JP4173145B2 - コンタクトアッセンブリおよびこれを用いた半導体パッケージ用ソケット - Google Patents
コンタクトアッセンブリおよびこれを用いた半導体パッケージ用ソケット Download PDFInfo
- Publication number
- JP4173145B2 JP4173145B2 JP2005053963A JP2005053963A JP4173145B2 JP 4173145 B2 JP4173145 B2 JP 4173145B2 JP 2005053963 A JP2005053963 A JP 2005053963A JP 2005053963 A JP2005053963 A JP 2005053963A JP 4173145 B2 JP4173145 B2 JP 4173145B2
- Authority
- JP
- Japan
- Prior art keywords
- contacts
- contact
- contact assembly
- assembly according
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/26—Rotors specially for elastic fluids
- F04D29/32—Rotors specially for elastic fluids for axial flow pumps
- F04D29/34—Blade mountings
- F04D29/36—Blade mountings adjustable
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F7/00—Ventilation
- F24F7/007—Ventilation with forced flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2210/00—Working fluids
- F05D2210/10—Kind or type
- F05D2210/12—Kind or type gaseous, i.e. compressible
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
- F05D2240/00—Components
- F05D2240/20—Rotors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6467—Means for preventing cross-talk by cross-over of signal conductors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Description
さらに本発明は、表面実装用の半導体パッケージの端子とケルビン接続を行うことができるコンタクトアッセンブリを提供し、かつ半導体パッケージの試験を精度よく行うことができるソケットを提供することを目的とする。
14:弾性変形部 16:中間部
16a:固定部 18:傾斜部
20:基板接続部 22:溝
22a、22b:斜面
30(30−1〜30−5、31−1〜31−5):第1組のコンタクト
32:絶縁シート
40(40−1〜40−5、41−1〜41−5):第2組のコンタクト
50:セパレータ 52:壁
54、58:開口 56、60:突起
100:コンタクトアッセンブリ 110:パッケージ載置面
120:BGAパッケージ 130:はんだボール
200:コンタクトアッセンブリ 314:スリット
Claims (17)
- 複数のコンタクトを積層したコンタクトアッセンブリであって、
第1の面内に第1の配列で配された第1組のコンタクトと、第2の面内に第2の配列で配された第2組のコンタクトとを対として、これらを複数対積層し、
第1組のコンタクトは、第2組のコンタクトに対して線対称となる基準線に関して第2組のコンタクトを180度反転した位置関係にあり、
第1および第2組のコンタクトの第1の端部は、積層する方向に整合され、
第1および第2組のコンタクトの第2の端部の面内方向のピッチは、第1および第2組のコンタクトの第1の端部の面内方向のピッチよりも大きいかまたは同一であり、
第1組および第2組のコンタクトの各々は、第1の端部と第2の端部との間にコンタクトを固定するための固定部と、前記固定部と第1の端部との間に湾曲した形状を有する弾性変形部とを含み、
前記固定部の軸方向は第1の端部の軸方向から水平方向に一定距離だけ変位し、
前記第1組のコンタクトの第2の端部のすべては、前記基準線より左側の領域側に配され、
前記第2組のコンタクトの第2の端部のすべては、前記基準線より右側の領域側に配されている、
コンタクトアッセンブリ。 - 各コンタクトの第2の端部の軸方向は、前記固定部の軸方向からそれぞれ異なる水平距離で変位している、請求項1に記載のコンタクトアッセンブリ。
- 第1および第2組のコンタクトの第2の端部は、積層する方向に千鳥状に配列されている、請求項1または2に記載のコンタクトアッセンブリ。
- 第1組のコンタクトと第2組のコンタクトの間に絶縁物が介在されている、請求項1ないし3いずれか1つに記載のコンタクトアッセンブリ。
- 第1および第2組のコンタクトの第1の端部は、半導体パッケージの端子にケルビン接続される、請求項1ないし4いずれか1つに記載のコンタクトアッセンブリ。
- コンタクトアッセンブリはさらに、複数のセパレータを含み、各セパレータは、第1および第2組のコンタクトを位置決め収容し、各セパレータが積層されている、請求項1ないし5いずれか1つに記載のコンタクトアッセンブリ。
- 各コンタクトは、金属板をスタンピングして形成される、請求項1ないし6いずれか1つに記載のコンタクトアッセンブリ。
- 各コンタクトの前記固定部には係止部が形成され、当該係止部は、セパレータに形成された突起に係止される、請求項6に記載のコンタクトアッセンブリ。
- セパレータは、第1組および第2組のコンタクトの第1の端部を挿入しかつ位置決めする開口を含んでいる、請求項6に記載のコンタクトアッセンブリ。
- 第1の端部は、V字またはU字状の溝を有し、当該溝の対向する斜面のうち、一方の斜面が他方の斜面よりも拡大されている、請求項1ないし9いずれか1つに記載のコンタクトアッセンブリ。
- 一方の斜面は、前記弾性変形部が湾曲する方向に位置する、請求項7または10に記載のコンタクトアッセンブリ。
- 一方の斜面は、他方の斜面よりも軸方向に高い、請求項7ないし11いずれか1つに記載のコンタクトアッセンブリ。
- コンタクトの前記固定部と第2の端部の間に他の弾性変形部が形成されている、請求項7ないし12いずれか1つに記載のコンタクトアッセンブリ。
- 請求項1ないし13いずれか1つに記載のコンタクトアッセンブリを含むソケット。
- ソケットのベースからコンタクトアッセンブリの第2の端部が突出し、第2の端部が基板に電気的に接続される、請求項14に記載のソケット。
- 第1組のコンタクトは電力供給用であり、第2組のコンタクトは信号測定用である、請求項14または15に記載のソケット。
- ソケットのベースに形成された開口内に複数のスリットが形成され、複数のスリット内に各セパレータが位置決めして挿入される、請求項14ないし16いずれか1つに記載のソケット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005053963A JP4173145B2 (ja) | 2005-02-28 | 2005-02-28 | コンタクトアッセンブリおよびこれを用いた半導体パッケージ用ソケット |
US11/326,302 US7217140B2 (en) | 2005-02-28 | 2006-01-05 | Contact assembly and socket for use with semiconductor packages |
KR1020060019017A KR101178972B1 (ko) | 2005-02-28 | 2006-02-27 | 반도체 패키지에 사용되는 콘택트 어셈블리 및 소켓 |
CN2006100093675A CN1841859B (zh) | 2005-02-28 | 2006-02-28 | 与半导体封装结合使用的触头组件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005053963A JP4173145B2 (ja) | 2005-02-28 | 2005-02-28 | コンタクトアッセンブリおよびこれを用いた半導体パッケージ用ソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006236950A JP2006236950A (ja) | 2006-09-07 |
JP4173145B2 true JP4173145B2 (ja) | 2008-10-29 |
Family
ID=36931303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005053963A Expired - Fee Related JP4173145B2 (ja) | 2005-02-28 | 2005-02-28 | コンタクトアッセンブリおよびこれを用いた半導体パッケージ用ソケット |
Country Status (4)
Country | Link |
---|---|
US (1) | US7217140B2 (ja) |
JP (1) | JP4173145B2 (ja) |
KR (1) | KR101178972B1 (ja) |
CN (1) | CN1841859B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220050422A (ko) * | 2020-10-16 | 2022-04-25 | 이승용 | 인터페이스, 및 그 인테페이스를 포함하는 테스트 소켓과 테스트 소켓 모듈 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5708002B2 (ja) * | 2011-02-14 | 2015-04-30 | 日本モレックス合同会社 | ソケット |
US8970238B2 (en) * | 2011-06-17 | 2015-03-03 | Electro Scientific Industries, Inc. | Probe module with interleaved serpentine test contacts for electronic device testing |
US8860446B2 (en) * | 2012-05-24 | 2014-10-14 | Texas Instruments Incorporated | Multiple contact test probe |
CN103389445B (zh) * | 2013-07-26 | 2015-11-18 | 南车南京浦镇车辆有限公司 | 多芯连接器配线绝缘耐压测试方法 |
JP5669285B1 (ja) * | 2014-02-21 | 2015-02-12 | 日本航空電子工業株式会社 | コネクタ |
JP2016151573A (ja) * | 2015-02-19 | 2016-08-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法およびプローブカード |
CN106207543B (zh) * | 2015-04-30 | 2018-09-25 | 泰科电子(上海)有限公司 | 端子模组、连接器和端子模组的制造方法 |
JP6641772B2 (ja) * | 2015-08-07 | 2020-02-05 | オムロン株式会社 | プローブピン、および、これを備えた検査治具 |
KR101826663B1 (ko) | 2016-03-07 | 2018-03-23 | 주식회사 이노글로벌 | 반도체 디바이스 테스트용 양방향 도전성 소켓, 반도체 디바이스 테스트용 양방향 도전성 모듈 및 이의 제조방법 |
JP6737002B2 (ja) * | 2016-06-17 | 2020-08-05 | オムロン株式会社 | プローブピン |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5495179A (en) * | 1991-06-04 | 1996-02-27 | Micron Technology, Inc. | Carrier having interchangeable substrate used for testing of semiconductor dies |
KR100664422B1 (ko) * | 1999-05-28 | 2007-01-04 | 닛폰 하츠죠 가부시키가이샤 | 도전성 접촉자 |
JP2001326046A (ja) * | 2000-05-17 | 2001-11-22 | Enplas Corp | コンタクトピン集合体、コンタクトピン組立体及び電気部品用ソケット |
JP3942823B2 (ja) * | 2000-12-28 | 2007-07-11 | 山一電機株式会社 | 検査装置 |
JP3566691B2 (ja) | 2001-12-17 | 2004-09-15 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置用ソケットおよび半導体装置のソケットへの取付け方法 |
JP3737078B2 (ja) | 2002-10-29 | 2006-01-18 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置用ソケットおよび半導体装置のソケットへの着脱方法 |
JP2005149958A (ja) | 2003-11-17 | 2005-06-09 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
-
2005
- 2005-02-28 JP JP2005053963A patent/JP4173145B2/ja not_active Expired - Fee Related
-
2006
- 2006-01-05 US US11/326,302 patent/US7217140B2/en active Active
- 2006-02-27 KR KR1020060019017A patent/KR101178972B1/ko active IP Right Grant
- 2006-02-28 CN CN2006100093675A patent/CN1841859B/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220050422A (ko) * | 2020-10-16 | 2022-04-25 | 이승용 | 인터페이스, 및 그 인테페이스를 포함하는 테스트 소켓과 테스트 소켓 모듈 |
KR102484421B1 (ko) * | 2020-10-16 | 2023-01-03 | 이승용 | 인터페이스, 및 그 인테페이스를 포함하는 테스트 소켓과 테스트 소켓 모듈 |
Also Published As
Publication number | Publication date |
---|---|
CN1841859A (zh) | 2006-10-04 |
KR101178972B1 (ko) | 2012-09-03 |
JP2006236950A (ja) | 2006-09-07 |
CN1841859B (zh) | 2011-04-13 |
KR20060095511A (ko) | 2006-08-31 |
US7217140B2 (en) | 2007-05-15 |
US20060192264A1 (en) | 2006-08-31 |
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