 6 so that Exposure 11 is performed from the mask 10 side.
  Next, by developing the silicon substrate 6 having the inclined resist film 9 (after exposure) shown in FIG. 1 (3), the surface of the silicon substrate 6 as shown in FIG. 1 (4). A plurality of required inclined resist film forming portions 12 (non-exposed portions) and non-resist film forming portions 13 (exposed portions) are formed on the surface of the above-described silicon substrate 6 so as to form different required protrusions. MLA type pattern of convex lens (convex microlens pattern for dry etching) can be formed.
  Further, since each of the inclined resist film forming portions 12 formed on the surface of the silicon base 6 is a part of the above-described inclined resist film 9, each of the resist film forming portions is similar to the above-described inclined resist film 9. 12 have different thicknesses, and the resist film forming portions 12 have different thicknesses, so that each resist film forming portion 12 has a required thickness. become.
  In the example shown in FIG. 1 (4), from the left side to the right side, the thin film is formed in order from the thinner to the thicker, that is, the thin resist film forming portion 12a and the middle resist film forming portion 12b. A thick resist film forming portion 12c is formed.
  In addition, the convex microlens pattern formed by each of the resist film forming portions 12 (12a, 12b, 12c) includes a three-dimensional arrangement of MLs based on the MLA pattern of different types of convex lenses in plan view. It consists of the size and shape of each ML viewed from the perspective.
  Accordingly, the convex microlens pattern described above can employ a configuration in which, for example, a cylindrical inclined resist film forming portion 12 having a plurality of required inclined top surfaces having different sizes is disposed.
  In addition, with respect to the cylindrical inclined resist film forming portion 12 described above, the side corresponding to the side light source 3 in the light guide plate 1 is configured to have a three-dimensionally low height, and the size of the circle in plan view. Is configured to be small.
[0016]
  Next, the silicon substrate 6 having the heterogeneous convex lens MLA type pattern shown in FIG. 1 (4), that is, the resist film forming portion 12 and the resist film non-forming portion 13 (the silicon substrate 6). 1 (5), by performing the required dry etching 14 on the exposed portion), the convex portion 15 (same size) corresponding to the microlens 4 of the light guide plate 1 described above on the silicon base 6 is obtained. And the same shape).
  At this time, although the erosion rate by the dry etching 14 is different, the resist film forming portion 12 and the exposed portion (the resist film non-forming portion) 13 of the silicon substrate 6 are simultaneously eroded (scraped). Thus, the exposed portion 13 of the silicon substrate 6 is eroded earlier than the inclined resist film forming portion 12.
  At this time, the inclined resist film forming portion 12 is first eroded from the thin resist film forming portion 12a having a small thickness and disappears sequentially, and the disappeared inclined resist film forming portion 12 is formed. The surface of the existing silicon substrate 6 is exposed.
  Further, by performing the dry etching 14 (continuously), the portion where the inclined resist film forming portion 12 in the silicon base 6 has disappeared is required to correspond to the shape of the light guide plate master described later. Form into shape.
  At this time (during dry etching with respect to the inclined resist film forming portion 12 and the portion of the silicon substrate 6 where the inclined resist film forming portion 12 is present), the resist film non-forming portion (exposed portion) 13 is eroded. By doing so, it is formed into a required shape corresponding to the shape of the light guide plate master described later.
  Therefore, by performing the dry etching 14 on the above-described inclined resist film forming portion 12 (including the portion where the inclined resist film forming portion 12 in the above-described silicon substrate 6 has disappeared) and the resist film non-forming portion 13, Since the silicon substrate 6 that has been eroded can be formed into a required shape corresponding to the shape of the light guide plate master described later, the microlens 4 of the light guide plate 1 described above on the portion of the silicon substrate 6 described above. The convex part 15 corresponding to can be formed.
[0017]
  That is, first, when the resist film forming portion 12 and the resist film non-forming portion 13 are dry etched 14 and eroded, the thin resist film forming portion 12a becomes the above-described middle resist film forming portion 12b or thick resist. It is eroded before the film forming part 12c and disappears.
  Next, by continuously performing the above-described dry etching 14, the portion (exposed portion) of the thin resist film forming portion 12a that has disappeared in the silicon substrate 6 is eroded into a required shape. Form.
  At this time, that is, when the thin resist film forming portion 12a including the corresponding silicon substrate 6 is eroded, the resist film non-forming portion 13 is eroded and formed into a required shape.
  Therefore, as shown in FIG. 1 (5), by performing the above-described dry etching 14, the small convex microlens (small convex ML) 4a of the light guide plate 1 is applied to the portion of the silicon base 6 described above. The small convex part 15a of the shape corresponding to can be formed.
  Further, when the above-described dry etching 14 is performed, first, the intermediate resist film forming portion 12b and the thick resist film forming portion 12c disappear in this order, as shown in FIG. The middle convex portion 15 b and the large convex portion 15 c are formed on the silicon base 6.
  Therefore, the light guide plate master 16 having a mold manufacturing function including the convex portions 15 (15a, 15b, 15C) described above can be formed from the silicon substrate 6.
[0018]
  Next, as shown in FIG. 1 (7), nickel electroforming is applied to the master 16 by nickel electroforming to the master 16 to form a nickel electroforming mold 17 (divided mold 18 described later). , 17 can be obtained.
  Next, the above-described nickel electroforming masters 16 and 17 can be obtained by dissolving the master 16 (silicon substrate 6) with an aqueous ammonium fluoride solution to leave the above-described electroforming mold 17 remaining.
  Therefore, as shown in FIG. 1 (8), the above-mentioned master 16 is dissolved and removed from the above-described electroforming mold 17, so that it can be detachably mounted on the nickel electroforming mold 17, that is, the light guide plate molding die. Can be obtained.
  It should be noted that the above-described split mold 18 has a cavity (concave part) 19 for molding ML4 corresponding to the above-described convex part 15, that is, a small concave part 19a, by transferring the convex part 15 of the master 16 described above. A recess 19a and a large recess 19a are provided.
[0019]
  Next, a method of resin-molding the light guide plate 1 described above using the light guide plate molding mold shown in FIGS. 2 (1) and 2 (2) will be described.
  That is, the above-described mold is composed of a fixed upper mold 21 and a movable lower mold 22 disposed opposite to the above-described fixed mold 21, and the above-described fixed mold 21 includes the above-described microlens molding cavity 19. The provided split mold 18 is configured to be detachable.
  The movable mold 22 is provided with a resin molding cavity 23, and both the molds 21 and 22 are provided with various mechanisms necessary for resin molding.
  That is, first, as shown in FIG. 2 (1), the molds 21 and 22 are clamped, and a transparent resin for forming a light guide plate is injected into the cavities 19 and 23 from a predetermined position and cooled. By solidifying, the above-mentioned different convex lens MLA type light guide plate 1 can be resin-molded in the above-described cavities 19 and 23.
  Therefore, as shown in FIG. 2 (2), the above-described light guide plate 1 can be taken out by opening both the molds 21 and 22 described above.
[0020]
  That is, in the first embodiment, as described above, the surface of the silicon substrate 6 having the required development pattern formed from the inclined resist film forming portion 12 and the resist film non-forming portion 13 having different thicknesses as described above. By performing the required dry etching 14, the convex portion 15 can be formed at the position of the inclined resist film forming portion 12 in the silicon substrate 6, so that the light guide plate master 16 can be formed. The shape of the master 16 described above can be transferred to the nickel electroforming mold 17 to form the split mold 18, and the light guide plate 1 can be resin-molded with a light guide plate molding die (the split mold 18 described above).
  Accordingly, in the present invention, the MLA type light guide plate of the different type (convex shape) lens, the light guide plate molding die for resin-molding the MLA type light guide plate of the different type lens, and the MLA type light guide plate of the different type lens. It is possible to provide a method of processing a light guide plate molding die for resin molding.
  In addition, for example, a configuration in which the thickness of the resist film forming portion 12 formed on the surface of the silicon base 6 is partially processed to a required thickness can be employed.
[0021]
  Next, a second embodiment will be described with reference to FIGS. 4 (1) to (8) and FIGS. 5 (1) to (2).
  In addition, the MLA type light guide plate of the different convex / concave lens formed by resin molding in the second embodiment is configured by providing different convex micro lenses (convex ML) on the light output surface (light output portion) side. In addition, different types of concave microlenses (concave ML) are provided on the reflective surface (reflecting portion) side.
  In the second embodiment, the processing method of the mold (split mold) for resin-molding different types of convex microlenses on the light exit surface side of the light guide plate is the same as that of the first embodiment, so the description thereof will be given. While omitted, the same components as those in the first embodiment are denoted by the same reference numerals.
  Therefore, in the second embodiment, the description will focus on the relationship between different types of concave microlenses on the reflective surface side of the light guide plate.
[0022]
  4 (1) to 4 (8) show a mold processing method for processing a split mold that is detachably mounted on a light guide plate molding mold for resin molding the MLA type light guide plate of different concave lenses. Each of the above-mentioned steps, the above-described split mold, the different concave microlens molding surface (reflecting part molding) for resin molding the different concave ML formed on the reflective surface side (microlens arrangement surface) of the above-mentioned light guide plate Surface) is processed and formed.
  That is, FIG. 4A is a photoresist film coating process.
  FIG. 4B is a resist film cutting process.
  FIG. 4 (3) shows an exposure process of a heterogeneous concave microlens pattern.
  FIG. 4 (4) shows the developing process of the exposed resist film (different concave microlens pattern forming process).
  FIG. 4 (5) shows a dry etching process.
  FIG. 4 (6) shows a master formation process (resist film removal process).
  FIG. 4 (7) shows a nickel electroforming process (electroforming mold forming process).
  FIG. 4 (8) shows a silicon melting step (split type forming step).
  5 (1) to 5 (2) are light guide plate molding dies (divided molds) processed in FIGS. 4 (1) to (8).
  FIG. 5 (1) shows the mold clamping state of the above-described mold, and FIG. 5 (2) shows the mold open state of the above-described mold.
  In addition, since the processing method of the light-guide plate shaping | molding die which forms the different convex shape ML in 2nd Example, and its metal mold | die are the same as 1st Example, as shown in FIG.5 (2), Different types of convex ML4 are formed on the light exit surface 32 side of the light guide plate 31 in the second embodiment, that is, as in the first embodiment, from the left to the right, the small convex ML4a, the middle convex ML4b, and the large A split mold 18 having a cavity 19 (concave portion) is shown in FIGS. 5 (1) and 5 (2), as in the first embodiment, while being provided in the order of convex ML4c.
  Further, as shown in FIG. 5B, the light guide plate 31 according to the second embodiment has a different concave ML33 on the reflective surface 34 side of the light guide plate 31, that is, a small concave shape from the left side to the right side. ML33a, a middle concave ML33b, and a large concave ML33c are provided in this order.
[0023]
  That is, first, as shown in FIG. 4A, a photoresist film 36 (resist film) is formed by applying (spin coating) a photoresist solution to the silicon base material 35 (substrate).
  Next, as shown in FIG. 4 (2), the resist film 36 is cut by a normal cutting method using a cutting tool 8, thereby forming an inclined resist film 37 on the surface of the silicon substrate 35. To do.
  In the illustrated example, the inclined resist film 37 is formed such that the left side is thick and the right side is thin.
  Next, as shown in FIG. 4 (3), a mask 38 having a pattern for different concave lens MLA type (on the reflective surface 34 side) is polymerized on the inclined resist film 37 on the silicon substrate 35. Exposure 39 is performed.
  Next, as shown in FIG. 4 (4), the silicon substrate 35 having the resist film 37 (after exposure) is developed, and the resist film forming portion 40 and the required plurality are formed on the surface of the silicon substrate 35. By forming a single resist film non-formation portion 41 (exposed portion of the silicon substrate), a different development pattern (a concave microlens pattern for dry etching) is formed on the surface of the silicon substrate 35. The concave lens MLA type pattern is formed.
  At this time, in the example shown in FIG. 4 (4), the resist film forming portion 40 described above is sequentially provided from the right side to the left side, from the thinnest to the thicker. (In the order of 40a, 40b, 40c, and 40d in order from the right side to the left side of the figure).
  The concave microlens pattern described above is a pattern for forming the concave portion 42 corresponding to the concave ML33 on the reflective surface 34 side of the light guide plate 31 described above.
  In the example shown in FIG. 4 (4), there is a resist film non-formation part 41 (film enclosure part) surrounded by the resist film formation part 40, and the thickness increases from the right side to the left side. Thin film surrounded portion 41a surrounded by thin resist film forming portions 40a and 40b, middle film surrounded portion 41b surrounded by a resist film forming portion having a medium thickness, and thick resist film forming portions 40d and 40c. Each of the film enclosures 41 (41a, 41b, 41c) described above is an exposed part on the surface of the silicon substrate 35.
  Further, each of the film surrounding portions 41 (41a, 41b, 41c) described above has a required depth surrounded by the resist film forming portion 40 (40a, 40b, 40c, 40d) having the required thickness described above. Each of the depressed portions (for example, a cylindrical hole portion) has a different planar size, and the bottom surface side of the depressed portion is an exposed portion (surface) of the silicon substrate 35.
  In addition, the concave microlens pattern formed by each of the film surrounding portions 41 surrounded by the resist film forming portion 40 has a three-dimensional arrangement of each ML by the MLA pattern of different types of concave lenses in plan view. And the depth of each ML and the shape of each ML.
  That is, the position and shape of each of the film surrounding portions 41 (41a, 41b, 41c) are determined by the concave microlens pattern described above.
  That is, the pattern is not limited to a planar pattern, but is a three-dimensional pattern including a plane and a depth (thickness of the resist film forming portion).
  Therefore, for the formation of the pattern (particularly, the required development pattern), for example, the planar shape of each film surrounding portion (exposed portion) formed on the surface of the silicon substrate and each of the above-described film surrounding portions And a required thickness in the resist film forming portion (required depth in the resist film non-forming portion).
[0024]
  Next, as shown in FIG. 4 (5), the silicon substrate 35 having the above-described film surrounding portion 41 is eroded separately by dry etching 42, whereby each of the above-described film surrounding portions 41 is formed. , Corresponding to the thickness of the surrounding resist film forming portion 40, that is, corresponding to the depth of the above-described film surrounding portion 41 (the above-described resist film non-formed portion or the above-described depressed portion) The recess 43 having the required depth is formed.
  That is, by subjecting each film surrounding portion 41 of the silicon base 35 to dry etching 42, each recess 43 having a required depth corresponding to each recess ML33 in the reflection surface 34 of the light guide plate 31 is formed. A master 44 can be formed.
  Therefore, as shown in FIG. 4 (5), in the above-described master 44, the above-described thin film enclosing portion 41a has a small recess 43a, the above-described intermediate enclosing portion 41b has an intermediate recess 43b, and A large concave portion 43c can be formed in the thick film surrounding portion 41c.
[0025]
  Next, as shown in FIG. 4 (6), by removing the resist film forming portion 40 (40 a, 40 b, 40 c, 40 d) on the silicon base material 35, a master 44 for mold making operation is obtained. Will be formed.
  In the example shown in FIG. 4 (6), the master 44 is shown in a state where the master 44 shown in FIG. 4 (5) is rotated at an angle of 180 degrees.
[0026]
  Next, as shown in FIG. 4 (7), nickel electroforming is performed on the master 44 described above.
  That is, by performing nickel electroforming on the master 44, nickel electroforming masters 44 and 45 can be obtained by depositing and forming a nickel electroforming mold 45 (divided mold described later) on the master 44.
  Next, by dissolving the master 44 (silicon substrate 35) from the nickel electroforming masters 44, 45 with an aqueous ammonium fluoride solution, the electroforming mold 45 can be left and obtained.
  Therefore, as shown in FIG. 4 (8), the above-mentioned master 44 is dissolved and removed from the above-described electroforming mold 45, so that it can be detachably mounted on the nickel electroforming mold 45, that is, the light guide plate molding die. Can be obtained.
  In the split mold 46, the convex portions 47 corresponding to the concave portions 43 of the master 44 (the concave shapes ML33 of the light guide plate 31) are formed.
  Therefore, the split mold 46 includes a small convex portion 47a corresponding to the small concave shape ML33a, a middle convex portion 47b corresponding to the central concave shape ML33b, and a large convex portion 47c corresponding to the large concave shape ML33c. Is provided and configured.
[0027]
  Next, a method of resin-molding the light guide plate 31 described above using the light guide plate molding mold shown in FIGS. 5 (1) and 5 (2) will be described.
  That is, the above-described mold is composed of a fixed upper mold 51 and a movable lower mold 52 disposed opposite to the above-described fixed mold 51, and the above-described fixed mold 51 includes the same as in the first embodiment. The split mold 18 provided with the microlens molding cavity 19 is configured to be detachable.
  Further, the movable mold 52 is provided with a split mold 46 having the above-described convex portions 47 in a detachable manner, and the movable mold 52 is a resin having the convex portions 47 of the split mold 46 as a part thereof. A molding cavity 53 is provided, and both the molds 51 and 52 are provided with various mechanisms necessary for resin molding.
  That is, first, as shown in FIG. 5 (1), the molds 51 and 52 are clamped and a transparent resin is injected and filled into the cavities 19 and 53 from a predetermined position to be cooled and solidified. In the above-described cavities 19 and 53, the MLA type light guide plate 31 of the above-described different lens can be resin-molded.
  Therefore, as shown in FIG. 5 (2), the above-described light guide plate 31 can be taken out by opening both the molds 51 and 52.
  In the light guide plate 31 resin-molded by the both molds 51 and 52 described above, a convex ML4 (4a, 4b, 4c) is provided on the light output surface 32 side, and a concave ML33 (on the reflective surface 34 side). 33a, 33b, 33c) are provided.
[0028]
  That is, as described above, the surface of the silicon substrate surrounded by the thin resist film (in the illustrated example, the thin film surrounded portion 41a) is eroded shallowly to form a shallow concave portion (in the illustrated example, 43a). In addition, the surface of the silicon substrate surrounded by the thick resist film (in the illustrated example, the thick film-enclosed portion 41c) is deeply eroded to form a deeply-recessed concave portion (in the illustrated example, 43c). It was found that it was formed.
  Therefore, by adjusting the thickness of the resist film surrounding the surface (film surrounding portion) of the silicon substrate that is eroded by dry etching, the depth at which the film surrounding portion is eroded can be adjusted. .
[0029]
  Further, as described above, in the second embodiment, the processing method of the split mold 18 (molds 51 and 52) for resin-molding the light exit surface side of the light guide plate 31 of the differently convex / concave lenses is the same as in the first embodiment. It is.
  Further, as described in the second embodiment, it is possible to process the split mold 46 (molds 51 and 52) for resin-molding the reflective surface 34 side of the light guide plate 31 of the above-described different convex / concave lenses.
  That is, in the above-described molds 51 and 52 (divided dies 18 and 46), the light guide plate of different convex and concave lenses having the required convex ML4 on the light exit surface 32 side and the required concave ML33 on the reflecting surface 34 side. 31 can be resin-molded.
  Therefore, in the second embodiment, the MLA type light guide plate of the different lens capable of improving the luminance efficiently, the light guide plate molding die for resin molding the MLA type light guide plate of the different type lens, and the different type of the above described It is possible to provide a method of processing a light guide plate molding die for resin molding a lens MLA type light guide plate.
  In order to mold a light guide plate molding die for resin molding a light guide plate having the same type of concave microlenses, a silicon substrate 35 having a resist film forming portion (resist film) having a substantially uniform thickness is formed. What is necessary is just to employ | adopt the structure which forms the required several depression part (resist film non-formation part 41) of the same depth.
[0030]
  Next, a third embodiment (annealing method) will be described with reference to FIGS.
  FIG. 6A shows a photoresist film coating process.
  FIG. 6B is a resist film cutting process.
  FIG. 6 (3) shows an exposure process of a different microlens pattern.
  FIG. 6 (4) shows the developing process of the exposed resist film (different microlens pattern forming process).
  FIG. 6 (5) shows an annealing process.
  FIG. 6 (6) is a nickel electroforming process (electroforming mold forming process).
  FIG. 6 (7) is a process of removing the master and forming a split mold (light guide plate molding mold).
  FIG. 6 (8) shows a light guide plate formed by resin molding using a light guide plate molding die.
[0031]
  That is, as shown in FIG. 6 (8), the MLA type light guide plate 61 of the different type convex lens formed by resin molding in the third example is similar to the first example on the light output surface 62 (light output part) side. Are provided with different types of convex microlenses 63 (convex ML).
  In the example shown in FIG. 6 (8), the small convex ML63a, the middle convex ML63b, and the large convex ML63c are arranged in this order from the left to the right.
[0032]
  First, as shown in FIG. 6A, a photoresist film 65 is formed by applying (spin coating) a photoresist solution to a silicon base material 64 (substrate).
  Next, as shown in FIG. 6 (2), the resist film 65 is cut by a normal cutting method using a cutting tool 8 to form an inclined resist film 66 on the surface of the silicon substrate 64. To do.
  In the illustrated example, the inclined resist film 66 is formed such that the right side is thick and the left side is thin.
  Next, as shown in FIG. 6 (3), a mask 67 having a different type of convex lens MLA type pattern (for the light output side) is polymerized on the inclined resist film 66 on the silicon base 64. Then, exposure 68 is performed.
  Next, as shown in FIG. 6 (4), the silicon substrate 64 having the above-described exposed photoresist film (65) is developed, and a plurality of required resist film forming portions 69 are formed on the surface of the silicon substrate 64. And a resist film non-formation portion 70 (exposed surface of the silicon base material 65) are formed on the surface of the silicon base material 64, and a convex microlens pattern for annealing (a different type of convexity) as a required development pattern. Shaped lens MLA type pattern).
  At this time, in the example shown in FIG. 6 (4), the resist film forming portion 69 described above is sequentially formed from the left side toward the right side, and the thin resist film forming portion sequentially from the thinner to the thicker. 69a, a middle resist film forming portion 69b, and a thick resist film forming portion 69c are formed, and each of the resist film forming portions 69 has a required thickness.
  For example, the above-described convex microlens pattern resist film forming portion 69 may have a cylindrical shape having an inclined top surface.
[0033]
  Next, as shown in FIG. 6 (5), the silicon substrate 64 having the resist film forming portion 69 is annealed (heated) at a predetermined temperature.
  At this time, each of the resist film forming portions 69 (69a, 69b, 69c) is heated and melted to have a required shape (the same shape as the microlens 63 formed on the light exit surface 62 of the light guide plate 61). ) It is configured to be softened and melted separately.
  In the example shown in FIG. 6 (5), the hemispherical convex portion 71 is formed from the left side to the right side in the order of the small convex portion 71a, the middle convex portion 71b, and the large convex portion 71c. This corresponds to the different convex ML63 in the light guide plate 61, that is, the small convex ML63a, the middle convex ML63b, and the large convex ML63c described above.
  Therefore, the master 72 can be formed by the above-described silicon base 64 and the convex portion 71 (annealed resist film forming portion).
  Next, as shown in FIG. 6 (6), nickel electroforming 73 (split die 74) is attached to the master 72 by electroforming nickel onto the convex portion 71 forming side of the silicon base 64. The nickel electroforming masters 72 and 73 can be obtained by forming them.
  Next, as shown in FIG. 6 (7), the above-described nickel electroforming masters 72 and 73 to the master 72 portion, that is, the silicon base 64 and the convex portion 71 (annealed resist film forming portion). Is dissolved with an aqueous ammonium fluoride solution, and the above-described electroforming mold 73 can be left to obtain a split die 74 (light guide plate molding die).
  Further, the split mold 73 is provided with a microlens molding cavity (concave portion) 75 as in the first embodiment.
  That is, as shown in 6 (7), the split mold 74 has a small concave portion 75 a and a middle concave portion 75 b corresponding to the small convex ML 63 a, the middle convex ML 63 b, and the large convex ML 63 c in the light guide plate 61, respectively. The large recess 75c is provided.
  Therefore, similarly to the first embodiment, in the third embodiment, the light guide plate 61 of the different lens can be resin-molded by the mold for forming the light guide plate in which the split mold 73 is detachably mounted. .
[0034]
  That is, in the third embodiment, for example, each resist film forming portion 69 (69a, 69b, 69c) on the silicon substrate 64 is annealed and softened and melted, so that hemispherical protrusions are formed on the silicon substrate 64. The master 72 can be formed by forming the part 71 (71a, 71b, 71c) and the above-described convex part 71 and the silicon substrate 64.
  Accordingly, in the present invention, the MLA type light guide plate 61 of a different type (convex) lens, the light guide plate molding die for resin molding the MLA type light guide plate 61 of the different type lens, and the MLA type of the different type lens described above. It is possible to provide a method of processing a light guide plate molding die for resin molding the light guide plate.
[0035]
  Further, in each of the above-described examples, the configuration in which the inclined resist film is formed by cutting the resist film applied to the above-described silicon substrate using the above-described cutting tool 8 by a normal cutting method is illustrated. Instead of the above-described normal cutting method, cutting may be performed using an elliptical vibration cutting method.
  That is, the elliptical vibration cutting method can cut the resist film into a fine shape as compared with the normal cutting method, so that a light guide plate forming die (divided die) having a fine shape can be processed. In addition, the light guide plate having a fine shape can be molded with resin.
[0036]
  Next, the above-described elliptical vibration cutting method will be described with reference to FIG.
  That is, the example of the elliptical vibration cutting shown in FIG. 7 is a configuration in which a work material 81 such as a steel material or a plastic material is cut with a predetermined cut thickness 82, and the work material 81 (material) described above is formed into an oval shape. An elliptical vibration cutting device is used for vibration cutting.
  Further, the above-described elliptical vibration cutting device includes, for example, a piezoelectric element (not shown) that applies vibration to the cutting edge of a cutting tool 8 such as a cutting tool in the X direction or in the X direction, and the XY two directions. In the piezoelectric element for generating vibration, a sinusoidal voltage can be input separately at a predetermined voltage, a predetermined frequency (for example, an ultrasonic region), and a predetermined phase difference (for example, 90 degrees). It is configured.
  Therefore, in the above-described elliptical vibration cutting device, the above-described cutting is performed by mechanically resonating and synthesizing the vibrations generated in the two directions of XY described above by inputting predetermined sine wave voltages to the respective piezoelectric elements. An elliptical vibration locus 83 having a predetermined period can be generated at the cutting edge of the tool 8.
  In FIG. 7, the aforementioned X direction corresponds to the cutting direction A and the main component force direction B, and the aforementioned Y direction corresponds to the back component force direction D.
  That is, as shown in FIG. 7, first, the workpiece 81 is cut in the main component force direction B (left direction in the illustrated example) with the cutting tool 8 according to the locus 83 of the elliptical vibration, The cutting tool 8 is separated from the work material 81 in the back component force direction D (upward in the illustrated example).
  At this time, the chips 84 cut from the above-described work material 81 are pulled up in the above-described back force direction D (upward in the illustrated example) by the above-described cutting tool 8 (the cutting edge). The chip 84 flows out in the chip outflow direction E.
  That is, in the above-described cutting by the elliptical vibration cutting method, the frictional resistance is reduced or reversed (negative frictional resistance) as compared with the normal cutting method.
  Accordingly, the cutting resistance of the work material 81 with respect to the cutting tool 8 is reduced, and the cutting force of the cutting tool 8 can be reduced, so that the machinability is improved.
  Next, the cutting tool 8 is separated from the chip 84 in the main component force direction B (rightward in the example), and the cutting tool is moved in the back component force direction D (downward in the example). That is, it is moved to the work material 81 side.
  That is, the above-described work material 81 can be machined by elliptical vibration cutting by periodically vibrating the cutting tool 8 according to the elliptical vibration locus 83 by the above-described elliptical vibration cutting method. It is configured as follows.
  Therefore, in the above-described elliptical vibration cutting method, the thickness of the chip 84 described above is reduced, the cutting resistance is reduced, and the surface of the workpiece 81 is compressed and deformed as compared with the normal cutting method. To prevent embrittlement efficiently, to allow mirror finishing, to extend the life of the cutting tool 8 described above, to improve the accuracy of the machining shape, and to suppress flash. There are advantages such as chatter vibration being prevented and cutting heat (friction heat) being reduced.
  In FIG. 7, reference numeral 85 denotes a shear angle. When the shear angle 85 is increased, the machinability of the work material 81 is improved.
[0037]
  The work material 81 corresponds to the resist films 6, 36, 65 shown in the respective embodiments.
  Further, in the drawings of the respective embodiments described above, an elliptical vibration locus 83 is shown in the vicinity of the cutting tool 8 for performing the elliptical vibration cutting of the resist films 6, 36, 65 described above.
[0038]
  In addition, when forming a photoresist film on a silicon substrate, for example, by applying a photoresist solution to the silicon substrate using a spin coater for applying a photoresist solution (spin coating), the surface of the silicon substrate is coated. A photoresist film is formed.
  That is, the spin coater device is provided with a rotating plate for mounting the silicon substrate, and the surface of the silicon substrate is formed in a state where the rotation center position of the rotating plate and the silicon substrate are polymerized. A resist film (having a substantially uniform thickness) is formed by applying a photoresist solution to the substrate and rotating the rotating plate.
  In each of the above embodiments, when the inclined resist film is formed on the silicon substrate, for example, the inclined resist film is formed by cutting the coated resist film formed on the silicon substrate surface with a cutting tool. ing.
  In other words, in each of the above embodiments, the above-described inclined resist film is formed in a two-step process.
[0039]
  In each of the above embodiments, when the inclined resist film is formed on the silicon substrate, the inclined resist film described above is formed by the resist film application process and the cutting process described above. A forming method can be adopted.
  That is, first, the silicon substrate is placed on the rotating plate of the spin coater without being superposed on the rotation center position of the rotating plate, and a photoresist solution is applied to the surface of the silicon substrate. By rotating the rotating plate in a state where the rotation center position and the silicon base material coated with the photoresist liquid are not polymerized, a centrifugal force acting in one direction on the photoresist liquid is formed on the silicon substrate. ) An inclined resist film is formed.
  Therefore, since the cutting process can be omitted in the above-described inclined resist film forming method, the productivity of the light guide plate forming mold (divided mold) can be efficiently improved in each of the above embodiments. Can do.
[0040]
  Further, in each of the above-described embodiments, when exposed and developed, the configuration in which the exposed portion of the resist film (resist film non-formed portion) is developed and removed is exemplified, but the configuration in which the exposed portion of the resist film is developed and removed. It may be adopted.
[0041]
  Next, the fourth embodiment will be described with reference to FIGS.
  For example, in the above-described first embodiment, the nickel electroforming mold 17 (the above-described divided mold 18) is processed and formed. However, instead of the above-described master 16 (silicon substrate 6), the nickel that becomes the above-described divided mold 18 is used. A configuration in which a large number of nickel electroforming masters 86 (mothers) are formed from one electroforming mold 17 (father) can be employed.
  That is, first, as shown in FIG. 8 (2), a release agent is applied to the side where the concave portion 19 of the nickel electroforming mold 17 (the above-described split mold 18) is formed to form a release layer 87, The nickel electroforming 17 is subjected to nickel electroforming to form an electroforming mold 86 (mother), and then released from the release layer 87, whereby the above-described electroforming mold 86 mother) is used in the first embodiment. Master 16 can be used.
  Next, by forming a release layer on the electroforming mold 91 (mother) and electroforming nickel, it is possible to form an electroforming mold (sun) having the same shape as the divided mold 18 described above.
  Therefore, by processing and forming a large number of the nickel electroforming masters 86 (mothers), it is possible to easily and efficiently process the split molds 18 and to improve the productivity of the light guide plate forming mold. Can be improved.
  FIG. 8 (1) shows the nickel electroforming mold 17 formed in the first embodiment.
[0042]
  The present invention (each of the above-described embodiments) can also be applied to an MLA type light guide plate of the same type of lens, the light guide plate shaping die, and a method of processing the die.
[0043]
  The present invention is not limited to the above-described embodiments, and can be arbitrarily modified and selected as necessary within a range not departing from the gist of the present invention. It is.
[0044]
【The invention's effect】
  According to the present invention,The present invention provides an excellent effect that it is possible to provide a method of processing a light guide plate molding die for resin-molding an MLA type light guide plate of a different lens.
[Brief description of the drawings]
1 (1) to 1 (8) are schematic longitudinal sectional views schematically showing each step in a mold processing method according to the present invention.
FIGS. 2 (1) to 2 (2) are schematic longitudinal sectional views schematically showing each step of resin-molding a light guide plate using a mold processed by the mold processing method according to the present invention. is there.
FIG. 3 (1) is a schematic front view schematically showing a light guide plate according to the present invention, and FIG. 3 (2) is a schematic front view schematically showing a light guide plate according to the present invention. is there.
4 (1) to 4 (8) are schematic longitudinal sectional views schematically showing each step in another mold processing method according to the present invention.
FIGS. 5 (1) and (2) are schematic longitudinal cross-sectional views schematically showing each step of resin-molding a light guide plate using a mold processed by another mold processing method according to the present invention. Surface.
6 (1) to 6 (7) are schematic longitudinal cross-sectional views schematically showing each step of resin-molding a light guide plate using a mold processed by another mold processing method according to the present invention. FIG. 6 (8) is a schematic longitudinal sectional view showing a light guide plate formed by resin molding using the mold shown in FIGS. 6 (1) to (7).
FIG. 7 is a schematic front view schematically showing a die processing method according to the present invention.
FIGS. 8 (1) to (3) are schematic longitudinal sectional views schematically showing each step in another mold processing method according to the present invention.
FIG. 9 (1) is a schematic front view schematically showing a conventional light guide plate, and FIG. 9 (2) is a schematic front view schematically showing a conventional light guide plate.
[Explanation of symbols]
  1 Light guide plate (different kind of convex lens)
  2 Light emitting surface (light emitting part)
  3 Side light source
  4 Convex microlens (convex ML)
  4a Small convex microlens (small convex ML)
  4b Medium convex microlens (Medium convex ML)
  4c Large convex microlens (large convex ML)
  5 Light path
  6 Silicone substrate (substrate)
  7 Photoresist film
  8 Cutting tools
  9 Inclined resist film
10 Mask
11 Exposure
12 Inclined resist film forming part
12a Thin resist film forming part
12b Middle resist film formation part
12c thick resist film formation part
13 Resist film non-formation part (exposed part)
14 Dry etching
15 Convex part (master)
15a Small convex part (master)
15b Middle convex part (master)
15c Large convex part (master)
16 Master
17 Electric mold
18 Split type
19 Cavity (concave)
19a Small recess (split type)
19b Middle recess (split type)
19c Large recess (split type)
20 Opposite side of side light source
21 Fixed upper mold
22 Movable lower mold
23 cavity
31 Light guide plate (Different convex / concave lens)
32 Light emission surface (light emission part)
33 Concave microlens (concave ML)
33a Small concave microlens (concave ML)
33b Medium concave microlens (concave ML)
33c Large concave microlens (concave ML)
34 Reflective surface (reflective part)
35 Silicone substrate
36 Photoresist film
37 Tilted resist film
38 mask
39 Exposure
40 Inclined resist film forming part
41 Resist film non-formation part (film surrounding part or exposed part)
42 Dry etching
43 Recess (Master)
43a Small recess (master)
43b Inner recess (master)
43c Large recess (master)
44 Master
45 Electric mold
46 Split type
47 Convex part (split type)
47a Small convex part (split type)
47b Middle convex part (split type)
47c Large convex part (split type)
51 Fixed upper mold
52 Movable lower mold
53 cavity
61 Light guide plate
62 Light-emitting surface
63 Convex microlens (convex ML)
63a Small convex microlens (small convex ML)
63b Medium convex microlens (Medium convex ML)
63c Large convex microlens (large convex ML)
64 Silicon substrate (substrate)
65 Photoresist film
66 Tilted resist film
67 Mask
68 Exposure
69 Inclined resist film forming part
69a Thin resist film forming part
69b Middle resist film formation part
69c thick resist film forming part
70 Resist film non-formation part (exposed part)
71 Convex
71a Small convex part
71b Middle convex part
71c Large convex part
72 Master
73 Electric mold
74 Split type
75 Cavity
75a small recess
75b Middle recess
75c large recess
81 Work material
82 Cut thickness
83 Trajectory of elliptical vibration
84 Chips
86 Nickel electric mold (mother)
87 Release layer
A Cutting direction
B Main component force direction
C Feeding force direction
D Back force direction
E Chip discharge direction

Claims (2)

Forming a resist film having a substantially uniform thickness on a silicon substrate;
  Forming the inclined resist film on the silicon substrate by cutting the resist film having a substantially uniform thickness as described above;
The resist film is exposed to a mask having a required pattern in a polymerized state, and the exposed resist film is developed to form an inclined resist film forming portion and a resist film non-forming portion on the surface of the silicon substrate. Forming a required development pattern;
Corresponding to the disposition of different kinds of convex microlenses on the surface of the silicon substrate on the surface of the silicon substrate by forming different kinds of convex microlens patterns on the surface of the silicon substrate during the development pattern forming step described above. And a step of forming a required plurality of inclined resist film forming portions each having a required thickness,
A step of annealing the silicon base material on which the required plurality of inclined resist film forming portions are formed, and
In the annealing process, the required plurality of resist film forming portions are individually softened and melted to form a required shape corresponding to different types of convex microlenses in the light guide plate. Forming a light plate master;
  A process of depositing and forming a nickel electroforming mold by nickel electroforming the above-mentioned master;
  A method of processing a light guide plate molding die, comprising: a mold forming step of remaining forming the nickel electromold as a light guide plate molding die by dissolving and removing the master. Performing the step of forming the inclined resist film on the silicon substrate by performing elliptical vibration cutting of the resist film having a substantially uniform thickness formed on the silicon substrate during the step of forming the inclined resist film; The processing method of the metal mold | die for light-guide plate shaping | molding of Claim 1 characterized by the above-mentioned.

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