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USD285301S - Pinned heat-sink extrusion for circuit-board mounting - Google Patents

Pinned heat-sink extrusion for circuit-board mounting Download PDF

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Publication number
USD285301S
USD285301S US06602666 US60266684F USD285301S US D285301 S USD285301 S US D285301S US 06602666 US06602666 US 06602666 US 60266684 F US60266684 F US 60266684F US D285301 S USD285301 S US D285301S
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US
Grant status
Grant
Patent type
Design
Prior art keywords
fig
view
elevational
side
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06602666
Inventor
Philip A. Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LaSalle Business Credit Inc
Original Assignee
Aavid Engineering Inc
Filing date
Publication date
Grant date

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Description

FIG. 1 is a perspective view of a pinned heat-sink extrusion for circuit-board mounting showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a side elevational view thereof, looking toward the right side thereof as it is shown in FIG. 1; and

FIG. 7 is a side elevational view thereof looking toward the left side thereof as it is shown in FIG. 1.

Claims (1)

  1. The ornamental design for a pinned heat-sink extrusion for circuit-board mounting, substantially as shown.
US06602666 1984-04-23 Pinned heat-sink extrusion for circuit-board mounting Expired - Lifetime USD285301S (en)

Publications (1)

Publication Number Publication Date
USD285301S true USD285301S (en) 1986-08-26

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040201964A1 (en) * 2002-11-20 2004-10-14 Sigl Dennis R. Snap-in heat sink for semiconductor mounting

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040201964A1 (en) * 2002-11-20 2004-10-14 Sigl Dennis R. Snap-in heat sink for semiconductor mounting

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