JP4218493B2 - Led灯具 - Google Patents
Led灯具 Download PDFInfo
- Publication number
- JP4218493B2 JP4218493B2 JP2003358343A JP2003358343A JP4218493B2 JP 4218493 B2 JP4218493 B2 JP 4218493B2 JP 2003358343 A JP2003358343 A JP 2003358343A JP 2003358343 A JP2003358343 A JP 2003358343A JP 4218493 B2 JP4218493 B2 JP 4218493B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- led
- vapor deposition
- light guide
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/40—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the combination of reflectors and refractors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/235—Light guides
- F21S43/236—Light guides characterised by the shape of the light guide
- F21S43/241—Light guides characterised by the shape of the light guide of complex shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
前記導光体は、複数であり、透明あるいは半透明の仕切部材で仕切られた空間に前記所定方向と直交する方向に並んで設けられていてもよい。
(1)LED4から放射された光を導光体5内に伝播させ、第1の反射面である蒸着面5aと第2の反射面である半蒸着面5bとで反射させて外部放射させるので、導光体5のサイズに依存せず、また、光反射部5Aの反射形状を複雑にしなくてもLED4の光が導光体5内に拡散して複数の点光源を有するような視認性を与えることができる。
(2)横放射型のLED4を導光体5のLED収容部5Bに収容しているので、LED4から放射された光の界面反射によって導光体5の外部への光放射効率が低下することを防げる。すなわち、界面反射が生じうる場所が導光体5内の凹状に形成された部分であるので、界面反射が生じたとしても導光体5の外部に反射光が漏れにくく、再入射できる可能性がある。
(3)透明な導光体5に蒸着によって光反射部5Aを形成しているので、別途反射鏡を設ける必要がなく、光反射部5Aの反射形状を導光体5の成型時に同時に付与することができ、製造工程の簡略化を実現できる。
(4)透明な導光体5の光出射側端面に半蒸着面5bを設けているので、LED4の形状、点灯状態を外部から視認できるだけでなく、蒸着面5aで反射された光の一部を反射させて隣接する光反射部5Aの蒸着面5aに再入射させることが可能となり、そのことによって視覚的に斬新な点灯状態を生じさせることができる。
(5)導光体5自体がLED取付基板40の支持部材の役割を果たすので、別途LED4の取付部材を必要としない構成とすることができ、部品点数の低減を実現し、構成の簡素化を図れる。
2 ハッチゲート
3 リヤコンビネーションランプ
4 LED
5 導光体
5A 光反射部
5B 収容部
5C 平面形状部
5D 曲面形状部
5a 蒸着面
5b 半蒸着面
30 本体
31 透明カバー
32 仕切部材
40 LEDチップ
40 LED取付基板
41A リードフレーム
41B リードフレーム
42 樹脂封止部材
42A 平坦面
42B 反射面
42C 側面放射面
41A,41B リードフレーム
Claims (5)
- 複数のLED光源と、
前記複数のLED光源を収容する複数の凹状のLED収容部が形成される入射側端面と、前記入射側端面と対向し外部へ前記光が出射する側の出射側端面と、前記入射側端面の外表面にアルミニウムの蒸着により形成され前記光を反射する光反射性の第1蒸着面と、前記出射側面の外表面にアルミニウムの蒸着により前記第1蒸着面より薄く形成され前記光の一部を透過させるとともに一部を反射する半光反射性の第2蒸着面と、を有する透明な導光体と、を備えたLED灯具。 - 前記複数のLED光源は、前記光を横放射する横放射型LED光源である請求項1に記載のLED灯具。
- 前記LED光源と前記LED収容部との間に屈折率が前記導光体に近似する透明樹脂材料を充填する請求項2に記載のLED灯具。
- 前記複数のLEDは、所定方向に並んで設けられ、
前記導光体は、複数であり、透明あるいは半透明の仕切部材で仕切られた空間に前記所定方向と直交する方向に並んで設けられる請求項2または3に記載のLED灯具。 - 前記第2蒸着面を覆う透明カバーを備えた請求項2から4のいずれか1項に記載のLED灯具。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003358343A JP4218493B2 (ja) | 2003-10-17 | 2003-10-17 | Led灯具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003358343A JP4218493B2 (ja) | 2003-10-17 | 2003-10-17 | Led灯具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005123092A JP2005123092A (ja) | 2005-05-12 |
JP4218493B2 true JP4218493B2 (ja) | 2009-02-04 |
Family
ID=34614939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003358343A Expired - Fee Related JP4218493B2 (ja) | 2003-10-17 | 2003-10-17 | Led灯具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4218493B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108561847A (zh) * | 2018-02-13 | 2018-09-21 | 上海小糸车灯有限公司 | 一种车灯系统与车灯 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4733009B2 (ja) * | 2006-01-30 | 2011-07-27 | 豊田合成株式会社 | 車両用灯具 |
JP4683648B2 (ja) * | 2006-04-04 | 2011-05-18 | 株式会社小糸製作所 | 車輌用灯具 |
JP4937649B2 (ja) * | 2006-06-28 | 2012-05-23 | 株式会社小糸製作所 | 車両用灯具 |
JP2008171604A (ja) * | 2007-01-10 | 2008-07-24 | Toyoda Gosei Co Ltd | リアコンビネーションランプ |
US7883249B2 (en) | 2006-12-11 | 2011-02-08 | Toyoda Gosei Co., Ltd. | Lighting device for vehicle |
JP2008171603A (ja) * | 2007-01-10 | 2008-07-24 | Toyoda Gosei Co Ltd | リアコンビネーションランプ |
JP2008166024A (ja) * | 2006-12-27 | 2008-07-17 | Toyoda Gosei Co Ltd | 車両用灯具 |
JP4663680B2 (ja) | 2007-05-22 | 2011-04-06 | 豊田合成株式会社 | 車両用灯具 |
JP5282945B2 (ja) * | 2008-09-12 | 2013-09-04 | スタンレー電気株式会社 | 車両用灯具 |
JP2013026008A (ja) | 2011-07-20 | 2013-02-04 | Koito Mfg Co Ltd | 車両用灯具 |
JP5726973B2 (ja) | 2013-09-27 | 2015-06-03 | 本田技研工業株式会社 | 灯火装置 |
-
2003
- 2003-10-17 JP JP2003358343A patent/JP4218493B2/ja not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108561847A (zh) * | 2018-02-13 | 2018-09-21 | 上海小糸车灯有限公司 | 一种车灯系统与车灯 |
WO2019157781A1 (zh) * | 2018-02-13 | 2019-08-22 | 华域视觉科技(上海)有限公司 | 一种车灯系统、车灯及车灯系统制作方法 |
US11236879B2 (en) | 2018-02-13 | 2022-02-01 | Hasco Vision Technology Co., Ltd. | Vehicle lamp system, vehicle lamp, and method for manufacturing vehicle lamp system |
Also Published As
Publication number | Publication date |
---|---|
JP2005123092A (ja) | 2005-05-12 |
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