JP4191067B2 - 押釦スイッチ用カバー部材 - Google Patents
押釦スイッチ用カバー部材 Download PDFInfo
- Publication number
- JP4191067B2 JP4191067B2 JP2004058923A JP2004058923A JP4191067B2 JP 4191067 B2 JP4191067 B2 JP 4191067B2 JP 2004058923 A JP2004058923 A JP 2004058923A JP 2004058923 A JP2004058923 A JP 2004058923A JP 4191067 B2 JP4191067 B2 JP 4191067B2
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- 239000011852 carbon nanoparticle Substances 0.000 claims description 24
- 229920001971 elastomer Polymers 0.000 claims description 15
- 239000011230 binding agent Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 description 12
- 239000004945 silicone rubber Substances 0.000 description 12
- 239000006230 acetylene black Substances 0.000 description 10
- 239000006229 carbon black Substances 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000011231 conductive filler Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000002134 carbon nanofiber Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
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- 239000000758 substrate Substances 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000003350 kerosene Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PDHXHYRJLUNSDZ-UHFFFAOYSA-N [C].C#C Chemical group [C].C#C PDHXHYRJLUNSDZ-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
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- 238000002508 contact lithography Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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Images
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- Contacts (AREA)
- Push-Button Switches (AREA)
Description
[実施例1]
[実施例2]
[比較例]
[比較例1]
[比較例2]
[比較例3]
11 押釦
12 可動接点部
13 押釦本体部
14 スカート部
15 押下面
16 最表層
17 押釦隣接層
18 回路基板
19 固定接点部
Claims (2)
- 押釦と該押釦に対応するスイッチ回路が配設された回路基板との間に、押圧時に通電するための可動接点部を有する押釦スイッチ用カバー部材であって、前記可動接点部は、カーボンナノ粒子とポリオルガノシロキサン組成物のバインダー成分とからなる最表層と、該最表層よりカーボンナノ粒子の配合量が少ないか或いは全くカーボンナノ粒子を含まない層との複層構造とするとともに、前記最表層の表面粗さの平均値(Ra)が0.1μm以上10μm以下としたことを特徴とする押釦スイッチ用カバー部材。
- 前記可動接点部のゴム硬度10〜80IRHDであることを特徴とする請求項1に記載の押釦スイッチ用カバー部材。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004058923A JP4191067B2 (ja) | 2004-03-03 | 2004-03-03 | 押釦スイッチ用カバー部材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004058923A JP4191067B2 (ja) | 2004-03-03 | 2004-03-03 | 押釦スイッチ用カバー部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005251515A JP2005251515A (ja) | 2005-09-15 |
JP4191067B2 true JP4191067B2 (ja) | 2008-12-03 |
Family
ID=35031790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004058923A Expired - Lifetime JP4191067B2 (ja) | 2004-03-03 | 2004-03-03 | 押釦スイッチ用カバー部材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4191067B2 (ja) |
-
2004
- 2004-03-03 JP JP2004058923A patent/JP4191067B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2005251515A (ja) | 2005-09-15 |
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