JP4215925B2 - 電子部品集合体の実装方法 - Google Patents
電子部品集合体の実装方法 Download PDFInfo
- Publication number
- JP4215925B2 JP4215925B2 JP2000029027A JP2000029027A JP4215925B2 JP 4215925 B2 JP4215925 B2 JP 4215925B2 JP 2000029027 A JP2000029027 A JP 2000029027A JP 2000029027 A JP2000029027 A JP 2000029027A JP 4215925 B2 JP4215925 B2 JP 4215925B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic component
- component assembly
- component
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000029027A JP4215925B2 (ja) | 2000-02-07 | 2000-02-07 | 電子部品集合体の実装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000029027A JP4215925B2 (ja) | 2000-02-07 | 2000-02-07 | 電子部品集合体の実装方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001223455A JP2001223455A (ja) | 2001-08-17 |
| JP2001223455A5 JP2001223455A5 (enExample) | 2007-03-22 |
| JP4215925B2 true JP4215925B2 (ja) | 2009-01-28 |
Family
ID=18554351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000029027A Expired - Fee Related JP4215925B2 (ja) | 2000-02-07 | 2000-02-07 | 電子部品集合体の実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4215925B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005072033A1 (ja) | 2004-01-27 | 2005-08-04 | Matsushita Electric Industrial Co., Ltd. | 回路基板およびチップ部品実装方法 |
| JP2011176078A (ja) * | 2010-02-24 | 2011-09-08 | Panasonic Corp | 電子部品実装方法 |
| WO2015087573A1 (ja) * | 2013-12-12 | 2015-06-18 | 株式会社村田製作所 | 複合電子部品 |
| JP7778583B2 (ja) * | 2022-02-01 | 2025-12-02 | 株式会社村田製作所 | キャリア基体付きセラミック電子部品、セラミック電子部品の実装構造、および、電子部品連 |
-
2000
- 2000-02-07 JP JP2000029027A patent/JP4215925B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001223455A (ja) | 2001-08-17 |
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