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USD269084S - Dual heat sink for electronic semiconductor devices - Google Patents

Dual heat sink for electronic semiconductor devices Download PDF

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Publication number
USD269084S
USD269084S US06/252,030 US25203081F USD269084S US D269084 S USD269084 S US D269084S US 25203081 F US25203081 F US 25203081F US D269084 S USD269084 S US D269084S
Authority
US
United States
Prior art keywords
heat sink
semiconductor devices
electronic semiconductor
dual heat
dual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/252,030
Inventor
Alfred F. McCarthy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LaSalle Business Credit Inc
Original Assignee
Aavid Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Engineering Inc filed Critical Aavid Engineering Inc
Priority to US06/252,030 priority Critical patent/USD269084S/en
Assigned to AAVID ENGINEERING, INC., A CORP. OF NH reassignment AAVID ENGINEERING, INC., A CORP. OF NH ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: MC CARTHY, ALFRED F.
Publication of USD269084S publication Critical patent/USD269084S/en
Application granted granted Critical
Assigned to MNC COMMERCIAL CORP. reassignment MNC COMMERCIAL CORP. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC., A NH CORP.
Assigned to MNC COMMERCIAL CORP., A MD CORP. reassignment MNC COMMERCIAL CORP., A MD CORP. SPECIAL POWER ATTY., ASSIGNOR HEREBY APPOINTS ASSIGNEE AS ITS POWER OF ATTORNEY TO ACT IN ALL MATTERS INVOLVING SAID PATENTS. Assignors: AAVID ENGINEERING, INC., A N.H. CORP.
Assigned to MNC COMMERCIAL CORP., A MD CORP. reassignment MNC COMMERCIAL CORP., A MD CORP. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC., A N.H. CORP.
Assigned to AAVID ENGINEERING, INC. reassignment AAVID ENGINEERING, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MARYLAND NATIONAL BANK (AS SUCCESSOR-IN-INTEREST TO MNC CREDIT CORP.)
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC.
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC.
Anticipated expiration legal-status Critical
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. CORRECTIVE ASSIGNMENT OF SECURITY INTEREST IN PATENTS TO AMEND THE CONVEYING PARTY NAME, PREVIOUSLY RECORDED AT REEL 6747, FRAME 0635. Assignors: AAVID THERMAL PRODCUTS, INC.
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. AMENDMENT: AMEND CONVEYING PARTY'S NAME ON PREVIOUSLY RECORDED ASSIGNMENT OF SECURITY INTEREST IN PATENTS, REEL 8059 FRAME 0087, RECORDED 10/07/96 Assignors: AAVID THERMAL PRODUCTS, INC.
Application status is Expired - Lifetime legal-status Critical

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Description

FIG. 1 is a perspective view of a dual heat sink for electronic semiconductor devices showing my new design; the broken lines being shown for illustrative purposes, only;

FIG. 2 is a front elevational view of the same heat sink;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof, looking toward the right side of the heat sink as it is shown in FIG. 1;

FIG. 5 is a side elevational view thereof, looking toward the left side of the heat sink as it is shown in FIG. 1;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a dual heat sink for electronic semiconductor devices, substantially as shown and described.
US06/252,030 1981-04-08 1981-04-08 Dual heat sink for electronic semiconductor devices Expired - Lifetime USD269084S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US06/252,030 USD269084S (en) 1981-04-08 1981-04-08 Dual heat sink for electronic semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/252,030 USD269084S (en) 1981-04-08 1981-04-08 Dual heat sink for electronic semiconductor devices

Publications (1)

Publication Number Publication Date
USD269084S true USD269084S (en) 1983-05-24

Family

ID=64048414

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/252,030 Expired - Lifetime USD269084S (en) 1981-04-08 1981-04-08 Dual heat sink for electronic semiconductor devices

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US (1) USD269084S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6633485B1 (en) 2002-11-20 2003-10-14 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Amperex Transistor Brocure, 6/1966, Extruded Aluminum Heat-Sink.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6633485B1 (en) 2002-11-20 2003-10-14 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting
US20040201964A1 (en) * 2002-11-20 2004-10-14 Sigl Dennis R. Snap-in heat sink for semiconductor mounting

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