JP3286157B2 - Resin mold and method for producing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin mold and a method of manufacturing the same, and more particularly, for example, to form a resin layer made of a reaction-curable resin on a glass substrate,
By using it as a resin electroforming master,
A resin mold capable of manufacturing optical parts and mechanical parts such as small-diameter aspherical lenses, microlenses, lens arrays, diffracted photons and the like that require precise dimensional accuracy, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Generally, molds for manufacturing optical components such as small-diameter aspherical lenses, microlenses, lens arrays, diffracted photons, and other mechanical components requiring precise dimensional accuracy are machined with high precision. It has become very expensive to be.

As a method of manufacturing a plurality of the same molds, there is a method in which a master mold is manufactured by machining and a mold is manufactured by electroforming based on the master mold. But,
The electroforming process requires a very long time due to the low plating speed, and therefore, such a manufacturing method results in a very late mold delivery time. In addition, by manufacturing a plurality of master dies by machining, and simultaneously electroforming the dies based on the plurality of master dies, such a problem of delivery time can be solved, but it is inevitable. In addition, the mold manufactured in this way is very expensive.

Further, as described in JP-A-3-202486, a master is manufactured by an electron beam,
A first mold is manufactured by electroforming based on the master, and a replica made of a photosensitive resin such as an ultraviolet curable resin is manufactured using the first mold. A method of producing a second mold by performing casting is also known.

However, in this method, since a reactive curable resin such as an ultraviolet curable resin is cured and shrunk, it is extremely difficult to manufacture a master for electroforming with high precision. In particular, it is increasingly difficult to manufacture a mold having a wall thickness in the order of mm or a mold having a complicated shape.

[0006] As a method of compensating for the shrinkage due to curing of the ultraviolet curable resin, for example, four methods as shown in FIGS. 8 to 11 are known.

FIG. 8 shows a method of irradiating the resin 102 with ultraviolet rays from a light source 103 while pressing the ultraviolet curable resin 102 on the molding die 101, as disclosed in Japanese Patent Application Laid-Open No. Hei 4-22609. is there. Also, 10 in FIG.
4 is a lens blank.

FIGS. 9 (a), 9 (b), and 9 (c) show Japanese Unexamined Patent Publication No.
As disclosed in JP-A-59104,
This is a method of controlling the irradiation area of the ultraviolet ray curable resin 202 on the first ultraviolet ray with the mask 203. Reference numeral 204 in the figure denotes a glass lens, an element substrate, or a substrate lens.

FIGS. 10 (a) to 10 (h) show Japanese Unexamined Patent Publication No.
As disclosed in Japanese Patent Application Laid-Open No. 1932, this is a method in which a defective replica processed in the first molding is used as a base material and molded again with the same mold. That is, the ultraviolet curable resin 302 supplied to the cavity 301A of the mold 301 is irradiated with ultraviolet light from above the glass substrate 303 (FIG. 10).
(A), (b), (c)) First molding resin layer 302
-1 when a bad replica occurs (FIG. 10
(D)) After supplying the resin 302 to the cavity 301A again (FIG. 10 (e)), the glass substrate 303 is irradiated with ultraviolet rays (FIG. 10 (g)). Then, a non-defective replica is created by the second molding resin layer 302-2.

FIGS. 11 (a) to 11 (f) show Japanese Unexamined Patent Publication No.
As disclosed in Japanese Patent No. 4868, a cavity 401A of a mold 401 is filled with a reaction-curable liquid resin 402 (FIGS. 11A and 11B) and solidified by ultraviolet rays to form a first resin. A layer 402-1 is formed (FIG.
(C)) Then, the cavity 401 is formed so that the second resin layer 402-2 is formed on the first resin layer 402-1.
A small amount of the reaction-curable liquid resin 402 is dropped into the inside to form a second resin layer 402-2, and the first and second resin layers are integrated and released (FIGS. 11E and 11F). )).

[0011]

However, the method of irradiating the ultraviolet curable resin with ultraviolet light while pressing the ultraviolet curable resin as shown in FIG. 8 has a problem that a special device for pressurizing the resin is required. Furthermore, when the thickness of the shape of the electroformed product to be molded is not uniform, the thin portion is first hardened by the irradiation of ultraviolet rays. Due to the hardening, pressure is not transmitted to the thick part of the meat, and the shrinkage upon hardening cannot be compensated. Therefore, there is a problem that a replica master requiring precise dimensional accuracy cannot be manufactured.

The method of controlling the irradiation area of ultraviolet rays as shown in FIG. 9 requires a special device for controlling the irradiation area, and furthermore, the control conditions of the irradiation area must be set by trial and error. There were also problems.

Further, as shown in FIG. 10, in a method of molding again with the same die using a defective replica processed in the first molding as a base material, the dimensional accuracy of the replica is improved as the number of moldings is increased. However, there is a problem in that the molding takes much time as much as the number of times of molding increases and the product becomes expensive.

Further, as shown in FIG. 11, the first and second layers 2
The method of forming in a batch process is problematic in that, when the thickness of the electroformed product is on the order of millimeters, the amount of hardening shrinkage increases, so that it is not possible to manufacture a replica master that requires precise dimensional accuracy. was there. Moreover, in this method, when the mold has a cavity having a complicated shape,
As the number of times of molding increases, it becomes more difficult to supply the resin to the details of the cavity having a complicated shape, and therefore, there is a problem that it is more difficult to form a highly accurate replica.

An object of the present invention is to provide a mold having a thickness of mm or a cavity having a complicated shape.
An object of the present invention is to provide a resin mold that can be manufactured with high precision and can manufacture an extremely high-precision electroforming mold at low cost by using it as an electroforming master, and a method for manufacturing the same.

[0016]

Means for Solving the Problems The resin mold of the present invention comprises:
In a resin mold manufactured by curing and then releasing the reaction-curable resin supplied into the cavity of the mold, the resin is bonded to the resin by curing the resin,
In addition, the semiconductor device has a substrate in which a hole having substantially the same shape as the projected shape of the cavity is formed.

The method for producing a resin mold according to the present invention is a method for producing a resin mold by curing a reaction-curable resin supplied into a cavity of a mold and then releasing the cured resin. On the resin supplied into the cavity of the mold, a substrate having a hole for allowing the resin to shrink during curing is placed, and the resin and the substrate are cured by curing the resin. And then releasing the resin from the mold together with the substrate.

According to the present invention, the curing shrinkage of the surface of the reaction curable resin is allowed by the holes provided in the substrate such as glass, so that the solidification shrinkage is adversely affected, that is, the resin is shrunk from the cavity forming surface of the mold. The layer is prevented from peeling off, and the resin layer is formed with high precision according to the shape and dimensions of the cavity forming surface of the mold. In addition, by providing an enlarged cavity forming surface for enlarging the outer peripheral portion of the cavity forming surface of the mold, a decrease in the adhesive force between the substrate and the resin layer due to the provision of the hole in the substrate such as glass is provided. In addition, they are integrated so that they can be reliably released from the mold.

[0019]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

First, a mold 1 for machine parts as shown in FIG.
Make one. The cavity forming surface 12 of the mold 11
Is machined by machining such as electric discharge machining. Next, as shown in FIG. 2, a replica mold 21 in which the mold 11 is incorporated in the frames A, B, and C is manufactured. This replica mold 2
In 1, the cavity forming surfaces 22 of the frames A and B are located on the outer periphery of the cavity forming surface 12 of the mold 11. The cavity forming surface 22 forms an enlarged cavity forming surface extending outward from the cavity forming surface 12 of the mold 11 in the horizontal direction (front-rear and left-right directions in FIG. 2). FIG.
FIG. 4A is a plan view of the replica mold 21 and FIG.
Is a plan view of a glass substrate 26 having a square hole 26A used for replica molding described later.

Hereinafter, a method for manufacturing an electroforming mold using such a replica mold 21 will be described.

First, as shown in FIG. 3A, a liquid ultraviolet curable resin 24 is filled in a cavity formed by the cavity forming surfaces 12 and 22 to such an extent that the liquid surface rises due to surface tension. Supply. Vacuum degassing is performed in this state, and the liquid ultraviolet curable resin 24 and the cavity forming surface 12 are brought into close contact with each other. When the cavity shape is fine and complicated, the state of their close contact is confirmed by enlarging with a microscope. Then, vacuum degassing is repeated until they adhere.

Next, as shown in FIG. 3 (b), the liquid ultraviolet curable resin 2 supplied to the extent that it swells due to surface tension.
4, a glass substrate 26 having a square hole 26A (FIG.
(See (b)) and place the square hole 26A above the cavity forming surface 12. The square hole 26A is
The projected shape of the cavity formed by the cavity forming surface 12 is substantially the same as the projected shape.

Next, as shown in FIG. 3C, the resin 24 is cured by irradiating ultraviolet rays from above. Glass substrate 2
6 is subjected to a silane treatment or the like, which serves as a silane coupling agent for improving adhesion, so that the cured resin 24 is integrated with the glass substrate 26. Although the resin 24 hardens and shrinks due to the irradiation of ultraviolet rays, since the portion of the resin 24 located above the cavity forming surface 12 is opened upward by the square hole 26A of the glass substrate 26, the resin 24 is Is hardened and shrunk while maintaining the close contact state, and the shape and dimensions of the cavity forming surface 12 are transferred with extremely high precision, and the cavity forming surface 12 does not peel off from the cavity forming surface 12.
The cavity forming surfaces 22 of the frames A and B are the same as those shown in FIG.
(C) Since the cavity forming surface 12 of the mold 11 is substantially enlarged by the width of the center left and right (actually also front and rear),
A wide contact surface between the resin 24 and the glass substrate 26 is secured by the amount of the enlargement, and a sufficient bonding strength between them is obtained.

Next, as shown in FIG. 3D, release is performed to obtain a replica master 28 for electroforming in which the cured resin 24 and the glass substrate 26 are integrated. The replica master 28 is provided on the cavity forming surface 12 of the mold 11.
Can be transferred with extremely high precision. Also, during this release operation, the frame A,
As a result, the resin 2
Since the bonding strength between the substrate 4 and the glass substrate 26 is sufficiently ensured, the resin 24 is surely released while being integrated with the glass substrate 26.

Next, as shown in FIG. 3E, electroforming is performed using the replica master 28 as a master to form an electroformed layer 31-1.

Next, as shown in FIG.
1-1 is machined to complete the electroforming mold 31-2. The electroforming mold 31-2 has a cavity forming surface 3 on which the shape and dimensions of the cavity forming surface 12 of the mold 11 are transferred with extremely high precision.
2 are formed.

In the above description, the case where the resin 24 is an ultraviolet-curable resin and the transparent glass substrate 26 is used as the substrate has been described. It is also possible to use epoxy resin, silicone, polyester, urethane, etc. of a mold or room temperature curing type, or a resin which is cured by an active energy ray other than ultraviolet rays, for example, infrared rays, visible rays, electron rays, X-rays, or the like. Resin materials include acrylics such as urethane acrylate, epoxy acrylate, polyester acrylate, and polyether acrylate, as well as a single composition in which a photoinitiator is mixed with epoxy, silicone, polyester, urethane, or a mixture of several types of monomers. The composition and the like can be used. As the substrate, a metal plate,
A plastic plate or the like may be used.

[0029]

Next, a specific example in which a mold for a mechanical part is actually manufactured based on the manufacturing method of the above-described embodiment will be described.

First, a mold 4 for machine parts as shown in FIG.
1 was made. The cavity forming surface 42 of the mold 41
Is machined by machining such as electric discharge machining. Next, FIG.
As shown in the figure, a replica mold 51 in which the molds 41 are assembled with the frames A, B, and C was manufactured. The molding die 51 is standardized, and can be adapted to various types of dies simply by changing a few parts. This replica mold 5
In 1, the cavity forming surfaces 52 of the frames A and B are located on the outer periphery of the cavity forming surface 42 of the mold 41. The cavity forming surface 52 forms an enlarged cavity forming surface extending outward from the cavity forming surface 42 of the mold 41 in the horizontal direction (front-back, left-right direction in FIG. 6).

When manufacturing an electroforming mold using such a replica mold 51, first, the cavity forming surface 4
2,52 is immersed in isopropyl alcohol and washed by ultrasonic waves.

Next, as shown in FIG. 7A, a urethane acrylate-based ultraviolet curable resin 54 is provided in the cavity formed by the cavity forming surfaces 42 and 52.
Is supplied to such an extent that the liquid surface rises due to surface tension, and then degassed in vacuum. Then, it is confirmed by a microscope or the like that the resin 54 is in close contact with the cavity forming surface 42 by magnification. Then, vacuum degassing is repeated until they adhere.

Next, as shown in FIG.
A glass substrate 56 having a square hole 56A is placed on the substrate, and the square hole 56A is positioned above the cavity forming surface 42. The glass substrate 56 has a thickness of 5 mm in which silane treatment with a silane coupling agent has been performed as a pretreatment.
The rectangular hole 54A is formed to have substantially the same size as the cavity forming surface 42.

Next, as shown in FIG. 7 (c), an ultraviolet ray having an illuminance of 0.4 mW / cm ² is applied from above the square hole 54A to the top of the square hole 54A.
After irradiating the resin 54 for 7 minutes, the resin 54 in the cavity was cured by irradiating it with ultraviolet light having an illuminance of 18.0 mW / cm ² for 7 minutes. At this time, since the portion of the resin 54 located on the cavity forming surface 42 is opened upward by the square hole 54A, the resin 54 cures and contracts while maintaining the close contact state with the cavity forming surface 42. Thus, the shape and dimensions of the cavity forming surface 42 are transferred with extremely high precision.

Next, as shown in FIG. 7D, release was performed to obtain a replica master 58 for electroforming. When the dimensions of the replica master 58 and the cavity forming surface 42 of the mold 41 were precisely measured, it was confirmed that the dimensions were transferred with extremely high precision. As a result of enlarging and observing the cavity forming surface of the replica master 58 in the lower part of FIG. 7D with an electron microscope, it was found that even the edge of the shape of the cavity forming surface 42 was very sharply transferred. Was also confirmed.

Next, as shown in FIG. 7E, electroforming was performed using the replica master 58 as a master.
In order to shorten the processing period, the thickness of the electroformed layer 61-1 was set to a thickness slightly exceeding 8 mm which is half of the mold 41. Thereafter, the electroformed layer 61-1 was released from the master 58.

Next, as shown in FIG.
1-1 was machined to obtain an electroforming mold 61-2. When the dimensions of the cavity forming surface 62 of the electroforming mold 61-2 were precisely measured, it was confirmed that the dimensions of the cavity forming surface 42 of the mold 41 were transferred with extremely high precision.
Further, as a result of enlarging and observing the cavity forming surface 62 with an electron microscope, it was confirmed that even the edge of the shape of the cavity forming surface 42 of the mold 41 was very sharply transferred.

Next, as shown in FIG. 7 (g), a spacer 63 manufactured by machining was attached to the electroforming mold 61-2 to complete a duplicate mold 64 of the mold 41.

The manufacturing cost of the electroforming mold manufactured by the above steps was less than half that of the mold manufactured by machining.

[0040]

As described above, according to the present invention,
For example, the wall thickness manufactured by machining is in mm,
Or even from a mold that forms a cavity with a complicated shape, without being affected by shrinkage during curing of the resin,
It is possible to manufacture a high-precision resin duplicate mold at extremely low cost. In addition, since the molding process of the reaction-curable resin does not damage the mold manufactured by the mechanical process, it is possible to manufacture a large number of extremely accurate and inexpensive resin molds.

[Brief description of the drawings]

FIG. 1 is a sectional view of a mold used in an embodiment of a manufacturing method of the present invention.

FIG. 2 is a sectional view of a replica molding die constituted by the die shown in FIG.

FIG. 3 is an explanatory view of a process of manufacturing a replica master for electroforming by the mold shown in FIG. 2 and a process of manufacturing an electroforming mold by the replica master.

4A is a plan view of the mold shown in FIG. 2, and FIG. 4B is a plan view of the glass substrate shown in FIG.

FIG. 5 is a sectional view of a mold used in an embodiment of the manufacturing method of the present invention.

FIG. 6 is a sectional view of a replica molding die constituted by the die shown in FIG. 1;

7 is an explanatory diagram of a process of manufacturing a replica master for electroforming by the mold shown in FIG. 6 and a process of manufacturing an electroforming mold by the replica master.

FIG. 8 is a partially cutaway side view of an apparatus used for a conventional method of manufacturing a replica molded product.

FIG. 9 is an explanatory view of a procedure for manufacturing a conventional replica molded product.

FIG. 10 is an explanatory diagram of a procedure for manufacturing a conventional replica molded product.

FIG. 11 is an explanatory view of a procedure for manufacturing a conventional replica molded product.

[Explanation of symbols]

11, 41 Mold 12, 22, 32, 42, 52, 62 Cavity forming surface 21, 51 Replica molding die 24, 54 Ultraviolet curing resin 26, 56 Glass substrate 28, 58 Replica master 31, 61 for electroforming Electric mold 63 Spacer

Continuation of front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B29C 33/00-33/76 C25D 1/00-1/22

Claims (10)

(57) [Claims] 1. A resin mold manufactured by curing a reaction-curable resin supplied into a cavity of a mold and releasing the resin, wherein the resin is bonded to the resin by curing the resin, and A resin mold having a substrate on which a hole having substantially the same shape as the projected shape of the cavity is formed. 2. The resin according to claim 1, wherein the resin is an ultraviolet curable resin that is cured by being irradiated with ultraviolet light, and the substrate is a glass substrate.
The resin mold described in 1. 3. The resin mold according to claim 1, wherein the substrate is subjected to a silane treatment using a silane coupling agent. 4. The master according to claim 1, wherein a portion of the mold separated from the cavity forming surface constitutes a master on which an electroformed layer can be formed by electroforming. The resin mold as described. 5. A method for producing a resin mold by curing a reaction-curable resin supplied into a cavity of a mold and releasing the cured resin, wherein the resin is supplied into the cavity of the mold. On the resin, a substrate having a hole for allowing shrinkage of the resin during curing is placed, and after the resin is cured, the resin is bonded to the substrate. A method of manufacturing a resin mold, comprising releasing the mold together with the substrate. 6. The method according to claim 5, wherein the holes in the substrate have substantially the same shape as the projected shape of the cavity. 7. An enlarged cavity forming surface facing the substrate placed on the resin is provided outside the cavity forming surface forming the cavity of the mold. 7. The method for producing a resin mold according to 5 or 6. 8. The resin according to claim 5, wherein the resin is an ultraviolet-curing resin that is cured by being irradiated with ultraviolet light, and the substrate is a glass substrate.
8. The method for producing a resin mold according to any one of items 1 to 7. 9. The method according to claim 5, wherein the substrate is subjected to a silane treatment with a silane coupling agent. 10. The master according to claim 5, wherein a portion of the mold separated from the cavity forming surface forms a master on which an electroformed layer can be formed by electroforming. The method for producing the resin mold described in the above.