JP4171587B2 - Mounting method of electronic component assembly - Google Patents

Description

【０１５６】
表１より、本発明の実施形態の実施例による電子部品集合体及びその実装方法は、チップ部品の実装面積が小さく、実装されたチップ部品がズレることなく、またチップ部品の実装時間が短いという結果が得られた。
【０１５７】
【発明の効果】
本発明の電子部品集合体及びその実装方法によれば、電子部品の位置ズレ不良を引き起こすことなく、回路基板などの被実装体への電子部品の実装面積を小さくし、実装時間を大幅に短縮することができる。
【０１５８】
すなわち、本発明の電子部品集合体及びその実装方法によれば、複数の電子部品をそれぞれ個別に回路基板などの被実装体に実装するのではなく、複数の電子部品を互いに長手方向と直交する方向に、かつ、横方向に積層し、かつ、隣接電子部品の電極間には絶縁層を配置して隣接電子部品を互いに固着して電子部品集合体を構成しているため、複数の電子部品間の位置ズレを防止することができ、かつ、実装面積を小さくすることができる。
【０１５９】
また、本発明の電子部品集合体によれば、隣接電子部品の電極間には絶縁層を配置し、隣接電子部品の電極以外の部分には絶縁層がなく、放熱用空間が確保できるため、電子部品の発熱時に放熱作用を行わせることができる。
【０１６０】
また、本発明の電子部品集合体及びその実装方法によれば、複数個の電子部品で構成される電子部品集合体を１つの部品として取り扱うことにより回路基板などに実装することができるため、複数個の電子部品をそれぞれ実装する場合と比較して、実装工程に要する時間が短縮できる。
【０１６１】
また、本発明の電子部品集合体及びその製造方法によれば、電子部品集合体を部品収納部材に収納するとき、上下方向に２個の積層された電子部品より構成する電子部品集合体を９０度回転させて横方向に積層された状態として、電子部品集合体の実装時に電子部品集合体の吸着面を上面に向くようにしたのち、その状態で部品収納部材に収納するようにすれば、電子部品集合体の実装時に部品収納部材内の電子部品集合体の吸着面を吸着ノズルで吸着すれば、電子部品集合体の全ての電極を回路基板に対向させることができ、従来の実装方法のまま、狭隣接実装が可能になる。また、電子部品集合体を回路基板などに実装するときに電子部品集合体を９０度回転させようとすると実装ヘッドの構造が複雑化するが、上記したように、部品収納部材に収納するときに予め９０度回転させて吸着面が上向きになるようにすれば、実装時に電子部品集合体を９０度回転させる必要がなくなり、実装ヘッドの構造を複雑化させることがない。
【０１６２】
また、電子部品を吸着ノズルで吸着するとき、吸着ノズルは外径が小さくなるほど製作が困難であり、かつ、ゴミ等の影響を受けやすくなるので小さくするのは現実的に困難であるため、従来の実装状態のように1個の電子部品の幅より吸着ノズルの外径が大きいためはみ出てしまう部分がある。このような状態で電子部品を吸着ノズルで吸着したのち回路基板などに実装すると、吸着ノズルのはみ出した部分が、既に回路基板に実装されている他の部品に当らないようにする必要があり、電子部品を狭隣接ピッチで実装するのに一番問題となる点である。
【０１６３】
これに対して、本発明の電子部品集合体及びその実装方法では、電子部品が積層されて構成された電子部品集合体の実装は、電子部品集合体において電子部品自体が既に狭隣接ピッチに配置され、かつ、固着されてる上に、吸着ノズルにより吸着可能な吸着面を1個の電子部品の幅より大きく、具体的には、複数個の電子部品の幅まで大きくすることができるので、実装動作が安定して行える。また、吸着ノズルと既に実装された他の部品との接触が無くなる為、電子部品同士の狭隣接ピッチでの実装が可能になる。
【図面の簡単な説明】
【図１】 （Ａ），（Ｂ）はそれぞれ本発明の第１実施形態にかかる電子部品集合体及び電子部品集合体の実装方法において、電子部品集合体の製造方法を示す工程図及び電子部品集合体の実装方法により電子部品集合体を回路基板に実装した状態の斜視図である。
【図２】 上記第１実施形態の電子部品集合体の製造方法を実施することができるチップ部品積層装置の透視的な概略斜視図である。
【図３】 上記電子部品集合体の製造方法のフローチャートである。
【図４】 上記電子部品集合体の製造方法においてチップ部品に接着剤を塗布する状態の説明図である。
【図５】 上記電子部品集合体の製造方法においてチップ部品を積層する状態の説明図である。
【図６】 上記電子部品集合体の製造方法においてチップ部品を９０度回転させる状態の説明図である。
【図７】 上記電子部品集合体の製造方法において電子部品集合体を吸着ノズルで吸着する状態の説明図である。
【図８】 （Ａ），（Ｂ）はそれぞれ上記電子部品集合体の製造方法において３個のチップ部品を積層する状態の説明図及び積層された２個チップ部品の上に、積層された２個チップ部品を積層する状態の説明図である。
【図９】 上記電子部品集合体の製造方法においてマーク付き積層チップ部品の斜視図である。
【図１０】 上記電子部品集合体の製造方法において一対の規正部材の規制によりチップ部品の位置決めを行う状態を示す説明図である。
【図１１】 （Ａ），（Ｂ）はそれぞれ上記電子部品集合体の製造方法において複数個のチップ部品１，…，１の積層を同時的に、かつ、連続的に行う場合を示す説明図である。
【図１２】 （Ａ），（Ｂ），（Ｃ）はそれぞれ本発明の第１実施形態の変形例にかかる電子部品集合体及び電子部品集合体の実装方法において、電子部品集合体の製造方法を示す工程図及び電子部品集合体の実装方法により電子部品集合体を回路基板に実装した状態の斜視図である。
【図１３】 （Ａ），（Ｂ）はそれぞれ本発明の第２実施形態にかかる電子部品集合体及び電子部品集合体の実装方法において、電子部品集合体の製造方法を示す工程図及び電子部品集合体の実装方法により電子部品集合体を回路基板に実装した状態の斜視図である。
【図１４】 本発明の第２実施形態にかかる電子部品集合体及び電子部品集合体の実装方法のフローチャートである。
【図１５】 （Ａ），（Ｂ）はそれぞれチップ部品にシート状絶縁層を溶着する状態の説明図及び溶着後の電子部品の説明図である。
【図１６】 （Ａ），（Ｂ）はそれぞれチップ部品に粘着層を転写する状態の説明図及び転写後の電子部品の説明図である。
【図１７】 チップ部品の電極の幅とランドの幅との関係を示す説明図である。
【図１８】 （Ａ），（Ｂ）はそれぞれ本発明の第１実施形態にかかる電子部品集合体を吸着ノズルで吸着して実装する状態の説明図及び従来の実装方法においてチップ部品を1個ずつ吸着ノズルで吸着して実装する状態の説明図である。
【図１９】 （Ａ），（Ｂ），（Ｃ）はそれぞれ本発明の第２実施形態の変形例にかかる電子部品集合体及び電子部品集合体の実装方法において、電子部品集合体の製造方法を示す工程図及び電子部品集合体の実装方法により電子部品集合体を回路基板に実装した状態の斜視図である。
【図２０】 （Ａ），（Ｂ），（Ｃ）はそれぞれ本発明の第２実施形態の別の変形例にかかる電子部品集合体及び電子部品集合体の実装方法において、電子部品集合体の製造方法を示す工程図及び電子部品集合体の実装方法により電子部品集合体を回路基板に実装した状態の斜視図である。
【図２１】 従来のチップ部品の回路基板への実装状態を示す平面図である。
【図２２】 図１の本発明の第１実施形態の別の変形例として、絶縁シートを介して2個の電子部品集合体を連結して１つの電子部品集合体として実装する状態を説明する斜視図である。
【図２３】 図１２の本発明の第１実施形態のさらに別の変形例として、絶縁シートを介して2個の電子部品集合体を連結して１つの電子部品集合体として実装する状態を説明する斜視図である。
【図２４】 図２３の電子部品集合体を絶縁シートを介してさらに別の図２３の電子部品集合体と連結して、１つの電子部品集合体として実装する状態を説明する斜視図である。
【図２５】 本発明の他の実施形態として電子部品集合体を製造する装置を示す斜視図である。
【図２６】 図２５の電子部品集合体製造装置が組み込まれた多機能型の部品実装装置の部分的に透視図的に示された概略斜視図である。
【図２７】 図２５の電子部品集合体製造装置が組み込まれた高速機型の部品実装装置の部分的に透視図的に示された概略斜視図である。
【図２８】 図２５の電子部品集合体製造装置のチップ部品位置規制部材の拡大平面図である。
【図２９】 上記実施形態において、一枚の絶縁層を隣接するチップ部品間に配置して互いに絶縁層の有する粘着性でもってチップ部品を固着する変形例を示す説明図である。
【図３０】 上記実施形態において、２枚の絶縁層を隣接するチップ部品の電極間に配置して互いに絶縁層の有する粘着性でもってチップ部品を固着する変形例を示す説明図である。
【図３１】 図３０の変形例において対向電極間に２枚の絶縁層を配置する状態の電極間部分の拡大図である。
【図３２】 図３０の変形例において対向電極間に１枚の絶縁層を配置する状態の電極間部分の拡大図である。
【符号の説明】
１…チップ部品、２…絶縁層、３，５，７，８…電子部品集合体、３a，５a…吸着面、４…絶縁性接着剤、５a…吸着面、６…補助シート、６a…回路配線、７a，８ａ…吸着面、２１…回路、２２…チップ部品電極、２３…回路基板、２４…絶縁層、２６，２７…電子部品集合体、２７a…吸着面、２９…放熱用空間、３０…送りリール、３１…巻取リール、３２…加熱加圧ツール、３２ａ…加圧部、３３…絶縁性粘着フィルム、３４…ベースフィルム、３５…粘着層、３６…加圧ツール、４０…マーク、４１，４２…規制部材、４１ａ，４２ａ…規制縁部、４１ｂ，４２ｂ…係止突起、４３…隙間、４４…規制板、４５…隙間、６８…ＸＹロボット、６９…吸着ノズル、７０…部品供給部、７０ａ…部品供給カセット、７１…吸着ヘッド、７２…絶縁性接着剤塗布装置、７２ａ…塗布ノズル、７３…認識装置、７４…Ｙ方向移動装置、７５…Ｘ方向移動装置、７６…Ｙ方向駆動モータ、７７…Ｘ方向駆動モータ、７８…チップ部品載置テーブル、７８ａ…吸引孔、７９…チップ部品認識装置、８０…モータ、８１…Ｙ方向移動装置、８１ａ…Ｙ方向移動装置本体、８２…ネジ軸、８３…電子部品集合体収納部、８３ａ…部品収納カセット、８４…硬化装置、８５…実装装置出入り口、９０…吸着ブロック、９０ａ…吸着面、１００，１０１，１０２，１０３…絶縁シート、１０５…接着剤、２００…テープ、２０１…吸着ノズル、２０２…矩形枠型のチップ部品位置規制部材、２０２ａ…エアシリンダ、２０２ｂ…押圧板、２０２ｃ…エアシリンダ、２０２ｄ…押圧板、２０２ｆ…回転テーブル周方向の時計方向側の規制壁、２０２ｇ…回転テーブル内周側の規制壁、２０２ｈ…開口、２０３…回転テーブル、２０４…回転駆動装置、２０５…接着剤塗布装置、２０５ａ…塗布ノズル、２０６…硬化装置、２０７…吸着ノズル、２０８…吸着ノズル、２１０…電子部品集合体製造装置、２２０…チップ部品供給装置、２２１…回路基板位置決め装置、２２２…部品部品供給装置、２２３…実装ヘッド、２２４…ＸＹロボット、２２５…基板搬送装置、２３０…部品供給装置駆動装置、２３１…基板位置決め装置、２３３…ロータリーヘッド、２３４…チップ部品供給用ロータリーヘッド、２３５…基板搬送装置、Ｉ…チップ部品積層位置、ＩＩ…チップ部品位置規制位置、ＩＩＩ…絶縁シート貼り付け位置、ＩＶ…チップ部品固定位置、Ｖ…接着剤硬化位置、ＶＩ…チップ部品取出し位置。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component assembly in which a plurality of rectangular parallelepiped electronic components (hereinafter simply referred to as chip components) having electrodes at both ends, a method of manufacturing the electronic component assembly, a circuit board, and the like The present invention relates to a mounting method for an electronic component assembly in which the electronic component assembly is mounted on a mounted body such as a circuit forming body or other components.
[0002]
[Prior art]
In recent years, as a method for reducing the mounting area of a chip component on a circuit board, it is common to reduce the distance between adjacent chip components.
[0003]
[Problems to be solved by the invention]
However, when the distance between the chip components is reduced, the chip component to be mounted in the chip component mounting process is already mounted if the chip component is sucked and mounted while being slightly displaced from the suction nozzle. In addition, there is a problem that physical contact with other chip parts causes a misalignment of the chip parts. Also, when recovering, for example, remounting a short component, the short component could not be mounted next to the tall component. Further, when the number of chip parts to be mounted is increased, there is a problem in the mounting process in that the time required for mounting is extended in a geometric series. In addition, there is a problem that if the chip component is physically contacted and mounted in order to reduce the distance between the chip components in this way, the heat radiation action cannot be performed when the chip component generates heat. It was.
[0004]
Accordingly, an object of the present invention is to solve the above-described problem, and can reduce the mounting area of the electronic component on the mounted body without causing a misalignment of the electronic component, and the electronic component. Provided are an electronic component assembly capable of radiating heat when heat is generated, a method of manufacturing the electronic component assembly, and a mounting method of the electronic component assembly capable of manufacturing an excellent quality mounted body. It is in.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is configured as follows.
[0006]
  According to the first aspect of the present invention,Both endsAt least two or more rectangular parallelepiped electronic components having electrodes are stacked in a direction perpendicular to the longitudinal direction of the electronic components, and the stacked electronic components face each other.The electrodes are fixed with an adhesive insulating layer, and a space for heat dissipation is formed between the stacked surfaces of electronic components other than the electrodes facing each other.Electronic component assemblyIs a mounting method of an electronic component assembly that is mounted at a predetermined position on a circuit board after being sucked by a suction nozzle,
The suction surface of the electronic component assembly sucked by the suction nozzle is a side surface in the longitudinal direction of the stacked electronic components that straddle a plurality of adjacent electronic components, and the plurality of adjacent electronic components It is a side other than the electrode,
An electronic component assembly mounting method is provided, wherein an outer diameter of the suction nozzle is larger than a width in a direction perpendicular to a longitudinal direction of one electronic component.
[0007]
  According to a second aspect of the invention,An outer diameter of the suction nozzle is larger than a width in a direction orthogonal to a longitudinal direction of the plurality of electronic components.Electronic component assembly according to the first aspectHow to implementI will provide a.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments according to the present invention will be described below in detail with reference to the drawings.
[0029]
The electronic component assembly 5 and the method for manufacturing the electronic component assembly 5 according to the first embodiment of the present invention will be described below.
[0030]
As shown in FIG. 1A, the electronic component assembly 5 includes a plurality of electronic components, for example, chip components 1 and 1 arranged in parallel in the longitudinal direction thereof, and a laminated surface of adjacent chip components 1 and 1. The liquid and adhesive insulating layers 4 and 4 are arranged between the electrodes 22 and 22 and fixed together with the adhesive properties of the insulating layers 4 and 4, whereby a plurality of chip components 1 and 1 are provided. Are stacked in a direction perpendicular to the longitudinal direction and in the lateral direction. The number of chip components 1 to be stacked is an arbitrary number of at least two or more. As an example, the chip component 1 has electrodes 22 on at least a mounting surface and a laminated surface. In the illustrated example, the chip component 1 is a surface facing the mounting surface other than the mounting surface and the stacking surface, and is mounted on the top surface during mounting, on the chip component end surface adjacent to both the mounting surface and the stacking surface, respectively. It has an electrode 22.
[0031]
The insulating layer 4 is disposed between the electrodes 22 and 22 of the chip components 1 and 1 constituting the electronic component assembly 5, and is provided to prevent the chip component electrodes 22 and 22 from being electrically short-circuited. However, the insulating layer 4 is not disposed in the portion other than the electrodes 22 and 22 so that the opposing surfaces of the chip component 1 are exposed through the space, and the heat radiation space 29 is secured, so that the chip component 1 , 1 can generate heat when it generates heat. The insulating layer 4 is a liquid thermosetting resin that has adhesiveness at room temperature and chemically develops when heated, such as an epoxy resin, an acrylic resin, a silicone resin, and a urea resin. An epoxy resin having excellent electrical characteristics is preferable, as long as it is a polyimide resin or a phenol resin. In this case, as shown in FIG. 1 (A), the electronic component assembly 5 has a plurality of chip components 1 and 1 arranged in parallel in the longitudinal direction, and opposed between adjacent chip components 1 and 1. Insulating layers 4 and 4 are respectively formed by applying a liquid and adhesive insulating adhesive to the two electrodes 22 and 22 on either one surface or both surfaces, respectively, and Adjacent chip components 1 and 1 are fixed to each other with the adhesiveness of the insulating layers 4 and 4 so that the plurality of chip components 1 and 1 are stacked in the direction perpendicular to the longitudinal direction and in the lateral direction. It is configured. The number of chip components 1 to be stacked is an arbitrary number of at least two or more.
[0032]
As shown in FIG. 1B, the electronic component assembly 5 configured in this way is an example of a mounted body with the surface where all the electrodes 22,..., 22 of each chip component 1 are exposed facing down. Are mounted on predetermined electrodes (not shown) of the circuit 21 of the circuit board 23, and the electrodes 22 of the chip components 1 of the electronic component assembly 5 are electrically connected to the electrodes of the circuit 21 of the circuit board 23, respectively. It is trying to be connected.
[0033]
The side surface of the at least one electronic component 1 on which the insulating layer 4 is not disposed is the laminated state when the electronic component 1 in the laminated state, that is, the electronic component assembly 5 is mounted on the circuit board 23. The electronic component assembly 5 which is the electronic component 1 functions as a flat suction surface 5a for sucking and holding. Further, as will be described later, when the outer diameter of the suction nozzle 69 is larger than the width of the side surface of one electronic component 1, the suction surface 5a extends over the electronic components 1 and 1 adjacent to each other. 1 and 1 side surface (upper surface in FIG. 1B), and the side surface where the insulating layer 4 does not protrude from between the plurality of adjacent electronic components 1 and 1 is used.
[0034]
A method for mounting the electronic component assembly for mounting the electronic component assembly 5 on the circuit board 23 will be described with reference to FIGS. Here, the electronic component assembly 5 will be described as an example.
[0035]
First, an electronic component assembly mounting apparatus, that is, a chip component stacking apparatus that can implement the mounting method will be described with reference to FIG. In this mounting apparatus, a Y-direction moving device 81 capable of moving the chip component placement table 78 only in the Y direction is arranged at the center, and the chip component placement table 78 placed on the Y-direction movement device 81 is sandwiched. Thus, a large number of chip components 1 can be accommodated, and a component supply unit 70 that can be supplied to the table 78 one by one, and a large number of electronic component assemblies 5 in which a plurality of chip components 1,. An electronic component assembly storage portion 83 is disposed. The suction head 71 is further provided so as to be movable among the component supply unit 70, the table 78, and the electronic component assembly storage unit 83.
[0036]
In the component supply unit 70, a plurality of component supply cassettes 70a,. Each component supply cassette 70a has a known tape component. That is, a large number of chip components 1,..., 1 are individually housed in a large number of recesses of the carrier tape, and such tape components are incorporated in the component supply cassette 70a while being covered with the cover tape. Therefore, as in the known tape component supply format, by feeding the carrier tape at a predetermined pitch, the cover tape is removed and one recess is exposed to the component takeout portion. The chip component 1 can be held by suction.
[0037]
The table 78 penetrates and forms one or more suction holes 78a,..., 78a connected to a vacuum suction device (not shown) so that the chip component 1 placed on the table 78 can be sucked and held. I am doing it. In the Y-direction moving device 81 that supports the table 78 substantially horizontally, the screw shaft 82 is rotated forward and backward by the rotational drive of the motor 80, and the Y-direction moving device is fixed to a nut (not shown) screwed to the screw shaft 82. The apparatus main body 81a moves forward and backward in the Y direction, and is movable through the mounting apparatus entrance / exit 85 to the inside of the curing apparatus 84 adjacent to the mounting apparatus. A chip component recognition device 79 composed of a CCD camera or the like is disposed on the component supply unit side of the Y-direction moving device 81, and the position of the chip component 1 sucked by the suction nozzle 69, the electrode state on the bottom surface, the outer shape, and the like. Component recognition can be performed.
[0038]
The suction head 71 can be moved in the X and Y directions by an XY robot 68 including an X direction moving device 75 and a Y direction moving device 74. The X-direction moving device 75 rotates a screw shaft (not shown) forward and backward by forward and reverse rotation of an X-direction drive motor 77, and a nut (not shown) screwed to the screw shaft is fixed in the Y direction. The moving device 74 can be moved back and forth in the X direction. The Y-direction moving device 74 rotates a screw shaft (not shown) forward and backward by forward and reverse rotation of the Y-direction drive motor 76, and a suction head to which a nut (not shown) screwed to the screw shaft is fixed. 71 can be moved forward and backward in the Y direction.
[0039]
The suction head 71 is provided with five suction nozzles 69,..., 69 along the Y direction. For example, the chip parts 1,..., 1 from five component supply cassettes 70a,. Are sucked and held by the five suction nozzles 69,... 69 and can be conveyed toward the table 78. A recognition device 73 is attached to the end portion of the suction head 71 so that the position and mounting state of the chip component 1 on the table 78 can be recognized. The placement state recognition information is used for correction during storage. An insulating adhesive coating device 72 having a pair of coating nozzles 72a and 72a is disposed at the other end of the suction head 71.
[0040]
The electronic component assembly storage section 83 includes a component storage cassette 83a as an example of a component storage member having a structure similar to that of the component supply cassette, and the electronic component assembly 5,. After being individually stored in a number of recesses of the carrier tape, it is covered with a cover tape.
[0041]
The electronic component assembly mounting apparatus configured as described above conveys five chip components 1,..., One unit at a time from the component supply unit 70 to the table 78, and on the table 78, the five electronic components are mounted. The component assemblies 5,..., 5 can be manufactured simultaneously, and the manufactured five electronic component assemblies 5,..., 5 can be stored in the electronic component assembly storage portion 83 simultaneously. Yes. However, for ease of understanding, in the following description, a case where one electronic component assembly 5 is manufactured and stored will be described.
[0042]
First, as shown in FIG. 5, in step S <b> 11, one chip component 1 individually housed in a number of concave portions of the carrier tape of the component supply cassette 70 a of the component supply unit 70 is sucked and held by the suction nozzle 69. After removal from the recess, the suction head 71 moves from the component supply cassette 70a toward the chip component recognition device 79.
[0043]
Next, in step S12, the chip component 1 sucked and held by the suction nozzle 69 is recognized by the chip component recognition device 79 to determine whether the position of the chip component 1 and the state of the electrodes 22 and 22 on the bottom surface are good or bad. If the state of the electrodes 22 and 22 is poor, the chip component 1 sucked and held by the suction nozzle 69 is discarded without being placed on the table 78, and another chip component 1 is sucked and held again to chip. It is recognized by the component recognition device 79. At this time, the thickness of the chip component 1 may be further recognized.
[0044]
Next, in step S <b> 13, the chip component 1 sucked and held by the suction nozzle 69 is placed on the table 78 based on the recognition result by the chip component recognition device 79. At this time, suction is performed through the suction holes 78 a,..., 78 a on the table side, and the mounted chip component 1 is sucked and held on the surface of the table 78.
[0045]
Next, in step S <b> 14, the recognition device 73 provided in the suction head 71 recognizes the chip component 1 sucked and held on the table 78 and recognizes the position and mounting state of the chip component 1. At this time, the upper surface of the chip component 1 is a stacked surface on which another chip component 1 is stacked.
[0046]
Next, in step S15, based on the recognition result by the recognition device 73 provided in the suction head 71, as shown in FIG. 4, at both ends of the laminated surface that is the upper surface of the chip component 1 sucked and held on the table. A predetermined amount of adhesive 4 is applied from the two adhesive application nozzles 72a and 72a. Thereby, the insulating layer 4 is formed. At this time, the adhesive 4 is not applied to portions other than both end portions of the laminated surface on the upper surface of the chip component 1. As shown in FIG. 4, if an adhesive is applied to both electrodes 22, 22 on the upper surface of the chip component 1, the chip component 1 for lamination can be joined and insulated at the same time. In addition, the adhesive is applied to the entire upper surface of the chip component 1 so as not to be applied only to both the electrodes 22 and 22 on the upper surface of the chip component 1, and other than both ends of the laminated surface of the upper surface of the chip component 1. It is possible to form an insulating layer with the adhesive 4 at the portion and to form a heat radiation space 29 between the two insulating layers by facing each other, but the gap between the heat radiation spaces 29 is reduced. In addition, the chip component 1 itself is exposed to the portions other than both ends of the laminated surface on the upper surface of the chip component 1 without exposing the chip component 1 itself, and a sufficient heat radiation space 29 for preventing heat generation is secured. can do.
[0047]
Next, in step S <b> 16, the recognition device 73 provided in the suction head 71 recognizes the position of the chip component 1 on the table 78 and the adhesive application state again. Based on the recognition result of the recognition device 73 provided on the suction head 71, it is determined whether or not a predetermined amount of adhesive has been applied to a predetermined position of the chip component 1. An agent is applied or the chip component 1 is discarded. If enough, go to the next step.
[0048]
Next, in step S17, the next chip component 1 is sucked and held and taken out. That is, after one chip component 1 in the recess of the carrier tape of the component supply cassette 70a of the component supply unit 70 is sucked and held by the suction nozzle 69 and taken out from the recess, the suction head 71 is removed from the component supply cassette 70a by the chip component recognition device. Move towards 79.
[0049]
Note that step S15, step S16, and step S17 may be performed simultaneously by arranging necessary devices or members, respectively.
[0050]
Next, in step S18, the chip component 1 sucked and held by the suction nozzle 69 is recognized by the chip component recognition device 79, and the quality of the position of the chip component 1 and the state of the electrodes 22 and 22 on the bottom surface is determined. If the state of the electrodes 22 and 22 is poor, the chip component 1 sucked and held by the suction nozzle 69 is discarded without being placed on the table 78, and another chip component 1 is sucked and held again to chip. It is recognized by the component recognition device 79. When the state of the electrodes 22 and 22 is good, the process proceeds to step S19. At this time, the thickness of the chip component 1 may be further recognized.
[0051]
Next, in step S19, as shown in FIG. 5, the chip part 1 sucked and held by the suction nozzle 69 is mounted on the chip part 1 on the table 78 via the insulating layer 4 of adhesive. At this time, the chip component 1 placed on the table side is continuously sucked through the suction holes 78 a,..., 78 a and remains sucked and held on the surface of the table 78.
[0052]
Next, in step S20, the adhesive insulating layer 4 is hardened to dissipate heat between the opposing surfaces of the adjacent chip components 1, 1 other than the electrodes 22 and 22 where the insulating layer 4 is formed. A space 29 is formed. That is, the Y-direction moving device 81 causes the Y-direction moving device main body 81a on which the table 78 is placed to advance to the Y-direction curing device side, and enters the curing device 84 adjacent to the mounting device via the mounting device entrance / exit 85. enter. In this curing device 84, the insulating layer 4 of the adhesive is heated and cured, and the two chip components 1 and 1 are fixed. After curing, the Y-direction moving device 81 returns the Y-direction moving device main body 81a on which the table 78 is placed from the curing device side to the inside of the mounting device via the mounting device entrance 85 along the Y direction.
[0053]
Next, in step S21, it is determined whether there is a chip component 1 to be further laminated. That is, it is determined whether or not three or more chip components 1 are stacked. When three or more chip components 1 are stacked, the process returns to step S14, and steps S14 to S21 are repeated as shown in FIG. If the number of chip parts 1 is less than 3, that is, 2 chips, the process proceeds to step S22.
[0054]
Next, in step S <b> 22, the side surfaces of the two stacked chip components 1, 1 are sucked by the suction surface 90 a of the suction block 90 as indicated by the solid line in FIG. 6. The suction surface 90a is provided with a number of suction holes (not shown) connected to a vacuum suction device (not shown), and the side surfaces of the two stacked chip components 1 and 1 by the suction holes. To adsorb.
[0055]
Next, in step S23, the suction block 90 is sucked by the rotation driving device (not shown) such as a cylinder while the side surfaces of the two stacked chip components 1 and 1 are sucked onto the suction surface 90a. Rotate 90 degrees from the state as in the two-dot chain line state. As a result, the two side surfaces of the two stacked chip components 1, 1, that is, the suction surface 5 a of the electronic component assembly 5 are positioned upward. That is, by rotating the electronic component assembly 5 composed of the two stacked chip components 1 and 1 by 90 degrees, the suction surface 5a of the electronic component assembly 5 is attached to the suction nozzle 69 when the electronic component assembly 5 is mounted. , 22 can make all the electrodes 22,..., 22 of the electronic component assembly 5 face the circuit board 23, and narrow adjacent mounting is possible with the conventional mounting method.
[0056]
Next, in step S24, the suction surface 5a of the electronic component assembly 5 is sucked and held by the suction nozzle 69 as shown in FIG.
[0057]
Next, in step S25, the chip component recognition device 79 disposed on the component supply unit side of the Y-direction moving device 81 uses the bottom surface of the electronic component assembly 5, that is, each of the two stacked chip components 1,1. The state of the electrodes 22 and 22 is recognized. If the state of the electrodes 22 and 22 is poor, the process does not proceed to the next step, that is, the electronic component assembly 5 sucked and held by the suction nozzle 69 is discarded without being stored in the electronic component assembly storage portion 83. . When the state of the electrodes 22 and 22 is good, the process proceeds to step S26. At this time, in order to confirm the insulation, for example, a probe may be brought into contact with each of the two electrodes 22 and 22 of the adjacent chip components 1 and 1 to inspect whether there is conduction.
[0058]
Next, in step S <b> 26, the electronic component assembly 5 sucked and held by the suction nozzle 69 is stored in the concave portion of the component storage cassette 83 a of the electronic component assembly storage portion 83 and then covered with a cover tape.
[0059]
In this way, the electronic component assembly 5 is formed from the plurality of chip components 1, 1 and stored in the electronic component assembly storage portion 83, thereby completing the manufacture of the electronic component assembly 5.
[0060]
When the electronic component assembly 5 is composed of four chip components 1,..., 1, as shown in FIG. 8 (B), on the stacked two chip components 1, 1, The stacking of the two chip components 1 and 1 is more stable than the stacking of four chip components 1,..., 1 one by one. As a result, the play of the chip component 1 when stacked can be suppressed.
[0061]
Further, since the chip component 1 is very small, for example, length 1.0 mm × length 0.5 mm × width 0.2 mm, the position of the chip component 1 is confirmed before each operation as described above. It is preferable that each operation can be performed smoothly and reliably.
[0062]
When mounting the electronic component assemblies 5,..., 5 manufactured as described above, a conventional chip component 1 is supplied one by one using a conventionally known electronic component mounting apparatus (not shown). As in the case of mounting on a circuit board or the like after sucking and holding and recognizing the position, the electronic component assembly 5 is sucked and held from the component supply cassette (corresponding to the component storage cassette 83a in FIG. 2) one by one. After recognizing the position, it may be mounted on a circuit board.
[0063]
According to the first embodiment, the plurality of chip components 1,..., 1 are not individually mounted on the circuit board 23, but the plurality of chip components 1,. In addition, the adjacent chip components 1 and 1 are fixed to each other by laminating in the horizontal direction and disposing an insulating adhesive as insulating layers 4 and 4 between the electrodes 22 and 22 of the adjacent chip components 1 and 1. Since the electronic component assembly 5 is configured, positional displacement between the plurality of chip components 1,..., 1 can be prevented, and the mounting area can be reduced. Further, an insulating adhesive is disposed between the electrodes 22 and 22 of the adjacent chip components 1 and 1 as the insulating layers 4 and 4, and an insulating layer is provided on portions other than the electrodes 22 and 22 of the adjacent chip components 1 and 1. 4 and the heat radiation space 29 can be secured, so that the heat radiation action can be performed when the chip parts 1 and 1 generate heat.
[0064]
Further, when the electronic component assembly 5 is stored, the electronic component assembly 5 constituted by the two stacked chip components 1 and 1 in the vertical direction is rotated 90 degrees to be stacked in the lateral direction. Since the suction surface 5a of the electronic component assembly 5 faces the upper surface when the assembly 5 is mounted, the electronic component assembly 5 is stored in the component storage portion 83 in that state. If the suction surface 5a of the body 5 is sucked by the suction nozzle 69, all the electrodes 22,..., 22 of the electronic component assembly 5 can be made to face the circuit board 23. Is possible.
[0065]
In addition, since the electronic component assembly 5 composed of a plurality of chip components 1,..., 1 can be mounted on the circuit board 23 by handling it as a single component, a plurality of chip components 1,. The time required for the mounting process can be shortened as compared with the case where 1 is mounted.
[0066]
Further, if the electronic component assembly 5 is rotated 90 degrees when the electronic component assembly 5 is mounted on the circuit board 23 or the like, the structure of the mounting head becomes complicated. For this reason, in the first embodiment, the electronic component assembly 5 is stored by rotating it 90 degrees in advance so that it can be mounted in the same manner as other electronic components. It is better to be able to adsorb to. Since the land 21a of the circuit 21 of the circuit board 23 is narrowly adjacent to the chip component 1, no short circuit or the like occurs, so that the land 21a is determined from the width W of the electrode 22 of the chip component 1 as shown in FIG. It is necessary to reduce (narrow) the width V.
[0067]
Further, the suction nozzle 69 for sucking the chip component 1 is more difficult to manufacture as the outer diameter is smaller, and more easily affected by dust and the like, so it is practically difficult to reduce the size. As in the conventional mounting state of B), there is a portion that protrudes because the outer diameter of the suction nozzle 69 is larger than the width of one chip component 1. When the chip component 1 is sucked by the suction nozzle 69 in this state and then mounted on the circuit board or the like, the protruding portion of the suction nozzle 69 is prevented from hitting another component 1 already mounted on the circuit board. This is the most problematic point for mounting the chip component 1 with a narrow adjacent pitch.
[0068]
On the other hand, in the first embodiment, as shown in FIG. 18A, mounting of the electronic component assembly 5 formed by stacking the chip components 1,... , 1 are already arranged at a narrow adjacent pitch and fixed, and the suction surface 5a that can be sucked by the suction nozzle 69 is larger than the width of one chip part 1, specifically Since the width of the plurality of chip parts 1 and 1 can be increased, the mounting operation can be performed stably. Further, since there is no contact between the suction nozzle 69 and other components already mounted, the chip components 1 and 1 can be mounted at a narrow adjacent pitch.
[0069]
In addition, this invention is not limited to the said embodiment, It can implement with another various aspect.
[0070]
For example, as shown in FIG. 9, when the stacking type mark 40 is attached to the side surface or upper and lower surfaces of the chip component 1 after stacking, before stacking, or during stacking, the component name becomes invisible due to stacking. The type of chip component 1 can also be confirmed by recognizing the stacking type specific mark 40. In addition, a mark for displaying characteristic information such as the number of stacked layers and capacity may be provided, or included in the stacking type specific mark 40.
[0071]
In the first embodiment, the recognition operation is frequently used in order to stack the chip components 1 and 1 without causing a step shift in the chip component 1 without the step difference in the chip component 1. As shown in FIG. 10, the outer shape of the chip component 1 can be regulated on the table 78 by the pair of regulating members 41 and 42. That is, the first restricting member 41 that can move on the table 78 includes a restricting edge portion 41 a that restricts the side surface of the chip component 1, and a locking protrusion 41 b that engages with an end surface of one end of the chip component 1. The second restricting member 42 that can move on the table 78 and can contact and separate from the first restricting member 41 includes a restricting edge portion 42 a that restricts the side surface of the chip component 1 that faces the side surface, and the chip component 1. And a locking projection 42b that locks to the end surface of the other end. In the state where the side surface of the chip component 1 is regulated by the regulating edge 41a of the first regulating member 41 and is locked to the end surface of one end of the chip component 1 by the locking projection 41b, the second regulating member 42 is shown in FIG. The first restricting member 41 is approached from the position of the chain line to the position of the solid line, the opposing side surface of the chip part 1 is restricted by the restricting edge part 42a of the second restricting member 42, and the other of the chip part 1 is restricted by the locking protrusion 42b. The end face of the end is locked. Thereby, the chip part 1 is sandwiched in the gap 43 between the first restriction member 41 and the second restriction member 42, and the first restriction member 41 and the second restriction member are arranged in the width direction of the chip part 1. In the longitudinal direction of the chip part 1, both of the first and second restricting protrusions 41 b and 42 b restrict the first and second restricting edges 41 a and 42 a. The position of the chip component 1 is regulated.
[0072]
In this way, by restricting the position of the chip component 1, it is possible to detect the position of the chip component 1 with high accuracy and reduce the recognition time. Further, if all the operations are not performed in the regulated state by the first regulating member 41 and the second regulating member 42, and the regulation position of the first chip component 1 is recognized, it is easy to teach the outline regulation of the chip component 1. become. Therefore, an effective method may be selected from the viewpoints of productivity, model switching, and the like to determine whether all operations are performed in a restricted state or only a part of operations are performed in a restricted state.
[0073]
In addition, the electronic component assembly 5 is not limited to be manufactured one by one from the plurality of chip components 1,..., 1 one by one, but a plurality of chips as shown in FIGS. The stacking of the components 1,..., 1, that is, the manufacturing of the plurality of electronic component assemblies 5, 5, 5 may be performed simultaneously and continuously. That is, as shown in FIG. 11A, a plurality of chip components 1,..., 1 from a component supply unit 70 are placed in a gap 45 between two restricting plates 44, 44 movably arranged on a table 78. Are sequentially sucked and held, and then the insulating adhesive is applied by the application nozzles 72a and 72a of the insulating adhesive applying device 72. Then, the insulating adhesive is cured by the curing device 84, and a cylinder or the like is applied. Use a rotation drive device, or twist the transport path or suck it with a suction block and rotate it 90 degrees, or tilt it so that it rotates 90 degrees, and finally control it, as shown in FIG. As shown, the manufactured electronic component assembly 5 is taken out and stored in the electronic component assembly storage portion 83. In this way, the insertion operation into the gap 45 on the table 78, the application operation of the insulating adhesive, the recognition operation, the removal and storage operation of the electronic component assembly 5 are performed simultaneously to improve productivity. You may make it make it. On the table 78, the gap 45 between the two restricting plates 44, 44 can be adjusted according to the width of the chip component 1 by moving at least one restricting plate 44.
[0074]
As a modification of the first embodiment, the auxiliary chip 6 is used as a carrier, and the stacked chip components 1,..., 1 are mounted on the circuit board 23 in a state where they are stacked vertically. Also good. That is, as shown in FIGS. 12A to 12C, the carrier-type electronic component assembly 8 includes an auxiliary sheet 6 as a carrier having circuit wiring 6 a and the chip components 1 of the electronic component assembly 5. The electrodes 22, 22 and one end of the circuit wiring 6 a are electrically connected to each other, and the other end of the circuit wiring 6 a is arranged near the lower end of the auxiliary sheet 6. The plurality of chip components 1,..., 1 are stacked on the circuit board 23 in the thickness direction so that the other end of each circuit wiring 6a is electrically connected to a predetermined electrode of the circuit 21 of the circuit board 23. To be implemented. When the carrier-type electronic component assembly 8 is mounted on the circuit board 23, the suction nozzle 69 holds and holds the flat suction surface 8a in the middle portion between the electrodes 22 and 22 on both ends of the uppermost chip component 1 by suction. What should I do? The circuit wirings 6a may be independent from each other or may be partially connected to each other.
[0075]
The material used as the auxiliary sheet 6 having the circuit wiring 6a constituting the carrier-type electronic component assembly 8 is not particularly limited, but a material excellent in electrical insulation such as polyimide resin or epoxy resin is suitable. is there.
[0076]
When considering a method of reducing the mounting area of the circuit board by shortening the distance between adjacent chip components mounted independently, the direction is limited to the direction along the surface of the circuit board. On the other hand, in the carrier-type electronic component assembly 8 of the modified example of the first embodiment, the plurality of chip components 1,..., 1 are stacked on the circuit board 23 in a direction perpendicular to the direction along the surface. Thus, the mounting area on the circuit board 23 can be reduced. That is, since the plurality of chip parts 1,..., 1 are stacked on the circuit board 23 in the thickness direction, the mounting area on the circuit board 23 is not much different from the case of the single chip part 1. The mounting area on the substrate 23 can be further reduced.
[0077]
Further, the insulating layer is not limited to a liquid layer, and may be a sheet as described below. That is, the electronic component assembly 3 and the method for manufacturing the electronic component assembly 3 according to the second embodiment of the present invention will be described below.
[0078]
As shown in FIG. 13A, the electronic component assembly 3 includes a plurality of chip components 1 and 1 arranged in parallel in the longitudinal direction, and between the electrodes 22 and 22 of adjacent chip components 1 and 1. In addition, the insulating layers 2 and 2 are in the form of a sheet, and the insulating layers 2 and 2 are arranged so that the insulating layers 2 and 2 are not disposed in portions other than between the electrodes 22 and 22. Thus, by fixing the chip components 1 and 1, the plurality of chip components 1 and 1 are stacked in the direction perpendicular to the longitudinal direction and in the lateral direction. The number of chip components 1 to be stacked is an arbitrary number of at least two or more.
[0079]
The insulating layer 2 is disposed between the electrodes 22 and 22 of the chip components 1 and 1 constituting the electronic component assembly 3 and is provided to prevent the chip component electrodes 22 and 22 from being electrically short-circuited. ing. This insulating layer 2 is sticky at room temperature, and is a sheet-like thermosetting resin that is chemically adhesive when heated, such as an epoxy resin, an acrylic resin, a silicone resin, or A phenolic resin or the like may be used, but an epoxy resin having excellent electrical characteristics is preferable.
[0080]
A side surface of the at least one electronic component 1 on which the insulating layer 2 is not disposed attracts and holds the stacked electronic component 1 when the stacked electronic component 1 is mounted on the circuit board 23. It functions so as to function as a flat suction surface 3a. Further, when the outer diameter of the suction nozzle 69 is larger than the width of the side surface of one electronic component 1, the suction surface 3a is formed on the side surface of the electronic components 1, 1 straddling the plurality of adjacent electronic components 1, 1. And the side surface on which the insulating layer 2 does not protrude from between the plurality of adjacent electronic components 1 and 1.
[0081]
As shown in FIG. 13B, the electronic component assembly 3 configured in this way is an example of a mounted body with the surface where all the electrodes 22,..., 22 of each chip component 1 are exposed facing down. Are mounted on predetermined electrodes (not shown) of the circuit 21 of the circuit board 23, and the electrodes 22 of the chip components 1 of the electronic component assembly 3 are electrically connected to the electrodes of the circuit 21 of the circuit board 23. To be.
[0082]
FIG. 14 is a flowchart showing a method of manufacturing the electronic component assembly 3 by stacking a plurality of chip components 1,..., 1 using the sheet-like insulating layers 2 and 2.
[0083]
First, as shown in FIG. 14, in step S31, one chip component 1 individually housed in a number of concave portions of the carrier tape of the component supply cassette 70a of the component supply unit 70 is sucked and held by the suction nozzle 69. After removal from the recess, the suction head 71 moves from the component supply cassette 70a toward the chip component recognition device 79. At this time, a plurality of chip components 1 individually housed in a number of concave portions of the carrier tape of the component supply cassette 70a of the component supply unit 70 are simultaneously sucked and held by a plurality of suction nozzles 69. After taking out from the recess, the suction head 71 may move from the component supply cassette 70a toward the chip component recognition device 79, and sequentially perform the following operations.
[0084]
Next, in step S32, the chip component 1 sucked and held by the suction nozzle 69 is recognized by the chip component recognition device 79, and the quality of the position of the chip component 1 and the state of the electrodes 22 and 22 on the bottom surface is determined. If the state of the electrodes 22 and 22 is poor, the chip component 1 sucked and held by the suction nozzle 69 is discarded without being placed on the table 78, and another chip component 1 is sucked and held again to chip. It is recognized by the component recognition device 79. At this time, the thickness of the chip component 1 may also be recognized.
[0085]
Next, in step S <b> 33, the chip component 1 sucked and held by the suction nozzle 69 is placed on the table 78 based on the recognition result by the chip component recognition device 79. At this time, suction is performed through the suction holes 78 a,..., 78 a on the table side, and the mounted chip component 1 is sucked and held on the surface of the table 78. At this time, before the adhesive or the like is applied, the chip component 1 may be recognized to detect the positional deviation amount.
[0086]
Next, in step S34, the sheet-like insulating layer 2 adsorbed and held by a sheet-like insulating layer adsorbing / holding member (not shown) is brought into contact with the upper surface of the chip component 1, and is pressed and heated to transfer, that is, paste. .
[0087]
Next, in S35, the recognition device 73 provided in the suction head 71 recognizes the chip component 1 sucked and held on the table 78, and the position and mounting state of the chip component 1 and the sheet-like insulating layer 2 are detected. Recognize the state. At this time, the upper surface of the chip component 1 is a stacked surface on which another chip component 1 is stacked.
[0088]
Next, in S36, the next chip component 1 is sucked and held and taken out. That is, after one chip component 1 in the recess of the carrier tape of the component supply cassette 70a of the component supply unit 70 is sucked and held by the suction nozzle 69 and taken out from the recess, the suction head 71 is removed from the component supply cassette 70a by the chip component recognition device. Move towards 79.
[0089]
Next, in S37, the chip component 1 sucked and held by the suction nozzle 69 is recognized by the chip component recognition device 79, and the position of the chip component 1 and the state of the electrodes 22 and 22 on the bottom surface are judged. If the state of the electrodes 22 and 22 is poor, the chip component 1 sucked and held by the suction nozzle 69 is discarded without being placed on the table 78, and another chip component 1 is sucked and held again to chip. It is recognized by the component recognition device 79. If the state of the electrodes 22, 22 is good, the process proceeds to step S38. At this time, the thickness of the chip component 1 may also be recognized.
[0090]
Next, in S38, the chip component 1 sucked and held by the suction nozzle 69 is mounted on the chip component 1 on the table 78 via the sheet-like insulating layer 2 as in FIG. At this time, the chip component 1 placed on the table side is continuously sucked through the suction holes 78 a,..., 78 a and remains sucked and held on the surface of the table 78.
[0091]
Next, in S39, the electrodes of the adjacent chip components 1 and 1 in which the sheet-like insulating layer 2 is formed by joining the chip components 1 and 1 through the sheet-like insulating layer 2 by heating and pressing. A heat radiation space 29 is formed between the opposing surfaces of portions other than 22 and 22. Heating / pressurization is performed by using a heating / pressurizing device provided in the suction head, or by providing another station next to the adhesive curing device. The heating / pressurizing apparatus may be used for heating / pressurizing. Moreover, you may make it perform only pressurization, without heating.
[0092]
Next, in S40, it is determined whether there is a chip component 1 to be further laminated. That is, it is determined whether or not three or more chip components 1 are stacked. When three or more chip components 1 are stacked, the process returns to step S35, and steps S35 to S40 are repeated as in FIG. 8A. If the number of chip parts 1 is less than 3, that is, 2 chips, the process proceeds to step S41.
[0093]
Next, in S41, the side surfaces of the two stacked chip components 1 and 1 are sucked by the suction surface 90a of the suction block 90, as in FIG. The suction surface 90a is provided with a number of suction holes (not shown) connected to a vacuum suction device (not shown), and the side surfaces of the two stacked chip components 1 and 1 by the suction holes. To adsorb.
[0094]
Next, in S42, the suction block 90 keeps the side surfaces of the two stacked chip components 1 and 1 on the suction surface 90a by the rotation driving device (not shown), as in FIG. Rotate degrees. As a result, the two side surfaces of the two stacked chip components 1, 1, that is, the suction surface 3 a of the electronic component assembly 3 are positioned upward. That is, by rotating the electronic component assembly 3 composed of the two stacked chip components 1 and 1 by 90 degrees, the suction surface 3a of the electronic component assembly 3 is moved to the suction nozzle 69 when the electronic component assembly 3 is mounted. , 22 can make all the electrodes 22,..., 22 of the electronic component assembly 3 face the circuit board 23, and narrow adjacent mounting is possible with the conventional mounting method.
[0095]
Next, in S43, the suction surface 3a of the electronic component assembly 3 is sucked and held by the suction nozzle 69 as in FIG.
[0096]
Next, in S44, the bottom of the electronic component assembly 3, that is, the two electrodes of the two stacked chip components 1 and 1, are detected by the chip component recognition device 79 disposed on the component supply unit side of the Y-direction moving device 81. 22 and 22 are recognized. If the state of the electrodes 22 and 22 is poor, the process does not proceed to the next step, that is, the electronic component assembly 3 sucked and held by the suction nozzle 69 is discarded without being stored in the electronic component assembly storage portion 83. . If the state of the electrodes 22, 22 is good, the process proceeds to step S45. At this time, in order to confirm the insulation, for example, a probe may be brought into contact with each of the two electrodes 22 and 22 of the adjacent chip components 1 and 1 to inspect whether there is conduction.
[0097]
Next, in S45, the electronic component assembly 3 sucked and held by the suction nozzle 69 is stored in the recess of the component storage cassette 83a of the electronic component assembly storage portion 83, and then covered with a cover tape.
[0098]
In this way, the electronic component assembly 3 is manufactured from the plurality of chip components 1, 1 and stored in the electronic component assembly storage portion 83.
[0099]
When the electronic component assembly 3 is composed of four chip components 1,..., 1 and the like, as in FIG. When the two chip components 1 and 1 are stacked, the stability of the chip components 1,..., 1 is better than when the four chip components 1,. Thus, the play of the chip component 1 when laminated can be suppressed.
[0100]
Further, since the chip component 1 is very small, for example, length 1.0 mm × length 0.5 mm × width 0.2 mm, the position of the chip component 1 is confirmed before each operation as described above. It is preferable that each operation can be performed smoothly and reliably.
[0101]
According to the second embodiment, the plurality of chip parts 1,..., 1 are not individually mounted on the circuit board 23, but the plurality of chip parts 1,. The sheet-like insulating layers 2 and 2 are arranged between the electrodes 22 and 22 of the adjacent chip components 1 and 1 so that the adjacent chip components 1 and 1 are fixed to each other. Since the component assembly 3 is configured, it is possible to prevent positional displacement between the plurality of chip components 1,..., 1 and to reduce the mounting area. Further, the sheet-like insulating layers 2 and 2 are arranged between the electrodes 22 and 22 of the adjacent chip components 1 and 1, and the sheet-like insulating layer 2 is provided at a portion other than the electrodes 22 and 22 of the adjacent chip components 1 and 1. Since the heat radiation space 29 can be secured, the heat radiation action can be performed when the chip components 1 and 1 generate heat.
[0102]
Further, when the electronic component assembly 3 is stored, the electronic component assembly 3 composed of the two stacked chip components 1 and 1 in the vertical direction is rotated 90 degrees to be stacked in the horizontal direction. Since the suction surface 3a of the electronic component assembly 3 faces the upper surface when the assembly 3 is mounted, the electronic component assembly 3 is stored in the component storage portion 83 in that state. If the suction surface 3a of the body 3 is sucked by the suction nozzle 69, all the electrodes 22,..., 22 of the electronic component assembly 3 can be opposed to the circuit board 23. Is possible.
[0103]
Further, since the electronic component assembly 3 composed of a plurality of chip components 1,..., 1 is mounted, the mounting process is required as compared with the case where the plurality of chip components 1,. Time can be shortened.
[0104]
Also, if the electronic component assembly 3 is rotated 90 degrees when the electronic component assembly 3 is mounted on the circuit board 23 or the like, the structure of the mounting head becomes complicated. For this reason, in the second embodiment, the electronic component assembly 3 is rotated 90 degrees in advance and stored in the second embodiment so that it can be mounted in the same manner as other electronic components. It is better to be able to adsorb to. Since the land 21a of the circuit 21 of the circuit board 23 is narrowly adjacent to the chip component 1, no short circuit or the like occurs, so that the land 21a is determined from the width W of the electrode 22 of the chip component 1 as shown in FIG. It is necessary to reduce (narrow) the width V.
[0105]
Further, the suction nozzle 69 for sucking the chip component 1 is more difficult to manufacture as the outer diameter is smaller, and more easily affected by dust and the like, so it is practically difficult to reduce the size. As in the conventional mounting state of B), there is a portion that protrudes because the outer diameter of the suction nozzle 69 is larger than the width of one chip component 1. When the chip component 1 is sucked by the suction nozzle 69 in this state and then mounted on the circuit board or the like, the protruding portion of the suction nozzle 69 is prevented from hitting another component 1 already mounted on the circuit board. This is the most problematic point for mounting the chip component 1 with a narrow adjacent pitch.
[0106]
On the other hand, in the second embodiment, as shown in FIG. 18A, mounting of the electronic component assembly 3 formed by stacking the chip components 1,... The chip parts 1,..., 1 themselves are already arranged at a narrow adjacent pitch and are fixed, and the suction surface 3a that can be sucked by the suction nozzle 69 is larger than the width of one chip part 1. Since the width of the plurality of chip parts 1 and 1 can be increased, the mounting operation can be performed stably. Further, since there is no contact between the suction nozzle 69 and other components already mounted, the chip components 1 and 1 can be mounted at a narrow adjacent pitch.
[0107]
In the second embodiment, as a specific example of joining the chip components 1 and 1 with the sheet-like insulating layers 2 and 2, an insulating adhesive film 33 that exhibits adhesiveness by heating is used as shown in FIG. Thus, the necessary amount of the insulating layer 2 can be affixed to the chip component 1 as much as necessary. That is, the heating and pressing tool 32 is pressed against the chip component 1 while being heated downward through the insulating adhesive film 33 rewound from the feed reel 30. As a result, a part of the insulating adhesive film 33 is thermocompression-bonded to the electrodes 22 and 22 of the chip component 1 by the two pressurizing portions 32a and 32a of the heating and pressurizing tool 32, and is pasted. The cut (fused) portion is fed by a predetermined pitch and taken up by the take-up reel 31 so that the next chip component 1 can be attached so that the insulating layers 2 and 2 can be continuously formed. It may be.
[0108]
As another specific example, as shown in FIG. 16, an adhesive layer 35 is disposed on the lower surface of the base film 34, and applied to the chip component 1 by the pressure seal 36 through the base film 34 and the adhesive layer 35. By applying pressure, a part of the adhesive layer 35 is transferred by thermocompression bonding to the electrodes 22 and 22 of the chip component 1, and the transferred portion is fed by a predetermined pitch and wound by the take-up reel 31, so that The chip parts 1 may be transferred so that the insulating layers 2 and 2 can be formed continuously.
[0109]
As a modification of the second embodiment, the auxiliary chip 6 is used as a carrier, and the stacked chip components 1,..., 1 are mounted on the circuit board 23 in a vertically stacked state. Also good. That is, as shown in FIGS. 19A to 19C, the carrier-type electronic component assembly 7 includes an auxiliary sheet 6 as a carrier having circuit wiring 6 a and the chip components 1 of the electronic component assembly 3. The electrodes 22, 22 and one end of the circuit wiring 6 a are electrically connected to each other, and the other end of the circuit wiring 6 a is arranged near the lower end of the auxiliary sheet 6. The plurality of chip components 1,..., 1 are stacked on the circuit board 23 in the thickness direction so that the other end of each circuit wiring 6a is electrically connected to a predetermined electrode of the circuit 21 of the circuit board 23. To be implemented. When the carrier-type electronic component assembly 7 is mounted on the circuit board 23, the suction nozzle 69 holds the flat suction surface 7 a in the middle between the electrodes 22, 22 at both ends of the uppermost chip component 1 by suction. What should I do? The circuit wirings 6a may be independent from each other or may be partially connected to each other.
[0110]
The material used as the auxiliary sheet 6 having the circuit wiring 6a constituting the carrier-type electronic component assembly 7 is not particularly limited, but a material excellent in electrical insulation such as polyimide resin or epoxy resin is suitable. is there.
[0111]
Conventionally, a method for reducing the mounting area of a circuit board by reducing the distance between adjacent chip components that are independently mounted has been limited to the direction along the surface of the circuit board. On the other hand, in the electronic component assembly 7 of the modified example of the second embodiment, the plurality of chip components 1,..., 1 are stacked on the circuit board 23 in a direction orthogonal to the direction along the surface. Thus, the mounting area on the circuit board 23 can be reduced. That is, since the plurality of chip parts 1,..., 1 are stacked on the circuit board 23 in the thickness direction, the mounting area on the circuit board 23 is not much different from the case of the single chip part 1. The mounting area on the substrate 23 can be further reduced.
[0112]
Further, as another modification of the second embodiment, the chip components 1 and 1 are not bonded and fixed by the two sheet-like insulating layers 2 and 2 corresponding to the electrodes 22 and 22, but in a single sheet form. The chip components 1 and 1 are bonded and fixed by the insulating layer 24 to form the electronic component assembly 26, and the auxiliary chip 6 is used as a carrier, and the stacked chip components 1 and 2 constituting the electronic component assembly 26 are formed. ..., 1 may be mounted on the circuit board 23 in a state where they are stacked in the vertical direction. That is, in the carrier-type electronic component assembly 27, as shown in FIGS. 20A to 20C, the auxiliary sheet 6 as a carrier having the circuit wiring 6a is used as the electrode of each chip component 1 of the electronic component assembly 26. 22, 22 and each one end of the circuit wiring 6a are electrically connected to each other, and the other end of the circuit wiring 6a is arranged near the lower end of the auxiliary sheet 6. The plurality of chip components 1,..., 1 are stacked on the circuit board 23 in the thickness direction so that the other end of each circuit wiring 6a is electrically connected to a predetermined electrode of the circuit 21 of the circuit board 23. To be implemented. When the carrier-type electronic component assembly 26 is mounted on the circuit board 23, the suction nozzle 69 holds and holds the flat suction surface 27a in the middle portion between the electrodes 22 and 22 on both ends of the uppermost chip component 1 by suction. What should I do?
[0113]
The material used as the auxiliary sheet 6 having the circuit wiring 6a constituting the carrier-type electronic component assembly 27 is not particularly limited, but a material excellent in electrical insulation such as polyimide resin or epoxy resin is suitable. is there.
[0114]
Conventionally, a method for reducing the mounting area of a circuit board by reducing the distance between adjacent chip components that are independently mounted has been limited to the direction along the surface of the circuit board. On the other hand, in the electronic component assembly 27 according to another modified example of the second embodiment, the plurality of chip components 1,..., 1 are arranged on the circuit board 23 in a direction perpendicular to the direction along the surface. Mounting can be performed in a stacked manner, and the mounting area on the circuit board 23 can be reduced. That is, since the plurality of chip parts 1,..., 1 are stacked on the circuit board 23 in the thickness direction, the mounting area on the circuit board 23 is not much different from the case of the single chip part 1. The mounting area on the substrate 23 can be further reduced.
[0115]
In each of the embodiments described above, the chip components constituting the electronic component assembly may be different types of resistors, capacitors, etc., their capacities, and external dimensions (not shown), and the number of chip components is 2 If it is more than one, no upper limit is required.
[0116]
Moreover, as shown in FIG. 22 as another modification of 1st Embodiment of this invention of FIG. 1, not only what uses the electronic component aggregate | assembly 5 of FIG. 1 (B) independently, as shown in FIG. The two electronic component assemblies 5 and 5 are connected via the insulating sheet 100 to have one electronic component assembly, and either or both of the adsorption surfaces of the two electronic component assemblies 5 and 5 are adsorbed. The surface may be mounted by suction holding with a suction nozzle.
[0117]
In addition, as shown in FIG. 23, as another modification of the first embodiment of the present invention shown in FIG. 12, the adhesive property is not limited to the electronic component assembly 8 shown in FIG. Two electronic component assemblies 8 and 8 are connected via an insulating sheet 101 having a single electronic component assembly, and / or one of the suction surfaces of the two electronic component assemblies 8 and 8. The suction surface may be mounted by suction holding with a suction nozzle. Further, the electronic component assembly of FIG. 23 is connected to another electronic component assembly of FIG. 23 via the insulating sheet 101, and as shown in FIG. All or any of the suction surfaces of the component assemblies 8,..., 8 may be mounted by suction with a suction nozzle.
[0118]
In addition, the adhesive is applied to one side surface of the plurality of stacked chip components 1,..., 1 as well as the one in which the plurality of chip components 1, 1 are fixed to the stacked surfaces facing each other with an adhesive interposed therebetween. Then, they may be fixed to each other.
[0119]
Further, as shown in FIGS. 25 to 28, an electronic component assembly manufacturing apparatus 210 for manufacturing the electronic component assembly may be incorporated in a multi-function type and high-speed type component mounting apparatus, respectively.
[0120]
That is, the electronic component assembly manufacturing apparatus 210 shown in FIG. 25 includes a rotary table 203 that can be intermittently rotated at predetermined angles by a rotary drive device 204 such as a motor, and a plurality of chip components are provided on the rotary table 203. A rectangular frame type chip part position restricting member 202,..., 202 capable of storing 1,. In this example, according to the intermittent rotation of the turntable 203, each chip component position restricting member 202 has a chip component stacking position I, a chip component position restricting position II, an insulating sheet attaching position III, a chip component fixing position IV, and an adhesive curing. The position V and the chip component extraction position VI are sequentially arranged.
[0121]
First, at the component stacking position I, a plurality of chip components 1,..., 1 are stacked in the rectangular frame type chip component position restricting member 202 using the suction nozzle 208. The rectangular chip type chip part position restricting member 202 has an inner chip part storage space formed slightly larger than the outer shape of one chip part 1, and can be restricted at a part restricting position II described later. I have to. At this component stacking position I, the lowest chip component 1 is adsorbed in a state where insulating layers 2 such as insulating sheets are disposed at both ends of the stacking surface, which is the upper surface, as shown in FIG. It is sucked and held by the nozzle 208 and stored in the chip component position regulating member 202. Next, similarly, the second chip component 1 from the bottom is also sucked and held by the suction nozzle 208 in a state where the insulating layers 2 such as insulating sheets are arranged at both ends of the laminated surface which is the upper surface. It is housed in the chip part position restricting member 202 and loaded on the lowest chip part 1. When a predetermined number of chip parts 1,..., 1 are stacked, they move to the next chip part position restriction position II according to the intermittent rotation of the rotary table 203.
[0122]
In the chip part position restriction position II, the position restriction is performed in both the width direction and the longitudinal direction of the chip part 1. That is, as shown in FIG. 28, the rectangular frame type chip component position restricting member 202 has an opening 202 h extending in the vertical direction on the wall 202 e on the outer peripheral side of the rotary table. A pressing plate 202d that passes through the opening 202h and abuts against the side surface on the outer peripheral side of the rotary table of the chip component 1 in the chip component storage space is disposed and is pressed and driven by the air cylinder 202c. ,..., 1 are simultaneously placed in contact with the restriction wall 202g on the inner peripheral side of the rotary table of the chip part position restriction member 202 so as to be restricted in position. In addition, a pressing plate 202b that is in contact with, for example, a counterclockwise side surface in the circumferential direction of the rotary table of the chip component 1 in the chip component storage space is disposed, and is pressed and driven by the air cylinder 202a. .., 1 are simultaneously placed in contact with the restriction wall 202f on the clockwise side in the circumferential direction of the rotary table of the chip part position restriction member 202 so as to be restricted in position. In this way, when the plurality of chip components 1,..., 1 are aligned and aligned in both the width direction and the longitudinal direction, the next insulating sheet attachment position III follows the intermittent rotation of the rotary table 203. Move to.
[0123]
At the insulating sheet attaching position III, the insulating sheets 2 and 2 wound around the tape 200 are individually taken out by the suction nozzle 201 and attached to the upper surfaces of both electrodes 22 and 22 of the uppermost chip component 1. And insulate. When the electrodes 22 and 22 of the uppermost chip component 1 are thus insulated, the rotary table 203 is intermittently rotated and moved to the next chip component fixing position IV.
[0124]
At the chip component fixing position IV, the adhesive 110 is applied to the side surface on the outer peripheral side of the rotary table of the plurality of chip components 1,..., 1 stacked in the vertical direction in the opening 202h of the chip component position regulating member 202. When coating is performed from the coating nozzle 205 a of the coating device 205, it moves to the next adhesive curing position V according to intermittent rotation of the rotary table 203.
[0125]
At the adhesive curing position V, the applied adhesive 110 is cured by heating or irradiating with ultraviolet light with the curing device 206, and the plurality of stacked chip components 1,... Aggregates 5 are formed. When the electronic component assembly 5 is formed, it moves to the next chip component extraction position VI according to the intermittent rotation of the rotary table 203.
[0126]
At the chip component take-out position VI, the uppermost suction surface of the electronic component assembly 5 housed in the chip component position restricting member 202 is sucked by the suction nozzle 207 and taken out from the chip component position restricting member 202 to 90 degrees. After the rotation, the electronic component assembly 5 is mounted on the circuit board 22. When the electronic component assembly 5 is taken out from the chip component position restricting member 202, the empty chip component position restricting member 202 moves to the chip component stacking position I according to the intermittent rotation of the rotary table 203, as described above. Stacking of a plurality of chip parts 1,..., 1 is started.
[0127]
In this way, according to the rotation of the turntable 203, the plurality of chip components 1,..., 1 are stacked in the chip component position regulating member 202, and the electronic component assembly 5 is manufactured and mounted on the substrate 22.
[0128]
At the chip component stacking position I, instead of the insulating sheet, an insulating adhesive is applied only to the upper or lower surface of each electrode (however, when the lowermost chip component is the mounting surface, the lower surface is excluded). If the chip component position is regulated at the chip component position regulating position II before the adhesive is cured, the chip component fixing position IV becomes unnecessary.
[0129]
Further, at the component stacking position I, every time one chip component 1 is stacked in the rectangular frame type chip component position restricting member 202 using the suction nozzle 208, the chip component 1 is placed on at least the electrode of the stacked chip component 1. Alternatively, the insulating sheets 2 and 2 may be attached using the suction nozzle 201. In this way, the insulating sheet attaching operation performed at the insulating sheet attaching position III can be made unnecessary, and the insulating sheet attaching position III can be omitted. Alternatively, at the insulating sheet attaching position III, the insulating sheets 2 and 2 may be attached to at least the electrodes of the uppermost chip component 1 using the suction nozzle 201.
[0130]
Further, at the component stacking position I, one chip component 1 is stacked in the rectangular frame type chip component position restricting member 202 by using the suction nozzle 208, and each of the air cylinders of the pressing plate 202d and the pressing plate 202b is stacked. After the chip component 1 is positioned and aligned in both the width direction and the longitudinal direction by driving, the insulating sheet 2 is used by using the suction nozzle 201 on at least the electrodes of the stacked chip components 1. 2 may be pasted. In this way, the chip component position restricting operation performed at the chip component position restricting position II and the insulating sheet attaching operation performed at the insulating sheet attaching position III become unnecessary, and the chip component position restricting position II and the insulating sheet are eliminated. The pasting position III can be omitted. Alternatively, whether or not to perform the entire chip component position restricting operation only at the chip component position restricting position II and omitting the insulating sheet attaching position III, instead of making both operations at the two positions II and III unnecessary. Alternatively, at the insulating sheet attaching position III, the insulating sheets 2 and 2 are attached to at least the electrodes of the uppermost chip component 1 using the suction nozzle 201, and the chip component position restricting position II is omitted. It may be.
[0131]
In addition, this apparatus is not limited to the above-described process, and the apparatus at each position described above is appropriately changed to perform the electronic component assembly manufacturing method such as FIG. 3 described in the previous embodiment. Also good.
[0132]
FIG. 26 shows a multifunctional component mounting apparatus in which the electronic component assembly manufacturing apparatus 210 is incorporated.
[0133]
In FIG. 26, 210 is an electronic component assembly manufacturing apparatus, 220 is a chip component supply apparatus configured by a component supply cassette or the like in which a large number of chip components are stored and can be supplied one by one to an extraction position, and 221 is an XY table. A circuit board positioning device 222 configured by a circuit board positioning device, a component supply device 222 configured by a component supply cassette or the like capable of storing a large number of components to be mounted on the circuit board 23 and supplying them one by one to the take-out position. For example, a mounting head having five suction nozzles, 224 is an XY robot that moves the mounting head 223 in the XY direction, and 225 is a substrate transfer device. Therefore, the circuit board positioning device 221 positions the substrate 23 conveyed by the substrate conveying device 225. The mounting head 223 is driven by the XY robot 224, moves to the component supply device 222, and holds and holds a plurality of components supplied from the component supply device 222 by a plurality of suction nozzles. Mounted on the circuit board 23 positioned by the board positioning device 221. The mounting head 223 is driven by the XY robot 224 and moves to the electronic component assembly manufacturing apparatus 210. The electronic component assembly supplied from the electronic component assembly manufacturing apparatus 210 is sucked and held by the suction nozzle, and then the circuit. Mounted on the circuit board 23 positioned by the board positioning device 221. At this time, if necessary, the electronic component assembly may be rotated 90 degrees and then positioned and mounted on the circuit board 23. During such a mounting operation, the electronic component assembly manufacturing apparatus 210 continues to manufacture the electronic component assembly continuously.
[0134]
According to such a configuration, the manufacture of the electronic component assembly and the component mounting on the substrate can be performed simultaneously in parallel.
[0135]
FIG. 27 shows a high-speed type component mounting apparatus in which the electronic component assembly manufacturing apparatus 210 is incorporated.
[0136]
In FIG. 27, 210 is an electronic component assembly manufacturing apparatus, 220 is a chip component supply apparatus configured by a component supply cassette or the like in which a large number of chip components are stored and can be supplied one by one to an extraction position, and 231 is an XY table. The circuit board positioning device 222 includes a component supply device 222 that includes a component supply cassette that stores a large number of components to be mounted on the circuit board 23 and can supply them one by one to the take-out position. A rotary head 234 for rotating the suction nozzles intermittently, 234 for supplying a chip component for rotating the suction nozzles intermittently, 235 is a substrate transfer device. Therefore, the circuit board positioning device 231 positions the substrate 23 transported by the substrate transport device 235. A number of suction nozzles are intermittently driven to rotate by the rotary head 233, and a desired component supply device 222 is advanced and retracted in a single axis direction at a high speed by the component supply device driving device 230 at the component suction position of the rotary head 233. Then, after the component is supplied from the positioned component supply device 222 and sucked and held by the suction nozzle of the rotary head 233, the component is rotated intermittently by the rotary head 233, and after the position and orientation recognition operation, the circuit board The circuit boards 23 positioned by the positioning device 221 are successively mounted. Further, when the rotary head 233 is positioned at the electronic component assembly supply position, the electronic component assembly supplied from the electronic component assembly manufacturing apparatus 210 is sucked and held by the suction nozzle of the rotary head 233, and then the position and orientation recognition operation is performed. Later, it is mounted on the circuit board 23 positioned by the circuit board positioning device 231. At this time, if necessary, the electronic component assembly may be rotated 90 degrees and then positioned and mounted on the circuit board 23. During such a mounting operation, the electronic component assembly manufacturing apparatus 210 causes the chip components 1,..., 1 supplied from the chip component supply devices 220, ..., 220 to be intermittently driven by the chip component supply rotary head 234. The electronic component assembly is continuously manufactured by continuously supplying it to the electronic component assembly manufacturing apparatus 210.
[0137]
According to such a configuration, the manufacture of the electronic component assembly and the component mounting on the substrate can be performed simultaneously in parallel.
[0138]
In the electronic component assembly manufacturing apparatus 210 of each of the component mounting apparatuses described above, when the electronic component assembly is supplied to the suction nozzle of the mounting head 223 or the rotary head 233, the electronic component assembly manufacturing apparatus 210 supplies the electronic component assembly directly. Not limited to, the electronic component assembly manufactured by the electronic component assembly manufacturing apparatus 210 is manufactured in advance and temporarily held on a holding member such as a tray or a belt conveyor, and the electronic component supplied from the holding member The assembly may be mounted by suction holding with the suction nozzle.
[0139]
Also, a combination of an electronic component assembly using a liquid insulating layer and an electronic component assembly using a sheet-like insulating layer is possible. For example, one chip component can be fixed with a sheet-like insulating layer, and the electronic component assemblies thus stacked can be fixed with a liquid insulating layer.
[0140]
In each of the above embodiments, the case where an insulating layer having both an insulating function and an adhesive function is used as the adhesive layer has been described. However, the present invention is not limited to this, and the adhesive layer is laminated as described above. An insulating layer that is disposed on the electrodes facing each other on the laminated surface of the electronic component and insulates the electrodes facing each other on the laminated surface of the laminated electronic component, and an adhesive that fixes the laminated electronic components together You may comprise so that. That is, as shown in FIG. 29, one adhesive insulating sheet 103 that functions as an example of the insulating layer constituting the adhesive layer is disposed between the electrodes 22 and 22 of the adjacent chip components 1 and 1 for insulation. After forming the layers, as shown in FIG. 31, the chip components 1 and 1 may be fixed to each other with a non-insulating adhesive 105 functioning as an example of the adhesive constituting the adhesive layer. At this time, it is preferable that a space for exposing portions other than the electrodes 22 and 22 of the chip components 1 and 1 is formed in one adhesive insulating sheet 103 and the adhesive 105.
[0141]
Further, in this case, not only one adhesive insulating sheet 103 is disposed on each of the electrodes 22 and 22 of the adjacent chip components 1 and 1, but either one of the electrodes 22 as shown in FIG. Alternatively, only one adhesive insulating sheet 103 may be disposed. In addition, the two adhesive insulating sheets 103 are not used to insulate the electrodes 22 and 22 at both ends, as shown in FIG. Each may be insulated.
[0142]
When high strength is required as a property of the adhesive or adhesive layer, 80 kgf / cm²1 × 10 when electrical insulation is required¹⁰Ω or more, and 50 wt% or more when low water absorption is required.
[0143]
The material of the adhesive or the adhesive layer includes, as a monomer, an epoxy type, bisphenol A, bisphenol F, aminophenol type, fetor novolac type, and as a curing agent, an imidazole type, an amine type, an amine adduct type, There are human-razine-based and isocyanate-based, and fillers include silica, alumina, talc, boron fluoride, and mica. Among these monomers, curing agents, and fillers, any one can be selected and combined as appropriate. be able to. Further, as another adhesive or adhesive layer, an alicyclic monomer can be used, an acid anhydride system can be used as a curing agent, and whisker or aluminum nitride can be used in combination as a filler. As one example of the adhesive or adhesive layer, bisphenol A type epoxy is 100 parts by weight, 2-mitylimidazole azine is 7 parts by weight, silica (SiO 2₂) Is 20 parts by weight.
[0144]
Further, in each chip component 1, the surface of the electrode to be insulated is at least the surface of the electrode positioned on the laminated surface, and more preferably, it is exposed during mounting to prevent electrical contact with other components. It is preferable from the viewpoint of electrical stability that the electrode surface that needs to be insulated is also insulated.
[0145]
【Example】
Specific examples of the electronic component assembly and the mounting method according to the first and second embodiments of the present invention will be given below.
<Example 1 to Example 4>
The following resins were used as insulating materials between chip components.
[0146]
As the sheet-like insulating layer, an epoxy resin (film thickness = 50 μm, manufactured by Nitto Denko Corporation) was used.
[0147]
As the paste (liquid insulating layer), an epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd.) was used.
[0148]
Then, using the insulating material and 10 chip components (dimensions: 1.0 mm × 0.5 mm × 0.25 mm), an electronic component assembly was prepared, and a sample mounted on a circuit board was prepared. (Examples 1 to 4).
[0149]
Example 1 corresponds to the electronic component assembly 3 in FIG. 13, Example 2 corresponds to the electronic component assembly 5 in FIG. 1, and Example 3 corresponds to the electronic component assembly 7 in FIG. Example 4 corresponds to the electronic component assembly 8 of FIG.
<Comparative Example 1>
As Comparative Example 1, as shown in FIG. 21, 10 samples mounted with a distance of 0.3 mm between adjacent chip components 10 (dimensions: 1.0 mm × 0.5 mm × 0.2 mm) on a circuit board were mounted. Produced. 21, reference numeral 11 is a substrate electrode on the circuit board, and 12 is a mounting area of the ten chip components 10,..., 10 on the circuit board.
[0150]
Various characteristics of the mounting sample obtained as described above were measured. The measuring method is as follows.
[0151]
1) Mounting area: The mounting area of the circuit board including the substrate electrode of the manufactured mounting sample (for example, the mounting area 12 of the circuit board including the substrate electrode 11 in FIG. 21) was measured.
[0152]
2) Component deviation rate: With an automatic electronic component mounting apparatus (not shown), the number (n) of components where the chip component is 0.1 mm or more away from the substrate electrode after component mounting is measured, and (n / 10) × 100 (%) was defined as the component deviation rate.
[0153]
3) Component mounting time: mounting speed = 0.1 sec / time was measured when a chip component was mounted on a circuit board with an automatic electronic component mounting machine (not shown).
[0154]
Table 1 shows the characteristic measurement results of each sample.
[0155]
[Table 1]

[0156]
From Table 1, the electronic component assembly according to the embodiment of the present invention and the mounting method thereof have a small chip component mounting area, the mounted chip component is not displaced, and the chip component mounting time is short. Results were obtained.
[0157]
【The invention's effect】
According to the electronic component assembly and the mounting method thereof of the present invention, the mounting area of the electronic component on the mounted body such as a circuit board is reduced and the mounting time is significantly shortened without causing the positional misalignment of the electronic component. can do.
[0158]
That is, according to the electronic component assembly and the mounting method of the present invention, the plurality of electronic components are not individually mounted on the mounted body such as a circuit board, but the plurality of electronic components are orthogonal to each other in the longitudinal direction. A plurality of electronic components are stacked in the horizontal direction and laterally, and an insulating layer is disposed between the electrodes of adjacent electronic components so that the adjacent electronic components are fixed to each other to form an electronic component assembly. It is possible to prevent misalignment between them and to reduce the mounting area.
[0159]
In addition, according to the electronic component assembly of the present invention, an insulating layer is disposed between the electrodes of the adjacent electronic components, and there is no insulating layer in a portion other than the electrodes of the adjacent electronic components, and a space for heat dissipation can be secured. Heat dissipation can be performed when the electronic component generates heat.
[0160]
In addition, according to the electronic component assembly and the mounting method thereof of the present invention, the electronic component assembly composed of a plurality of electronic components can be mounted on a circuit board or the like by handling it as one component. Compared with the case of mounting individual electronic components, the time required for the mounting process can be shortened.
[0161]
In addition, according to the electronic component assembly and the method of manufacturing the same according to the present invention, when the electronic component assembly is stored in the component storage member, the electronic component assembly configured by two stacked electronic components in the vertical direction is provided. When the electronic component assembly is mounted in the state after being rotated in the horizontal direction, the electronic component assembly adsorbing surface is directed to the upper surface when the electronic component assembly is mounted. If the suction surface of the electronic component assembly in the component storage member is sucked by the suction nozzle when mounting the electronic component assembly, all the electrodes of the electronic component assembly can be made to face the circuit board. Narrowly adjacent mounting is possible. Also, if the electronic component assembly is rotated 90 degrees when the electronic component assembly is mounted on a circuit board or the like, the structure of the mounting head becomes complicated. However, as described above, when the electronic component assembly is stored in the component storage member If the suction surface is turned up by 90 degrees in advance, it is not necessary to rotate the electronic component assembly by 90 degrees during mounting, and the structure of the mounting head is not complicated.
[0162]
In addition, when sucking electronic components with a suction nozzle, the suction nozzle is more difficult to manufacture as the outer diameter becomes smaller, and it is more difficult to make it smaller because it is more susceptible to dust and the like. As in the mounting state, there is a portion that protrudes because the outer diameter of the suction nozzle is larger than the width of one electronic component. In such a state, when the electronic component is sucked by the suction nozzle and then mounted on the circuit board or the like, it is necessary to prevent the protruding portion of the suction nozzle from hitting other parts already mounted on the circuit board. This is the most problematic point for mounting electronic components at a narrow adjacent pitch.
[0163]
On the other hand, in the electronic component assembly and the mounting method thereof according to the present invention, the mounting of the electronic component assembly formed by stacking the electronic components is already arranged at a narrow adjacent pitch in the electronic component assembly. In addition to being fixed, the suction surface that can be sucked by the suction nozzle can be made larger than the width of one electronic component, specifically, up to the width of multiple electronic components. Operation can be performed stably. In addition, since there is no contact between the suction nozzle and other components already mounted, the electronic components can be mounted at a narrow adjacent pitch.
[Brief description of the drawings]
FIGS. 1A and 1B are a process diagram and an electronic component showing a method of manufacturing an electronic component assembly in the electronic component assembly and the electronic component assembly mounting method according to the first embodiment of the present invention, respectively. It is a perspective view of the state which mounted the electronic component assembly on the circuit board by the assembly mounting method.
FIG. 2 is a perspective schematic perspective view of a chip component laminating apparatus that can implement the method of manufacturing an electronic component assembly according to the first embodiment.
FIG. 3 is a flowchart of a manufacturing method of the electronic component assembly.
FIG. 4 is an explanatory diagram of a state in which an adhesive is applied to a chip component in the method for manufacturing an electronic component assembly.
FIG. 5 is an explanatory diagram of a state in which chip components are stacked in the method for manufacturing an electronic component assembly.
FIG. 6 is an explanatory diagram of a state in which the chip component is rotated 90 degrees in the method of manufacturing the electronic component assembly.
FIG. 7 is an explanatory diagram of a state in which the electronic component assembly is adsorbed by an adsorption nozzle in the electronic component assembly manufacturing method.
FIGS. 8A and 8B are explanatory views showing a state in which three chip components are stacked in the method for manufacturing an electronic component assembly, and two stacked on two stacked chip components, respectively. It is explanatory drawing of the state which laminates | stacks an individual chip component.
FIG. 9 is a perspective view of a laminated chip component with a mark in the manufacturing method of the electronic component assembly.
FIG. 10 is an explanatory view showing a state where the chip component is positioned by the restriction of the pair of regulating members in the method of manufacturing the electronic component assembly.
FIGS. 11A and 11B are explanatory views showing a case where a plurality of chip parts 1,..., 1 are stacked simultaneously and continuously in the method of manufacturing an electronic part assembly, respectively. It is.
FIGS. 12A, 12B, and 12C are an electronic component assembly and an electronic component assembly manufacturing method according to a modification of the first embodiment of the present invention, respectively. FIG. 6 is a perspective view of a state in which the electronic component assembly is mounted on the circuit board by the process diagram illustrating the electronic component assembly mounting method.
FIGS. 13A and 13B are a process diagram and an electronic component showing a method of manufacturing the electronic component assembly in the electronic component assembly and the electronic component assembly mounting method according to the second embodiment of the present invention, respectively. It is a perspective view of the state which mounted the electronic component assembly on the circuit board by the assembly mounting method.
FIG. 14 is a flowchart of an electronic component assembly and an electronic component assembly mounting method according to the second embodiment of the present invention.
FIGS. 15A and 15B are an explanatory diagram of a state in which a sheet-like insulating layer is welded to a chip component and an explanatory diagram of an electronic component after welding, respectively.
FIGS. 16A and 16B are an explanatory diagram of a state where an adhesive layer is transferred to a chip component and an explanatory diagram of an electronic component after transfer, respectively.
FIG. 17 is an explanatory diagram showing the relationship between the width of an electrode of a chip component and the width of a land.
FIGS. 18A and 18B are an explanatory diagram of a state in which the electronic component assembly according to the first embodiment of the present invention is sucked and mounted by a suction nozzle and one chip component in the conventional mounting method, respectively. It is explanatory drawing of the state mounted and picked up by a suction nozzle one by one.
FIGS. 19A, 19B, and 19C are an electronic component assembly and an electronic component assembly manufacturing method according to a modification of the second embodiment of the present invention, respectively. FIG. 6 is a perspective view of a state in which the electronic component assembly is mounted on the circuit board by the process diagram illustrating the electronic component assembly mounting method.
FIGS. 20A, 20B, and 20C are respectively an electronic component assembly and an electronic component assembly mounting method according to another modification of the second embodiment of the present invention. It is a perspective view in the state where the electronic component assembly was mounted on the circuit board by the process diagram showing the manufacturing method and the mounting method of the electronic component assembly.
FIG. 21 is a plan view showing a state in which a conventional chip component is mounted on a circuit board.
FIG. 22 illustrates a state in which two electronic component assemblies are connected via an insulating sheet and mounted as one electronic component assembly as another modification of the first embodiment of the present invention shown in FIG. It is a perspective view.
FIG. 23 illustrates a state in which two electronic component assemblies are connected via an insulating sheet and mounted as one electronic component assembly as still another modification of the first embodiment of the present invention shown in FIG. FIG.
24 is a perspective view illustrating a state in which the electronic component assembly of FIG. 23 is connected to another electronic component assembly of FIG. 23 via an insulating sheet and mounted as one electronic component assembly.
FIG. 25 is a perspective view showing an apparatus for manufacturing an electronic component assembly as another embodiment of the present invention.
26 is a schematic perspective view partially shown in a perspective view of a multi-functional component mounting apparatus in which the electronic component assembly manufacturing apparatus of FIG. 25 is incorporated.
27 is a schematic perspective view partially shown in a perspective view of a high-speed type component mounting apparatus in which the electronic component assembly manufacturing apparatus of FIG. 25 is incorporated.
28 is an enlarged plan view of a chip part position restricting member of the electronic part assembly manufacturing apparatus of FIG. 25. FIG.
FIG. 29 is an explanatory view showing a modification in which one insulating layer is disposed between adjacent chip components and the chip components are fixed to each other with the adhesiveness of the insulating layers in the embodiment.
FIG. 30 is an explanatory view showing a modification in which two insulating layers are arranged between electrodes of adjacent chip components and the chip components are fixed with the adhesiveness of the insulating layers to each other in the embodiment.
FIG. 31 is an enlarged view of a portion between electrodes in a state where two insulating layers are arranged between opposing electrodes in the modification of FIG.
32 is an enlarged view of a portion between electrodes in a state in which one insulating layer is disposed between opposing electrodes in the modification of FIG. 30. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Chip component, 2 ... Insulating layer, 3, 5, 7, 8 ... Electronic component assembly, 3a, 5a ... Adsorption surface, 4 ... Insulating adhesive, 5a ... Adsorption surface, 6 ... Auxiliary sheet, 6a ... Circuit Wiring, 7a, 8a ... adsorption surface, 21 ... circuit, 22 ... chip component electrode, 23 ... circuit board, 24 ... insulating layer, 26, 27 ... electronic component assembly, 27a ... adsorption surface, 29 ... space for heat dissipation, 30 DESCRIPTION OF SYMBOLS ... Feed reel, 31 ... Take-up reel, 32 ... Heating and pressing tool, 32a ... Pressurizing part, 33 ... Insulating adhesive film, 34 ... Base film, 35 ... Adhesive layer, 36 ... Pressing tool, 40 ... Mark, 41, 42 ... restriction member, 41a, 42a ... restriction edge, 41b, 42b ... locking projection, 43 ... gap, 44 ... restriction plate, 45 ... gap, 68 ... XY robot, 69 ... suction nozzle, 70 ... parts supply , 70a... Component supply cassette, 71... Suction head, 72 Insulating adhesive coating device, 72a ... coating nozzle, 73 ... recognition device, 74 ... Y direction moving device, 75 ... X direction moving device, 76 ... Y direction driving motor, 77 ... X direction driving motor, 78 ... chip component mounting Placement table, 78a ... Suction hole, 79 ... Chip component recognition device, 80 ... Motor, 81 ... Y direction moving device, 81a ... Y direction moving device main body, 82 ... Screw shaft, 83 ... Electronic component assembly storage unit, 83a ... Component storage cassette, 84 ... curing device, 85 ... mounting device entrance / exit, 90 ... suction block, 90a ... suction surface, 100, 101, 102, 103 ... insulating sheet, 105 ... adhesive, 200 ... tape, 201 ... suction nozzle, 202 ... Rectangular frame type chip part position regulating member, 202a ... Air cylinder, 202b ... Pressing plate, 202c ... Air cylinder, 202d ... Pressing plate, 202f ... Time Restriction wall on the clockwise side of the table circumferential direction, 202 g... Restriction wall on the inner circumference side of the rotation table, 202 h... Opening, 203... Rotation table, 204. DESCRIPTION OF SYMBOLS ... Curing device, 207 ... Suction nozzle, 208 ... Suction nozzle, 210 ... Electronic component assembly manufacturing device, 220 ... Chip component supply device, 221 ... Circuit board positioning device, 222 ... Component component supply device, 223 ... Mounting head, 224 XY robot, 225, substrate transfer device, 230 ... component supply device drive device, 231 ... substrate positioning device, 233 ... rotary head, 234 ... chip component supply rotary head, 235 ... substrate transfer device, I ... chip component stacking position II ... Chip component position restricting position, III ... Insulating sheet pasting position, IV ... Chip component Fixing position, V: Adhesive curing position, VI: Chip component removal position.

Claims (2)

At least two rectangular parallelepiped electronic components having electrodes at both ends are laminated in a direction perpendicular to the longitudinal direction of the electronic component, and the laminated electronic components have an adhesive property between the electrodes facing each other. An electronic component assembly fixed by a layer and having a heat radiation space formed between the opposing laminated surfaces of electronic components other than the electrodes is adsorbed by an adsorption nozzle, and then mounted on a predetermined position on a circuit board. A method of mounting a part assembly,
The suction surface of the electronic component assembly sucked by the suction nozzle is a side surface in the longitudinal direction of the stacked electronic components that straddle a plurality of adjacent electronic components, and the plurality of adjacent electronic components It is a side other than the electrode,
An electronic component assembly mounting method, wherein an outer diameter of the suction nozzle is larger than a width in a direction orthogonal to a longitudinal direction of one electronic component.   2. The method for mounting an electronic component assembly according to claim 1, wherein an outer diameter of the suction nozzle is larger than a width in a direction orthogonal to a longitudinal direction of the plurality of electronic components.

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