JP4224235B2 - 基板乾燥装置 - Google Patents

基板乾燥装置 Download PDF

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Publication number
JP4224235B2
JP4224235B2 JP2001386424A JP2001386424A JP4224235B2 JP 4224235 B2 JP4224235 B2 JP 4224235B2 JP 2001386424 A JP2001386424 A JP 2001386424A JP 2001386424 A JP2001386424 A JP 2001386424A JP 4224235 B2 JP4224235 B2 JP 4224235B2
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Prior art keywords
substrate
gas
hot plate
rectifying
supported
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Expired - Fee Related
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JP2001386424A
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Japanese (ja)
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JP2003188077A (ja
JP2003188077A5 (enrdf_load_stackoverflow
Inventor
大輔 松嶋
貴弘 山崎
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2001386424A priority Critical patent/JP4224235B2/ja
Publication of JP2003188077A publication Critical patent/JP2003188077A/ja
Publication of JP2003188077A5 publication Critical patent/JP2003188077A5/ja
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  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Drying Of Solid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2001386424A 2001-12-19 2001-12-19 基板乾燥装置 Expired - Fee Related JP4224235B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001386424A JP4224235B2 (ja) 2001-12-19 2001-12-19 基板乾燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001386424A JP4224235B2 (ja) 2001-12-19 2001-12-19 基板乾燥装置

Publications (3)

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JP2003188077A JP2003188077A (ja) 2003-07-04
JP2003188077A5 JP2003188077A5 (enrdf_load_stackoverflow) 2005-07-28
JP4224235B2 true JP4224235B2 (ja) 2009-02-12

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JP2001386424A Expired - Fee Related JP4224235B2 (ja) 2001-12-19 2001-12-19 基板乾燥装置

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JP (1) JP4224235B2 (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3718688B2 (ja) 2003-06-17 2005-11-24 東京エレクトロン株式会社 加熱装置
JP4662479B2 (ja) * 2006-05-30 2011-03-30 東京エレクトロン株式会社 熱処理装置
JP5144299B2 (ja) * 2008-02-12 2013-02-13 光洋サーモシステム株式会社 減圧乾燥装置
JP5786487B2 (ja) * 2011-06-22 2015-09-30 東京エレクトロン株式会社 熱処理装置及び熱処理方法
CN104681402B (zh) * 2015-03-16 2018-03-16 京东方科技集团股份有限公司 基板加热装置和基板加热方法
KR102426224B1 (ko) * 2017-11-15 2022-07-28 주식회사 케이씨텍 기판 가열 장치 및 이를 구비한 기판 처리 시스템
CN110207470A (zh) * 2019-05-27 2019-09-06 武汉华星光电半导体显示技术有限公司 干燥装置
JP7571684B2 (ja) 2021-07-30 2024-10-23 三浦工業株式会社 医療器具乾燥器

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Publication number Publication date
JP2003188077A (ja) 2003-07-04

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