JP4202895B2 - 脱熱器組立体、脱熱器の組み付け方法、及び脱熱器 - Google Patents
脱熱器組立体、脱熱器の組み付け方法、及び脱熱器 Download PDFInfo
- Publication number
- JP4202895B2 JP4202895B2 JP2003385146A JP2003385146A JP4202895B2 JP 4202895 B2 JP4202895 B2 JP 4202895B2 JP 2003385146 A JP2003385146 A JP 2003385146A JP 2003385146 A JP2003385146 A JP 2003385146A JP 4202895 B2 JP4202895 B2 JP 4202895B2
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- Prior art keywords
- heat sink
- frame
- spring
- electrical component
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000000034 method Methods 0.000 title description 11
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 230000009977 dual effect Effects 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 229910001369 Brass Inorganic materials 0.000 claims description 2
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- 239000010962 carbon steel Substances 0.000 claims description 2
- 239000002991 molded plastic Substances 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims 2
- 239000010959 steel Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000001125 extrusion Methods 0.000 description 7
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000007567 mass-production technique Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
12…フレーム
16…底面
18…ガイド
26…スプリング部材
30…突出部
34…スプリング
40…電気部品
50…脱熱器
52…外側側面
58…角部
62…複式フレーム
Claims (15)
- 底面を有するフレームであって、前記底面から上方向に延在する複数のスプリング部材を有し、複数の前記スプリング部材が突出部を有する形状の自由端部を有するフレームと、
前記スプリング部材の内側に適合して前記フレームの前記底面に設置される電気部品と、
前記電気部品と接触する全体的に平らな表面を有する脱熱器であって、前記平らな表面から外方向に延在する複数の放熱フィンを有し、前記脱熱器の少なくとも二つの対向配置された外側側面に沿って形成された少なくとも一つの細長い角部を有し、前記細長い角部回りにスナップ式に適合する複数の前記スプリング部材によって前記フレームに関して固定位置に保持される脱熱器と、
前記フレームと前記電気部品との間に位置するスプリングであって、前記脱熱器の全体的に平らな前記表面に対して前記電気部品を外方向に付勢する予め定められた力を発生するのに適したスプリング、とを具備し、
前記フレームは、さらに、前記フレームから外方向に延在する複数のガイドを有し、少なくとも一つの前記細長い角部は、前記外側側面に切られた溝によって画定される脱熱器組立体。 - 前記脱熱器は押出成形された金属である請求項1に記載の脱熱器組立体。
- 前記脱熱器は押出成形されたアルミニウムである請求項1に記載の脱熱器組立体。
- 複数の前記ガイドは矩形空間を形成する四つのガイドを具備する請求項1に記載の脱熱器組立体。
- 前記電気部品は孔を有し、前記底面は前記底面から外方向に延在するピンを有し、前記ピンは前記孔へ入り所望位置に前記電気部品を導く請求項1に記載の脱熱器組立体。
- 前記ガイドを有する前記底面と複数の前記スプリング部材とは、一体の射出成形プラスチック構造である請求項1に記載の脱熱器組立体。
- 前記脱熱器組立体は、前記脱熱器とは反対側において前記フレームに固定されるPC基板と、前記PC基板へ接続されるように前記フレームを貫通する前記電気部品の導電リードとを有する請求項1に記載の脱熱器組立体。
- 前記スプリングは上向きのアーチ形状であり、上向きのアーチ形部で前記電気部品と接触する請求項1に記載の脱熱器組立体。
- 前記スプリングは鋼及び真ちゅうの一方から構成される請求項8に記載の脱熱器組立体。
- 前記鋼は、ステンレス鋼及び炭素鋼の一方を含む請求項9に記載の脱熱器組立体。
- 前記フレームは、さらに、予め定めた位置に前記スプリングを位置させるために前記フレームの前記底面から上方向に延在するスプリングガイドを有する請求項1に記載の脱熱器組立体。
- 前記電気部品は前記フレームの前記底面を貫通する複数の導電リードを有する請求項1に記載の脱熱器組立体。
- 複数の個々の取り付け部を有する複式フレームであって、前記取り付け部のそれぞれは、底面と、前記底面から上方向に延在する複数のスプリング部材とを有し、複数の前記スプリング部材は突出部を有する形状の自由端部を有する複式フレームと、
前記スプリング部材の内側に適合して前記底面に設置される電気部品と、
前記電気部品と接触する全体的に平らな表面を有する脱熱器であって、前記平らな表面から外方向に延在する複数の放熱フィンを有し、前記脱熱器の少なくとも二つの対向配置された外側側面に沿って形成された少なくとも一つの細長い角部を有し、前記細長い角部回りにスナップ式に適合する複数の前記スプリング部材によって前記フレームに関して固定位置に保持される脱熱器と、
前記フレームと前記電気部品との間に位置するスプリングであって、前記脱熱器の全体的に平らな前記表面に対して前記電気部品を外方向に付勢する予め定められた力を発生するのに適したスプリング、とを具備し、
前記フレームは、さらに、前記フレームの前記底面から外方向に延在する複数のガイドを有し、少なくとも一つの前記細長い角部は、前記外側側面に切られた溝によって画定される複式脱熱器組立体。 - 個々の前記取り付け部は、平行な取り付け部の列に整列される請求項13に記載の複式脱熱器組立体。
- 任意の列の個々の前記取り付け部は、隣接する列に形成された取り付け部に隣接しないようにされる請求項14に記載の複式脱熱器組立体。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/065,794 US6633485B1 (en) | 2002-11-20 | 2002-11-20 | Snap-in heat sink for semiconductor mounting |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004172618A JP2004172618A (ja) | 2004-06-17 |
JP4202895B2 true JP4202895B2 (ja) | 2008-12-24 |
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Application Number | Title | Priority Date | Filing Date |
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JP2003385146A Expired - Fee Related JP4202895B2 (ja) | 2002-11-20 | 2003-11-14 | 脱熱器組立体、脱熱器の組み付け方法、及び脱熱器 |
Country Status (4)
Country | Link |
---|---|
US (2) | US6633485B1 (ja) |
EP (1) | EP1422982B1 (ja) |
JP (1) | JP4202895B2 (ja) |
DE (1) | DE60314355T2 (ja) |
Cited By (1)
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CN101606016B (zh) * | 2006-12-26 | 2012-09-05 | Nkk株式会社 | 喷雾罐制品以及喷雾罐用吸收体片材的制备方法 |
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US7360586B2 (en) * | 2003-07-31 | 2008-04-22 | Fujitsu Limited | Wrap around heat sink apparatus and method |
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CN101730445B (zh) * | 2008-10-20 | 2012-11-21 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN102026522A (zh) * | 2009-09-17 | 2011-04-20 | 富准精密工业(深圳)有限公司 | 散热模组 |
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-
2002
- 2002-11-20 US US10/065,794 patent/US6633485B1/en not_active Expired - Lifetime
-
2003
- 2003-07-06 US US10/604,252 patent/US20040201964A1/en not_active Abandoned
- 2003-10-10 DE DE60314355T patent/DE60314355T2/de not_active Expired - Lifetime
- 2003-10-10 EP EP03022990A patent/EP1422982B1/en not_active Expired - Fee Related
- 2003-11-14 JP JP2003385146A patent/JP4202895B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101606016B (zh) * | 2006-12-26 | 2012-09-05 | Nkk株式会社 | 喷雾罐制品以及喷雾罐用吸收体片材的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1422982A3 (en) | 2006-01-11 |
DE60314355D1 (de) | 2007-07-26 |
US20040201964A1 (en) | 2004-10-14 |
EP1422982B1 (en) | 2007-06-13 |
EP1422982A2 (en) | 2004-05-26 |
JP2004172618A (ja) | 2004-06-17 |
US6633485B1 (en) | 2003-10-14 |
DE60314355T2 (de) | 2008-02-07 |
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