USD267942S - Heat-sink for electronic semiconductor devices - Google Patents

Heat-sink for electronic semiconductor devices Download PDF

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Publication number
USD267942S
USD267942S US06208924 US20892480F USD267942S US D267942 S USD267942 S US D267942S US 06208924 US06208924 US 06208924 US 20892480 F US20892480 F US 20892480F US D267942 S USD267942 S US D267942S
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US
Grant status
Grant
Patent type
Design
Prior art keywords
fig
view
heat
sink
side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06208924
Inventor
Alfred F. McCarthy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LaSalle Business Credit Inc
Original Assignee
Aavid Engineering Inc
Filing date
Publication date
Grant date

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Description

FIG. 1 is a perspective view of a heat sink for electronic semiconductor devices showing my new design, the semiconductor being shown in broken lines for illustrative purposes only;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof, looking toward the right side of the heat-sink as it is shown in FIG. 1;

FIG. 5 is a side elevational view thereof, looking toward the left side of the heat-sink as it is shown in FIG. 1;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a heat-sink for electronic semiconductor devices, substantially as shown and described.
US06208924 1980-11-21 Heat-sink for electronic semiconductor devices Expired - Lifetime USD267942S (en)

Publications (1)

Publication Number Publication Date
USD267942S true USD267942S (en) 1983-02-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6633485B1 (en) 2002-11-20 2003-10-14 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6633485B1 (en) 2002-11-20 2003-10-14 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting
US20040201964A1 (en) * 2002-11-20 2004-10-14 Sigl Dennis R. Snap-in heat sink for semiconductor mounting

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