USD282838S - Slip-on heat sink for encased electrical packages - Google Patents
Slip-on heat sink for encased electrical packages Download PDFInfo
- Publication number
- USD282838S USD282838S US06/478,919 US47891983F USD282838S US D282838 S USD282838 S US D282838S US 47891983 F US47891983 F US 47891983F US D282838 S USD282838 S US D282838S
- Authority
- US
- United States
- Prior art keywords
- slip
- heat sink
- electrical packages
- encased electrical
- encased
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of a slip-on heat sink for encasing electrical packages showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view thereof, looking toward the left side of the heat sink as it is shown in FIG. 1;
FIG. 5 is a side elevational view thereof, looking toward the right side of the heat sink as it is shown in FIG. 1;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a slip-on heat sink for encased electrical packages, substantially as shown.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/478,919 USD282838S (en) | 1983-03-25 | 1983-03-25 | Slip-on heat sink for encased electrical packages |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/478,919 USD282838S (en) | 1983-03-25 | 1983-03-25 | Slip-on heat sink for encased electrical packages |
Publications (1)
Publication Number | Publication Date |
---|---|
USD282838S true USD282838S (en) | 1986-03-04 |
Family
ID=70005254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/478,919 Expired - Lifetime USD282838S (en) | 1983-03-25 | 1983-03-25 | Slip-on heat sink for encased electrical packages |
Country Status (1)
Country | Link |
---|---|
US (1) | USD282838S (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6633485B1 (en) | 2002-11-20 | 2003-10-14 | Illinois Tool Works Inc. | Snap-in heat sink for semiconductor mounting |
US7443022B2 (en) * | 1999-09-02 | 2008-10-28 | Micron Technology, Inc. | Board-on-chip packages |
-
1983
- 1983-03-25 US US06/478,919 patent/USD282838S/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7443022B2 (en) * | 1999-09-02 | 2008-10-28 | Micron Technology, Inc. | Board-on-chip packages |
US6633485B1 (en) | 2002-11-20 | 2003-10-14 | Illinois Tool Works Inc. | Snap-in heat sink for semiconductor mounting |
US20040201964A1 (en) * | 2002-11-20 | 2004-10-14 | Sigl Dennis R. | Snap-in heat sink for semiconductor mounting |
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