TW552237B - Molding apparatus for mass production of duplications having thereon a micro-pattern - Google Patents

Molding apparatus for mass production of duplications having thereon a micro-pattern Download PDF

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Publication number
TW552237B
TW552237B TW92100567A TW92100567A TW552237B TW 552237 B TW552237 B TW 552237B TW 92100567 A TW92100567 A TW 92100567A TW 92100567 A TW92100567 A TW 92100567A TW 552237 B TW552237 B TW 552237B
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Taiwan
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mold
micro
metal
present
microstructure
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TW92100567A
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Chinese (zh)
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TW200412322A (en
Inventor
Tien-Yu Chou
Jyh-Huei Lay
Irene Chen
Jo-Wen Wu
Yan-Heng Lin
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Tech Media Corp U
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Publication of TW200412322A publication Critical patent/TW200412322A/en

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Abstract

The present invention is concerned with an improved molding apparatus for mass production of a variety of plastic or metal duplications having thereon a micro-pattern to the scale of micron or sub-micron. The present invention is suited for the applications such as micro-pitch CD disks manufacturing or bio-chips.

Description

552237 五、發明說明(1) 發明所屬之技術領域 本發明係關於具有微結構或複製圖案之模仁製作技 術及其模具結構’尤指一種具高良率、高生產效率、低 成本之微結構模仁製作技術及其模具結構。本發明的優 點在於可以大幅減少模仁加工時間、費用,並克服機械 精密加工尺寸精度的極限。本發明將微結構以黃光微影 製程竺電鑄轉移至金屬薄板:再將金屬薄板與模仁接 合’可運用於大量複製性生產,例如具有微結構之光碟 片或生物晶片等等。此外,透過黃光製程更可以在一片 轉印模版(stamper)上製作出複雜微圖案 (micro-pat ter η)或多模結構,在一模多穴的實際生產效 能更是大幅提升。 ^ 先前技術 一般大量複製性生產中若要能延伸或改變功能以生 產新產品,皆需要開發新模 過程中,不管是時間或是費 費。而傳統成型技術是將所 (CNC、FMS、雕模機等)加工 產品逐漸走向微小化,傳統 級以下的微細結構。為因應 將既有量產型複製機台作更 具。在開發、設計新模具的 用上均會造成一定程度的浪 要的成品形狀以機械方式 於模具、模仁上。但近年來 機械加工已無法加工微米等 未來產品微小化的潮流以及 有效利用,並且避免將時間552237 V. Description of the invention (1) The technical field to which the invention belongs The present invention relates to the manufacturing technology of mold cores with microstructures or replicated patterns and the mold structure thereof, especially a microstructure mold with high yield, high production efficiency and low cost Ren manufacturing technology and its mold structure. The advantages of the present invention are that it can greatly reduce the processing time and cost of mold cores, and overcome the limit of dimensional accuracy of mechanical precision machining. In the invention, the microstructure is transferred to the metal sheet by electro-forming in a yellow light lithography process: the metal sheet is then combined with the mold core ', which can be applied to a large number of reproducible productions, such as optical discs or biochips with microstructures. In addition, through the yellow light process, complex micro-patterns or multi-mode structures can be made on one stamper, and the actual production efficiency of one-mode multi-cavity is greatly improved. ^ Prior technology Generally, in order to be able to extend or change functions to produce new products in mass replication production, it is necessary to develop new molds, regardless of time or cost. The traditional molding technology is to gradually reduce the processed products (CNC, FMS, engraving machine, etc.) to miniaturization, and the fine structure below the traditional level. In order to respond to the existing mass production type replication machine. In the development and design of new molds, it will cause a certain degree of wave. The finished product shape is mechanically applied to the molds and mold cores. However, in recent years, mechanical processing has been unable to process micron and other future product miniaturization trends and effective use.

第10頁 552237 五、發明說明(2) 與金錢浪費於重新開發模具 鐘於此,申请人乃根據此傳統機械 之缺點及依據多年從事製造該類產品之 工所無法克服 觀察且研究之,而提出可以具有微=構,關經驗,悉心 之本發明,以降低生產成本,並增加產=仁之製作技術 發明以既有的複製型機台模具,^用金f以及良率。本 有〜微圖案之金屬薄板與模仁结合。鼓f接著技術將具 開發模—具的—時間—以及成本,並—可達到|〜由本發明可節省 目的。 &造微結構產品的 發明内容 構產 精密 痒級 微結 圍就術經 與模 將模 模多 本發 品 8^· 加工 ,要 構產 相當 電鑄 仁以 仁置 穴之 明的目的,在於解決既 所遇到之瓶頸。傳統大 尺寸、精度,一般微結 以機械加工(CNC、FMS 品相當困難,主要是因 於微結構產品尺寸範圍 將微結構圖案轉移至金 金屬接著技術結合,即 於模穴中即可大量複製 作法更可以顯現出本發 #複製型棬a曰 量生產i機台量產 構產品κ ^受限於 、雕楔機等^約在 。:)加工容許誤 ^此結合黃光微 ’溥板,再將金屬 了完成模仁製作。 出所要的成品。尤 明之優越性。 微結 模仁 微米 出具 差範 影技 薄板 最後 其一Page 10 552237 V. Description of the invention (2) and money wasted in re-developing the mold clock. The applicant is based on the shortcomings of this traditional machine and based on the years of laboratories engaged in manufacturing this type of products. It is proposed that the invention can have microstructure, related experience, and careful invention to reduce the production cost, and increase the production technology of the invention to the existing replica machine mold, using gold f and yield. The thin metal plate with ~ pattern is combined with the mold core. The drum-following technology will have a development model—a tool—a time—and a cost, and—which can achieve the purpose of saving by the present invention. & Summary of the invention of micro-structured products The production of precision itching-grade micro-encapsulation surgery techniques and molds will produce a large number of hair products 8 ^ · Processing. Solve the bottlenecks encountered. Traditional large size and precision, micro-junctions are usually machined (CNC, FMS products are quite difficult, mainly because the micro-structure product size range is transferred to gold metal and then the technology is combined, that is, a large number of copies can be copied in the mold cavity The practice can also show that this hair #copy type 棬 a mass production i machine mass production structure products κ ^ Limited to, wedge engraving machine, etc. ^ about. :) Processing tolerances ^ This combined with Huang Guangwei '溥 plate, and then The metal is finished to make the mold. The desired finished product. You Ming's superiority. Micro-junction, mold kernel, micron, difference film, thin sheet, last one

第11頁 552237 五、發明說明(3) 本發明捨棄一般傳統機械加工而改採用轉印模版固 接(Stamper Mount ing)模仁的方式,確實可將微結構圖 形轉移到模具產出成品。 本發明可廣泛應用於目前具複雜微結構的產品,如 導光板、微鏡陣列結構(micro-lens array)、生物晶片 等。配合微影技術,未來更可將應用範圍擴大於生產奈 米級產品。 ---———----一 —___ _ __ _ 為讓本發明之上述目的、特徵、和優點能更明顯易 懂’下文特舉一較佳實施例,並配合所附圖式,作詳細 說明如下。 實施方式 請參閱圖一,圖一為本發明金屬接著技術之剖面示 意圖。在模仁製作的過程中,最重要的是需考慮到未來 產品成型的影響以及接著效果,以免影響了成品微結構 的品質。所以必須加壓以維持模仁表面的平整度。然 而’一般的加壓方式易損傷金屬薄板表面微結構。如圖 了所示’在本發明中所使用的金屬接著技術是先將金屬 薄板1 0,例如鎳板,以及模仁1 2表面電鍍銅金屬層1 4, 接著在兩鋼金屬層1 4間填上銦(I η )或銦合金之中間接合 層16,加熱至20 0°C〜40 (TC、加壓至300〜40 〇kg/cm2 (以Page 11 552237 V. Description of the invention (3) The present invention abandons the general traditional machining and adopts the transfer mold mounting (Stamper Mounting) mold kernel, which can indeed transfer the microstructure pattern to the mold to produce the finished product. The invention can be widely applied to products with complex microstructures at present, such as light guide plates, micro-lens arrays, biological wafers, and the like. With lithography technology, the scope of application can be expanded to produce nano-grade products in the future. ---———---- 一 —___ _ __ _ In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, 'a preferred embodiment is given below, in conjunction with the accompanying drawings, A detailed description is as follows. Embodiment Please refer to FIG. 1. FIG. 1 is a schematic cross-sectional view of the metal bonding technology of the present invention. In the process of making mold cores, the most important thing is to consider the impact of future product molding and subsequent effects, so as not to affect the quality of the finished microstructure. Therefore, pressure must be applied to maintain the flatness of the mold surface. However, the general pressing method easily damages the surface microstructure of the metal sheet. As shown in the figure, the metal bonding technology used in the present invention is to first plate a thin metal plate 10, such as a nickel plate, and the surface of the mold core 12 with a copper metal layer 14 and then between two steel metal layers 14 Fill in the intermediate bonding layer 16 of indium (I η) or indium alloy, and heat to 20 ° C ~ 40 (TC, pressurize to 300 ~ 40 〇kg / cm2 (to

第12頁 552237Page 552 237

五、發明說明(4) 磁力、機械力等形式)將兩金屬層1 4黏著固接。上述接人 法僅為本發明之一較佳實施例,該行業者可參酌本發明σ 而可採用其它等同之接合法,達到與本發明之相同^ 的’例如以超強膠黏合、以機械方式鎖接,本發明並不 限定金屬薄板1 〇以及模仁1 2之接合法。金屬接合之接合 力強,因此一般建議使用此方法D此外,亦可以用加熱 方式將中間接合層1 6熱融後,將金屬薄板丨〇以及模仁” 分離,達到再利用之目的。 請參閱圖二及圖三,其中圖二為本發明以磁力吸附 ,免微結構損壞之示意圖,圖三為本發明以機械壓板固 疋以避免微結構損壞之示意圖。為避免將微結構破壞, 本發明乃採用以下設計: 1·在金屬模仁22下方放置磁鐵24,或其它磁力源,將最 上層金屬薄板2 0吸住。使金屬薄板2 〇固定在正確位置, ^^所示。金屬模仁22固定於一模具28的模穴29中。 金屬薄板2 0與模仁2 2之間為一銦金屬層2 6。 =·以機械方式固定。如圖三所示,金屬模仁2 2固定於一 二^ 28的模穴29中。金屬薄板20與模仁22之間為一銦金 从曰2 6。以機械壓板3 〇在轉印膜板2 〇表面具有微結構以 外之區域,例如週邊區域,施加壓力。 所ία &金對於金屬的接著效果好,同時熱傳導性 貝 將各種金屬薄板黏著於模仁之後並不會因為複製V. Description of the invention (4) Magnetic force, mechanical force, etc.) The two metal layers 14 are adhered and fixed. The above access method is only one of the preferred embodiments of the present invention. Those skilled in the art may refer to the invention σ and may use other equivalent joining methods to achieve the same as the present invention ^ such as bonding with super strong glue, mechanical The method of locking, the present invention is not limited to the joining method of the metal sheet 10 and the mold core 12. Metal bonding has a strong bonding force, so this method D is generally recommended. In addition, the intermediate bonding layer 16 can also be heated by heating to separate the metal sheet 丨 〇 and the mold core ”to achieve the purpose of reuse. See also Figures 2 and 3, of which Figure 2 is a schematic diagram of the present invention using magnetic force to avoid microstructure damage, and Figure 3 is a schematic diagram of the present invention using a mechanical plate to fix the microstructure to avoid damage to the microstructure. To avoid damage to the microstructure, the present invention The following design is used: 1. Place a magnet 24 or other magnetic force source under the metal mold core 22 and suck the top metal sheet 20. Fix the metal sheet 20 at the correct position, as shown in ^^. 22 is fixed in the cavity 29 of a mold 28. An indium metal layer 26 is formed between the metal sheet 20 and the mold core 22. = · Mechanically fixed. As shown in FIG. 3, the metal mold core 2 2 is fixed In the mold cavity 29 of one ^ 28. Between the metal sheet 20 and the mold core 22 is an indium gold from 26. A mechanical platen 3 has a region other than the microstructure on the surface of the transfer film plate 20, such as In the surrounding area, apply pressure. Ία & Gold has a good adhesion to metal, and also has thermal conductivity. After bonding various metal sheets to the mold core, it will not be copied.

第13頁 552237Page 13 552237

性機台的往復作用而造成脫落或者位移。Due to the reciprocating action of the machine, it may cause falling or displacement.

本發明係結合微機電技術與金屬接著技術,改一 =模具、模仁的製作方式,並可生產出具微、奈米 結構產品。不同於習知以機械加工於模仁方式,而是 微影製程後經電鑄具有微結構的金屬薄板,利用金屬接 著方式固定於模仁上,最後使用射出機、熱壓機、壓 機等上種複製型成形機器大量生產。本發明不僅可以排 除巧械加工極限,同時製作方式簡單,在不改變現有模-具条j冓下即可以生產具微結構的產品,並可製作複雜性 高的微結構成品,利用本發明可成功將各種具微結構產 於產^,例如導光板(LGP)、micr〇—lens array等,並可 達轉寫率、高自動化之生產製程。其應用領域將包 枯金屬結構之成型模具,應用本模仁製造技術之方法, 皆可產生微結構模仁,尤以應用在工業用複製性生產技 術下,需微結構模仁之模具者,應用本模仁製造技術之 方法,除可產生微結構模仁,更可因具置換式模仁功 能’而發展多元化之產品。 請參閱圖四,圖四為本發明一模多穴應用之示意 圈^本發明利用金屬薄板黏著於模仁之技術,可應用在 〆模多穴之作法更可以顯現出本發明之優越性。如圖四 所不’複製性機台4 0,例如射出機、熱壓機、壓鑄機 等’包含有一上模42、一下模44,以友複數個與具有相The invention combines micro-electromechanical technology and metal bonding technology, and changes the manufacturing method of molds and mold cores, and can produce products with micro and nano structures. Different from the conventional method of mechanically processing the mold core, but after the lithography process, a metal sheet with a microstructure is electroformed and fixed to the mold core by metal bonding. Finally, an injection machine, a hot press, a press, etc. Mass production of the above replication-type forming machines. The invention can not only eliminate the limit of mechanical processing, but also has a simple production method. It can produce microstructured products without changing the existing mold-strip j, and can produce highly complex microstructured finished products. Successfully produced a variety of microstructures in production, such as light guide plate (LGP), micr0-lens array, etc., and can achieve the transfer rate, high-automation production process. Its application field will be forming molds with clad metal structure, and the method of manufacturing technology of this mold kernel can produce microstructure mold kernel, especially for industrial replicating production technology, who need microstructure mold kernel, In addition to the production of microstructure mold cores, this method of mold core manufacturing technology can also develop diversified products due to the function of replacement mold cores. Please refer to FIG. 4. FIG. 4 is a schematic diagram of a multi-cavity application of the present invention. ^ The present invention uses a thin metal plate to adhere to the mold kernel. The method can be applied to the multi-cavity of the mold to show the superiority of the present invention. As shown in Figure 4, “reproducible machine 40, such as injection machine, hot press, die casting machine, etc.” includes an upper mold 42 and a lower mold 44.

第14頁 552237 五、發明說明(6) 同或不同微結構金屬薄板(或稱為轉印模版staraper)固接 之模仁46分別置於相對應之模穴49内。以塑膠射出成型 為例,塑膠經熱擠壓由上模42塑膠射出口(未顯示)射 出,經由流道48分別流至流穴49,再經由下模46内之冷 部系統(未顯示)冷卻成型。需強調的是,本發明並不僅 僅限於應用在塑膠射出成型領域,金屬成型,例如鎮合 金成型,或其它可以融鎔態轉印壓製而需有微結構於其 上之複製性產品皆為本發明之應用範_。 请參閱圖五’圖五為本發明上下模模具合模之示音 圖。如圖五所示,業界-般使用之模具服以直立^ 主,上模52在使用時會與下模54緊密結合,而與轉印模 版結合之f仁5 6及容置於上模5 2所提供之模穴5 9中。塑 膠經熱撥壓經由箭頭所示方向由上模52的射出口注入模 穴5 9中。此外,依據本發明之另一較佳實施例,上模亦 可以设置相對應之模仁,其上亦接合有具有微結構之轉 印模版’如此即可製程兩面皆具有微細結構之複製性產 品’例如雙面微結構或者據有微通道之生物晶片。 、 請參閱圖六,圖六顯示本發明另一較佳實施例之側 視圖。本發明亦可使用單一片轉印模版6 0,其上有複數 個微結構^案區6丨,使轉印模版6 〇直接以上述金屬接合 方式與:模6 4藉由接合層6 3接合,而不使用模仁。塑膠 可經由設置於上模62下端面之流道66流至相對應之模穴 552237_^_____ 五、發明說明(7) 67中。 綜上所=,本發明的好處為可大幅節省模具開發時 間與費用。若生產新產品,只需將模穴中的模仁置換即 <。也就是説不需要大幅度變更模具設計,只要將模仁 取出,另外置入具有與新圖形薄板接著的模仁,就可以 產出不同的產品。如此一來,不但可以延長模具以及複 製性機台的壽竟丄更可以1省許多開發成本及時間。以 上種種優點皆為傳統機械加工所無法達成,均顯示本發 明已完全符合專利法所規定之產業利用性、新穎性及進 步性等法定要件,爰依專利法提出申請,敬請詳查並賜 准本案專利。 < s ^上所述僅為本發明之較佳實施例,凡依本發明申 ;月。範圍所作之均等變化與修飾,皆應屬本發明專利 之涵盍範圍。Page 14 552237 V. Description of the invention (6) The mold cores 46 fixed with the same or different micro-structure metal sheets (or called transfer stencil staraper) are respectively placed in the corresponding mold cavities 49. Taking plastic injection molding as an example, the plastic is ejected from the plastic injection port (not shown) of the upper mold 42 through hot extrusion, flows through the flow channel 48 to the cavity 49, and then passes through the cold part system (not shown) in the lower mold 46. Cool forming. It should be emphasized that the present invention is not limited to the application in the field of plastic injection molding, metal molding, such as town alloy molding, or other reproducible products that can be transferred and pressed in a molten state and require a microstructure on it. Application of invention _. Please refer to FIG. 5 'FIG. 5 is a sound chart of the mold clamping of the upper and lower molds of the present invention. As shown in Figure 5, the mold clothes commonly used in the industry are mainly upright. The upper mold 52 will be closely combined with the lower mold 54 when in use. 2 of the mold cavity 5 9 provided. The plastic is injected into the mold cavity 59 through the ejection opening of the upper mold 52 through the hot pressing pressure through the direction indicated by the arrow. In addition, according to another preferred embodiment of the present invention, the upper mold may also be provided with a corresponding mold core, and a transfer template having a microstructure is also connected thereto. This allows the production of replicating products with microstructures on both sides of the process. 'For example, double-sided microstructures or biochips with microchannels. Please refer to FIG. 6, which shows a side view of another preferred embodiment of the present invention. The present invention can also use a single piece of transfer stencil 60 with a plurality of microstructure ^ case areas 6 丨 on it, so that the transfer stencil 60 can be directly bonded with the above-mentioned metal bonding method: mold 6 4 through a bonding layer 6 3 Without using mold kernels. Plastic can flow to the corresponding mold cavity through the flow channel 66 provided on the lower end surface of the upper mold 62. 552237 _ ^ _____ 5. Description of the invention (7) 67. In summary, the advantage of the present invention is that it can greatly save mold development time and costs. To produce a new product, simply replace the mold core in the cavity, <. That is to say, there is no need to change the mold design significantly, as long as the mold core is taken out and the mold core attached to the new graphic sheet is inserted, a different product can be produced. In this way, not only the life of the mold and the replicating machine can be extended, but also a lot of development costs and time can be saved. All the above advantages cannot be achieved by traditional mechanical processing, which shows that the present invention has fully complied with the statutory requirements of industrial availability, novelty, and progress as stipulated by the Patent Law. The application was filed in accordance with the Patent Law. The patent in this case was approved. < s ^ The above description is only a preferred embodiment of the present invention. All equal changes and modifications made within the scope shall fall within the scope of the invention patent.

第16頁 552237 圖式簡單說明 圖示之簡單說明 意 示 。之 圖壞 意損 示構 面結 剖微 之免 術避 技附 著吸 接力 屬磁 金以 明明 發發 本本 為為 1 二 圖圖 圖 之 壞 損 構 結 微 免 避 以 定 固 板 壓 械 機 以 明 發 本 為 三 圖 本 為 。四 圖圖 意 示 本示 為顯 五六 圖圖 〇 圖 。-圖視 圖-意側 意一示之 示之例 之I模施 ! 用I合實 應|具佳 穴I模較 多|模一 模|下3 一 |上明 明I明發 發|發本 圖示之符號說明 10 金屬薄板 12 模仁 14 金屬層 16 中間接合層 20 金屬薄板 22 模仁 24 磁鐵 26 銦金屬層 28 模具 29 模六 30 機械壓板 40 複製性機台 42 上模 44 下模 46 模仁 48 流道 49 模穴 50 模具 52 上模 54 下模 56 模仁 59 模穴Page 16 552237 Simple illustration of the diagram Simple illustration of the diagram The figure shows the damage of the facet structure. The avoidance of the avoidance technique. The attachment and suction force is magnetic gold. The book is clearly issued. The damage structure of the figure is slightly avoided. The Mingfa Book is a three-picture book. The four diagrams show that this is the five or six diagrams. -Picture view-I-mode application of the example shown by the side-by-side! Use I-synthetic application | with more points in the acupoint | mode-mode | down 3-one | on the Ming-I Explanation of symbols 10 Metal sheet 12 Mold core 14 Metal layer 16 Intermediate bonding layer 20 Metal sheet 22 Mold core 24 Magnet 26 Indium metal layer 28 Mold 29 Mold six 30 Mechanical platen 40 Reproducible machine 42 Upper mold 44 Lower mold 46 mold Ren 48 runner 49 mold cavity 50 mold 52 upper mold 54 lower mold 56 mold kernel 59 mold cavity

第17頁 552237 圖式簡單說明 60 轉印模版 61 微結構圖案區 62 上模 63 接合層 64 下模 66 流道 67 模穴 1^1 第18頁Page 17 552237 Brief description of the drawings 60 Transfer stencil 61 Microstructure pattern area 62 Upper mold 63 Bonding layer 64 Lower mold 66 Runner 67 Cavity 1 ^ 1 Page 18

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552237552237 第20頁Page 20
TW92100567A 2003-01-10 2003-01-10 Molding apparatus for mass production of duplications having thereon a micro-pattern TW552237B (en)

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