TW594225B - Manufacturing method of light guiding micro structure - Google Patents

Abstract

There is provided a manufacturing method of light guiding micro structure. The method comprises first electroplating a thin metal layer on a substrate, coating a photoresist layer on the thin metal layer, and making the photoresist layer form the most of plural openings extended downward to the thin metal layer by carving, so as to electroplate a metal layer with low melting point on the thin metal layer at the bottom of each opening; removing the photoresist layer and softening the top of each metal layer by heating to respectively form a deformed structure, and electroplating a metal layer on the top of the deformed structure; after separating the metal layer from the deformed structure, taking the metal layer as a master for being placed in a mold device, and producing a light guiding plate by injection molding, wherein the light guiding plate is formed with a light guiding micro structure corresponding to the micro structure of the metal layer.

Description

594225 V. Description of the invention [Technical background of the convex mold core formed on the base material of electricity [previously please refer to (1) field] Ming Department of thin-coated metal pillar heating variable light-guiding microjunction technology] The manufacturing method of the light-guiding microstructure is a method in which a photoresist layer is applied after a layer is formed, and the metal layer is used to form the light-guiding microstructure outside the shape, and the manufacturing method is made by flipping the structure. It is attached to a substrate 7 1 with a coating material 7 1 top surface covering 7 3 with 2 1 and no further portion 7 2 2 is thermally formed to form a mold 7 9 again and again, the thickness of Yu Wei is difficult to resist. Most of the light-guiding elements that are easily formed by the droplet distribution are etched away after the exposed portions of most of the holes are exposed, so that the photoresist layer 7 of the deformed structure is deformed. Plastic is hardened because of the light, so that the substrate 7 covers the thicker part 7 7 in the center. It explains the manufacturing method of the conventional light guide element. After the positive photoresist layer 7 2 is applied, it is then applied to the base mask 73. The light is exposed by UV light, and the photomask 7 3 1 makes the photoresist layer to form most exposed portions 7 Ί 2 2. The substrate 7 1 is immersed in the developing solution 7 4 to expose the portion, and then the substrate 7 1 is taken from the developing solution 7 4 to expose the unexposed portion 7 2 1 and the top is softened by heat, and divided into 7 2 3 ° 2 top surface. After depositing a metal layer 75 and turning the mold, and then inserting the mold core into the mold 76 and injecting the plastic into the mold, a light guide element 7 7 is obtained. The resist is in a liquid state during coating, so that the photoresist layer 7 2 uses a spin coating method as an example. After a certain amount of 1 is centered, the photoresist liquid is placed on the top surface of the substrate 7 1 by spin coating. Therefore, the photoresist layer 7 2 is very thin and the surroundings are thin, so that the convex portion 7 7 1 formed later will have a higher convex portion in the center.

Page 4 594225 V. Description of the invention (2) The surrounding convex parts are low, which makes it difficult to present a uniform appearance and affect the light guide effect. In addition, the photoresist layer is easy to deform due to its low hardness, so when the surface is softened by heat, it is easy to form an uneven state, which affects the transmission of light. Please also refer to Figure 4 for another light guide plate master mold The forming method is to form a positive photoresist layer 8 2 on a substrate 8 1, and form a plurality of openings 8 2 1 in the positive photoresist layer 8 2, and then fill the negative photoresist 8 3 into the openings. After 8 2 1, perform maskless exposure, and then place the substrate 8 1 and the positive and negative photoresist layers 8 2 and 8 3 in #etching liquid for development #etching to remove

Going to the positive photoresist layer 8 2. After that, the negative photoresist 8 3 is heated to be softened by heat to form a majority deformed structure 8 3 1, and electroplated on the negative photoresist 8 3 to form a microstructure 8 4 1 after the mold is turned. Light guide plate female mold 8 4. However, since this method requires two photoresists, the selection of the etchant is more complicated.

Furthermore, since the etching time of the positive photoresist layer 8 2 needs to be accurately controlled, otherwise the interface between the positive photoresist layer 8 2 and the substrate 8 1 and the negative photoresist 8 3 will be incompletely etched, which will affect the microstructure formation. . Therefore, this method is not easy in process control. Therefore, it is necessary to solve the problems caused by the above two known technologies. [Objective and Effect] The main object of the present invention is to provide a solution to the above problems.

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Iff Sliiiii ill Page 5 594225 V. Description of the Invention (3) The manufacturing method of the light-guiding microstructure is a method in which a thin metal layer is sputtered on the substrate, and then a photoresist layer is coated on the thin metal layer. And let the photoresist layer form a majority of openings that penetrate down to the thin metal layer. Based on the conductivity of the thin metal layer, a low-melting metal pillar is electroplated thereon, and the metal pillars respectively form a convex after the photoresist layer is removed. The pillars use the low melting point characteristics of the convex pillars to form a deformed structure after being softened by heat, so as to serve as the microstructure surface of the mold core. Therefore, the height of each deformed structure is the same, so that the light guide plate generated after the mold turning has a uniform microstructure to ensure the light guide effect. Yet another object of the present invention is to provide a method for manufacturing a light-guiding microstructure, in which each deformed structure is formed of a low-melting-point metal, so its hardness is higher than that of a photoresist layer used in conventional technology, and deformation can be avoided. The structure is deformed improperly so as to affect the light-guided microstructure generated later. Another object of the present invention is to provide a method for manufacturing a light-guided microstructure. After a thin metal layer is sputtered on the material, a positive or negative photoresist can be coated on the thin metal layer, instead of using two photoresists at the same time as in the prior art, so it can be achieved Convenient manufacturing effect. The above and other objects and advantages of the present invention can be easily understood from the detailed description and accompanying drawings of the selected embodiments below. Of course, the present invention allows some differences in the arrangement or arrangement of other parts, but the selected embodiment is described in detail in this specification and its structure is shown in the drawings. [Detailed description of the embodiment]

594225 V. Description of the invention (4) Please refer to Fig. 1. The structure of the embodiment of the present invention is shown in the figure. This is for illustration only. It is not restricted by such structure in patent applications. The present invention relates to a method for manufacturing a light-guiding microstructure. A glass substrate 1 is first immersed in a nitrogen oxide solution (concentration 2 to 4 w · t%) for 6 to 20 minutes, and then deionized water (that is, Purified water), and clean in an oven at 80 ° C ~ 1 2 5 X: Bake for 5 ~ 12 minutes, and remove excess water on the glass substrate 1 by evaporation.

After the glass substrate 1 is dried, the glass substrate 1 is plated with a thickness of about 5 to 50 nm by using a vacuum sputtering coating method (a vacuum degree of about 0.01 to 0.001 t rr). A thin metal layer 2 (such as gold, silver, IT0, copper, aluminum, etc.) that has better electrical conductivity. In this embodiment, the thin metal layer 2 plated on the glass substrate 1 is a silver layer, and vacuum sputtering The method of spray coating is conventional, and is not a technical feature of this case, so it will not be repeated here.

After that, the glass substrate 1 is placed on a spin coater (not shown), and the spin coater drives the glass substrate 1 to rotate at a rotation speed of 100 to 5 0 0 r pm. And a positive photoresist layer 3 is coated on the thin metal layer 2 (the photoresist layer of this embodiment is AZ-P46 2 0), and the photoresist layer 3 is made uniform by the action of centrifugal force Distributed on the thin metal layer 2. Then, most of the exposure patterns 31 (electron beam energy is 1 to 3 G ev), which are almost circular and have a diameter of 3 um to 180 um, are directly exposed on the photoresist layer 3 by electron lithography. The Department of Cinematography is widely used in the electronics and optoelectronic industries, and is not a technical feature of this case, and will not be repeated here.

Page 7 594225 V. Description of the invention (5) The shadowing liquid (not shown in the figure 5 to 4 0 is thinned down and penetrates ~ 1 0 0 um ~ 7 0 um part 3 4). Plating bath (not shown in the figure, such as tin, indium, and zinc 3 is non-conductive, and the thin metal layer 2 will adhere to the openings, and each opening 3 will be thicker than the pillars 41 and then reused to make the gold protruding pillars 4 2. The structure shown in the figure is heated, the shape of the structure 4 3, the surface 4 3 1, and the height of um, the curvature is between 0 and the photoresist layer 3 and the thin metal is shown. The type of the developer is minutes, so that the majority is exposed to the The thin metal layer 2 has openings 3 3 between the openings, and the rest is not etched (the light is not shown), and those with tin properties are 3 3 3 moderately intermediary, which is a pillar resistance layer 3 and medium, plated with lead. Etc.), and the thin openings with excellent bottom surfaces are respectively formed in 4 um film. The 4 1 thin metals have a lower melting point. ◦ Because the 3 3 series is more conductive than the metal layer and has a lower melting point ~ 7 0, the photoresist layer forms a majority. The base material of the protruding posts 4 2 is such that the top of each protruding post 4 2 is subjected to each of the deformed structures 4 3 and the deformed structures 4 3 are straight lum ~ 50 um, .0 1 ~ 0 . 2 . The substrate 1 of layer 2 is immersed in a display AZ400K) for pattern 3 1 is etched and the thickness is formed to a diameter of 3 um 3 and the depth of 4 um is the part of the substrate 1 that forms the majority of the retention layer 2 is placed in an electrical The metal layer at 500 ° C (the photoresist layer used in the present invention penetrates down to the thin metal layer 2). Therefore, the metal ions are only 2 and gradually increase in thickness. Between the gold um. 3 Most of the remaining parts 3 4 protruding from the thin metal layer 2 the surface 1 is placed in an oven (not thermally softened in the figure to form a different surface respectively to form a half ball with a radius of 6 um ~ 2 〇0 And each hemisphere surface 4 3 1

Page 8 594225 V. Description of the invention (6) Finally, a metal layer 6 is electroformed on the surface of the glass substrate 1 having the majority of deformed structures 43, and the metal layer 6 is separated from the glass substrate 1, and A micro-structured surface 6 1 is formed on one side of the metal layer 6 near the substrate 1 to complement the top surface of the substrate 1. A mold steel 5 6 is bonded to one side of the metal layer 6 away from the micro-structured surface 6 1. The metal layer 6 and the mold steel 56 are formed together to form a mold core 60. The mold core 60 is placed in a mold 5 7, and the plastic 5 9 is injected into the mold 57. After the plastic is hardened and opened, a light guide plate 6 2 is generated, and the light guide plate 6 2 is formed with the Most of the light-guiding microstructures 6 2 1 are complementary to the microstructure surface 6 1.

It should also be reminded that the photoresist layer 3 of the present invention is not limited to using a positive type photoresist, but a negative type photoresist can also be used as the photoresist layer 3. In addition, electroless plating can also be used to form metal pillars. The surface of the thin metal layer 2 is first activated, so that low-melting-point metals can only be deposited on the silver layer to form metal pillars. This technique is also a practice. We do n’t repeat them here.

It can be known from the above description that the present invention is that a thin metal layer 2 is plated on the substrate 1 first, and then a photoresist layer 3 is coated on the thin metal layer 2 to allow the photoresist layer 3 to form a majority of downward transmission. After reaching the opening 3 3 of the thin metal layer 2, a low melting point metal pillar 4 1 is electroplated on the thin metal layer 2 in the opening 3 3 based on the conductivity of the thin metal layer 2, and each metal pillar 4 1 is in a photoresist After the layer 3 is removed, a convex pillar 4 2 is formed, and a deformed structure 4 3 is formed after being softened by heat using the low melting point characteristics of the convex pillar 4 2 to serve as a microstructure surface 6 1 of the mold core 60. Therefore, the heights of the deformed structures 43 are the same, so that the light guide plate 62 produced after the mold turning has a uniform microstructure.

Page 9 594225 Light effect Metal layer Metal layer will be uniformly affected. Deformation and light-guiding technology of the deformation junction technology is only required to be applied first. Two openings of the light which are used to distribute the light firstly. The resistance layer on the opening layer is a point-removing layer. 1, and the structure of each convex column 4 column 4 2 4 3 In addition, its hard deformed structure does not deform, and then it is manufactured on the basis of the thin pre-technique. The thin gold penetrates down to the metal columns of each opening. The structure of the convex pillar 4 is electroplated when the structure 4 3 is improperly deformed (7) to ensure the guide, even if the thin 2 is in a thin locality, the shape is not good, because the degrees are still improper than the conventional 4 3 It is confirmed that the metal layer of the present invention requires simultaneous effects. As mentioned above, the thin metal layer 4 in the thin metal layer is coated on the base layer with low melting in light 2 as a result, so it has a uniform hardness of 2 and achieves the formation of low melting point on the photoresist thin metal layer on the electroplating The convexity is softened and divided. Because each makes the flip mold to maintain the light guiding power with different degrees of softening due to heat, because of the formation, the majority of the deformation 2 on the photoresist layer 3 is thick and the other is electroplated, so the subsequent structure 4 3 is composed of The low-melting point uses a high photoresist layer to maintain the subsequent efficacy. Forming a type or negative type photoresist on the substrate 1 can be made of a photoresist. The metal is formed, and the light guide can be prevented from micro-junction of the thin metal layer. After the substrate 3 has a resistance layer 3, the formation of the heated microstructure surface should be consistent after the formation of the insulation layer 3, and the thin layer of the metal layer can be avoided. The metal pillars 4 1 and 4 2 use the same guiding effect that the deformed convex pillars 4 2 are formed in the same way, and the deformation structure after each gold

Page 10 594225 V. Description of the Invention (8) Of course, there are still many examples of the present invention, and only the details have changed. Please refer to FIG. 2. The second embodiment of the present invention is different in that a glass substrate 9 3 coated with a positive photoresist layer 9 1 and a silver layer 9 2 is placed under a photomask 9 4, and the photomask 9 4 A plurality of holes 9 4 1 having a plurality of apertures of about 3 μm to 180 μm, and a UV light source 9 5 is provided above the photomask 9 4, so that the photoresist layer 9 1 is irradiated by the UV light source 9 5 to form a majority of exposed portions 9 1 1 and most unexposed portions 9 1 2. The exposed photoresist layer 9 1 is immersed in a developing solution for development for 5 to 40 minutes, so that most of the unexposed portion 9 1 2 is etched and the thickness is reduced downward and penetrates to the thin metal layer, so as to form as above. The opening 9 1 3 achieves the effect described in the first embodiment. The disclosure of the embodiments described above is used to illustrate the present invention, and is not intended to limit the present invention. Therefore, any change in the value or replacement of equivalent components should still belong to the scope of the present invention. From the above detailed description, those skilled in the art can understand that the present invention can indeed achieve the aforementioned purpose, and it has indeed complied with the provisions of the Patent Law, and filed a patent application.

Page 594225 Brief description of the diagram. Figure 1 is a schematic flow chart of the manufacturing method of the light-guiding microstructure of the present invention. Figure 2 is a schematic flow chart of the second embodiment of the present invention. Figure 3 is a schematic flow chart of the conventional light-guide element manufacturing method. Figure 4 is a schematic flow chart of another method of manufacturing a conventional light guide plate master mold. [Illustration of drawing number] (conventional part) Substrate 7 1 Photoresist layer 7 2 Exposed part 7 2 1 Unexposed part 7 2 2 Deformed structure 7 2 3 Light Cover 7 3 Hole 7 3 1 Developer 7 4 Metal layer 7 5 Mould 7 6 Light guide 7 7 Projection 7 7 Mould 7 8 Plastic 7 9 Substrate 8 1 Positive photoresist layer 8 2 Opening 8 2 1 Negative Photoresist 8 3 Deformed structure 8 3 1 Light guide plate master 8 8 Microstructure 8 4 1

(Part of the invention) Photoresist layer 9 1 Exposed portion 9 1 1 Substrate 1 Metal layer 6 Silver layer (thin metal layer) 2 Microstructure surface 6 1

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Claims (1)

594225 6. Scope of patent application1. A manufacturing method of light-guiding microstructure, which is formed on a light-guiding plate, which is firstly plated on a substrate with a thin metal layer with better conductivity Then, a photoresist layer is coated on one side of the thin metal layer away from the substrate, and the photoresist layer is exposed to a plurality of exposure patterns, and the plurality of exposure patterns are etched into a plurality of openings with a developing solution. Contact the thin metal layer respectively, and form a low melting point metal pillar combined with the thin metal layer in each opening; remove the photoresist layer and heat the low melting point metal pillar to make the low melting point metal The top of the pillar is softened by heat, and a deformed structure is formed respectively, and a metal layer is formed on the top surface of the majority of the deformed structure; The metal layer is separated from the deformed structure, so that the metal layer is close to one side of the substrate to form a microstructure surface corresponding to the deformed structure complementary, and the metal layer is formed into a mold core, and the light guide plate is generated by the mold core. The microstructure on the light guide plate corresponds to the microstructure surface of the metal layer. 2 · Manufacturing method of light-guiding microstructure according to item 1 of the scope of patent application Wherein, the substrate having a photoresist layer and a thin metal layer is placed under a photomask, the photomask has a plurality of holes of a predetermined shape, and a UV light source is arranged above the photomask, so that the photoresist layer is illuminated by the UV light source. Most exposed portions and most unexposed portions are formed, and then the exposed photoresist layer is immersed in a developing solution for development, so that most of the unexposed portions or exposed portions are etched to become thinner and penetrate to the thin metal layer. To form the openings respectively. 3. The manufacturing method of the light-guiding microstructure according to item 1 of the scope of the patent application, wherein the photoresist layer is directly exposed by electron lithography to expose the majority Page 14 594225 VI. Patent Application Exposure pattern, and then the developer is used to develop and etch the majority exposure pattern to produce the majority opening. 4. The method of manufacturing a light-guiding microstructure according to item 1 of the scope of the patent application, wherein the metal layer is bonded to the top surface of the majority of the deformed structure by electroforming. 5. The method for manufacturing a light-guiding microstructure according to item 1 of the scope of the patent application, wherein the metal layer is combined with a mold steel on a surface remote from the microstructure surface to form the mold core. Page 15