JP4181069B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP4181069B2
JP4181069B2 JP2004052807A JP2004052807A JP4181069B2 JP 4181069 B2 JP4181069 B2 JP 4181069B2 JP 2004052807 A JP2004052807 A JP 2004052807A JP 2004052807 A JP2004052807 A JP 2004052807A JP 4181069 B2 JP4181069 B2 JP 4181069B2
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Japan
Prior art keywords
plasma
coating
processing apparatus
film
plasma processing
Prior art date
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Expired - Lifetime
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JP2004052807A
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English (en)
Japanese (ja)
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JP2005243987A (ja
JP2005243987A5 (https=
Inventor
雅嗣 荒井
勉 手束
浩之 橘内
宗雄 古瀬
匡規 角谷
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2004052807A priority Critical patent/JP4181069B2/ja
Publication of JP2005243987A publication Critical patent/JP2005243987A/ja
Publication of JP2005243987A5 publication Critical patent/JP2005243987A5/ja
Application granted granted Critical
Publication of JP4181069B2 publication Critical patent/JP4181069B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Coating By Spraying Or Casting (AREA)
  • Drying Of Semiconductors (AREA)
JP2004052807A 2004-02-27 2004-02-27 プラズマ処理装置 Expired - Lifetime JP4181069B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004052807A JP4181069B2 (ja) 2004-02-27 2004-02-27 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004052807A JP4181069B2 (ja) 2004-02-27 2004-02-27 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2005243987A JP2005243987A (ja) 2005-09-08
JP2005243987A5 JP2005243987A5 (https=) 2005-11-17
JP4181069B2 true JP4181069B2 (ja) 2008-11-12

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ID=35025389

Family Applications (1)

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JP2004052807A Expired - Lifetime JP4181069B2 (ja) 2004-02-27 2004-02-27 プラズマ処理装置

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JP (1) JP4181069B2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007115973A (ja) * 2005-10-21 2007-05-10 Shin Etsu Chem Co Ltd 耐食性部材
JP2007243020A (ja) * 2006-03-10 2007-09-20 Hitachi High-Technologies Corp プラズマ処理装置
JP4905697B2 (ja) * 2006-04-20 2012-03-28 信越化学工業株式会社 導電性耐プラズマ部材
JP4887910B2 (ja) * 2006-05-30 2012-02-29 パナソニック株式会社 プラズマ処理装置
JP5071856B2 (ja) * 2007-03-12 2012-11-14 日本碍子株式会社 酸化イットリウム材料及び半導体製造装置用部材
JP5551353B2 (ja) * 2008-10-30 2014-07-16 株式会社日本セラテック 耐食性部材
JP5782293B2 (ja) * 2011-05-10 2015-09-24 東京エレクトロン株式会社 プラズマ生成用電極およびプラズマ処理装置
US9123651B2 (en) * 2013-03-27 2015-09-01 Lam Research Corporation Dense oxide coated component of a plasma processing chamber and method of manufacture thereof
JP6156850B2 (ja) * 2014-12-25 2017-07-05 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理装置の部材の交換判断方法
US12567564B2 (en) 2015-11-16 2026-03-03 Coorstek, Inc. Corrosion-resistant components
US20170140902A1 (en) 2015-11-16 2017-05-18 Coorstek, Inc. Corrosion-resistant components and methods of making
EP3526177B1 (en) * 2016-11-16 2021-06-09 Coorstek Inc. Corrosion-resistant components and methods of making

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Publication number Publication date
JP2005243987A (ja) 2005-09-08

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