JP4862864B2 - Printed wiring board manufacturing equipment - Google Patents

Description

  The present invention relates to a printed wiring board manufacturing apparatus, and more particularly, to a printed wiring board manufacturing apparatus suitable for manufacturing a printed wiring board containing components.

  In recent years, in order to improve the component mounting density per unit area in response to the demand for smaller, lighter and more multifunctional electronic devices, semiconductor components (integrated circuit components, discrete components) and chip components (chip capacitors and chip resistors) ) And other components are mounted on the inside, and multilayer printed wiring boards with built-in components are being developed.

  A multilayer printed wiring board with a built-in component involves a process of mounting the component on an inner layer board called a core board in the middle of manufacturing. Such a mounting process is a process different from a normal printed wiring board manufacturing process, and normally, a component mounting / assembling device such as a mounter or a bonder is used. Further, when the mounting method is flip chip connection or wire bonding connection of semiconductor elements, the area of the core plate to be mounted may be limited due to the specifications of the available mounting apparatus.

  Therefore, in the conventional case, when manufacturing a multilayer printed wiring board with built-in components, the total area of the multilayer printed wiring board to be manufactured is determined according to the specifications of available mounting devices and the like.

  In general, a multilayer printed wiring board is preferably manufactured by attaching a plurality of identical sheets to a relatively large plate material from the viewpoint of productivity, and cutting into small pieces as a product in a final manufacturing process. From the general point of view, it is preferable from the viewpoint of manufacturing efficiency that a multilayer printed wiring board having a built-in component is manufactured by imposing a plurality of identical sheets on a relatively large plate material. However, as described above, there are cases where such a manufacturing method cannot be adopted due to restrictions in component mounting.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a printed wiring board manufacturing apparatus capable of improving the manufacturing efficiency of a printed wiring board containing components.

In order to solve the above-described problems, the printed wiring board manufacturing apparatus according to the present invention is configured such that the cutout space portion of the first wiring board material having a partial cutout in the plane is smaller than the cutout space portion . a wiring board material, and write no position alignment device fitted to a state that is aligned respectively with the wiring board material wiring board material and the second first reference position, the reference position between the first wiring board material and the second wiring board material and said second wiring board material fixing member to fix a state of being respectively aligned with the first wiring board material against And a member supply device for supplying to the boundary portion.

  In other words, this manufacturing device fits the component-mounted wiring board material (second wiring board material) into the space in the frame of the wiring board material (first wiring board material) that becomes the framework, aligns and fixes it. It is a device that can do. This apparatus is consistent with the case where a wiring board is manufactured using various well-known mounting / assembly apparatuses by limiting the size of the second wiring board material. In other words, by aligning, fitting, and fixing the second wiring board material that has been mounted to the first wiring board material as a framework, the subsequent processes can be applied to a large area in a plurality of areas. Can proceed in the form. Therefore, it becomes possible to improve the manufacturing efficiency of the printed wiring board which incorporates components. Examples of the fixing member include an adhesive resin, a solder paste, and an adhesive tape.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing apparatus of the printed wiring board which can improve the manufacturing efficiency of the printed wiring board which incorporates components can be provided.

  Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are process diagrams schematically showing a printed wiring board manufacturing process in which a manufacturing apparatus according to each embodiment of the present invention is useful, in perspective. First, this process will be described. The process proceeds in the order of FIG. 1A, FIG. 1B, and FIG. 2A, and FIG. 2B is a schematic diagram showing the state of the printed wiring board in cross section after the process shown in FIG. FIG. In these drawings, the same reference numerals are assigned to the same corresponding parts.

  First, as shown in FIG. 1A, a wiring board material (panel) 10 to be a core part of a printed wiring board is prepared. The wiring board material 10 has, for example, wiring layers (not shown) on at least both surfaces, and each has been patterned. The wiring layer may further exist as an inner layer of the wiring board material 10 (that is, the wiring board material 10 may be, for example, a three-layer wiring board, a four-layer wiring board, a five-layer wiring board,. .) The means for electrical connection between these wiring layers is not particularly limited, and for example, a well-structured structure with a conductive resin or a hollow structure with a metal layer on the inner surface of the through hole can be used.

  The wiring board material 10 is formed by imposing a plurality of parts to be the same product (here, four as an example, but the number is not limited). Each impositioned part is once cut out in a later process by the cut lines 11a, 11b, 11c, and 11d. A semiconductor component mounting area 12 is provided in each impositioned portion. The mounting region 12 may be used not only for semiconductor components but also for passive components (chip capacitors and chip resistors). There are one or more mounting areas for semiconductor components for each part.

  Once the wiring board material 10 is prepared, the impositioned portions 10a, 10b, 10c, and 10d are then used in a general printed wiring board manufacturing process such as a router, as shown in FIG. 1B. And cut out along the cut lines 11a, 11b, 11c, and 11d. The remaining portion becomes the wiring board material 10A as a frame. And about each part 10a, 10b, 10c, 10d, the components 20, such as a predetermined | prescribed semiconductor component, are each mounted using a mounting apparatus. For this mounting, if the semiconductor component is a bare chip, a well-known flip chip connection or a connection by wire bonding can be applied. Of course, a package product may be mounted as a semiconductor component. Further, passive components may be mounted.

  Dedicated mounting and assembly equipment is used for flip-chip connection and wire bonding. In such a device, the size of the target side on which the bare chip is mounted is usually limited. In this manufacturing process, the size of each portion 10a, 10b, 10c, 10d is determined within the size limitation. Keep it. As a result, it is possible to utilize dedicated mounting / assembling equipment with restrictions on the size of the object.

  Next, as shown in FIG. 2A, the parts 10a, 10b, 10c, and 10d on which the component 20 is mounted are fitted back into the cut-out wiring board material 10A, and these are used as core parts. For example, the prepreg 15 (17) and the double-sided wiring board 16 (18) are laminated on both sides of the wiring board material 10, and these are integrated by heating and pressing.

  Here, it is preferable that a receding hole or a through hole is provided in advance at the position of the prepreg 15 facing the position where the component such as the component 20 is mounted.

  Further, as with the wiring board material 10, the double-sided wiring board 16 (18) has, for example, a wiring layer (not shown) on at least both surfaces, and each has been patterned. As the means for electrical connection between these wiring layers, for example, a well-structured structure made of a conductive resin or a hollow structure made of a metal layer on the inner surface of the through hole can be used.

  By integrating the wiring board material 10, the prepreg 15 (17), and the double-sided wiring board 16 (18), a multilayer wiring board having the wiring board material 10 as a core portion can be obtained. In addition, it can replace with the double-sided wiring board 18, and can also laminate | stack and integrate using a metal (copper) foil. The obtained multilayer wiring board is put into a subsequent process (for example, a process such as forming a solder resist).

  FIG. 2B is a schematic diagram showing in cross section an example of a multilayer (six layer) wiring board obtained as described above. In the case shown in this figure, the electrical connection means that penetrates the prepregs 15 and 17 has a structure filled with a conductive resin as shown in the figure, but a hollow structure with a metal layer on the inner surface of the through hole is used. A thing may be used. By cutting out between C1 and C2 and cutting out between C3 and C4 in FIG. 2 (b) (these cutouts are naturally made at the back and front in the direction perpendicular to the paper surface), a plurality of final small pieces are obtained. The same product is obtained. It should be noted that these cutouts are preferably performed inside the seam (buried seam) with the portion 10c of the wiring board material 10 and the like, as shown. Thereby, what is not structurally different from a normal multilayer wiring board is obtained.

  As described above, in this manufacturing process, a printed wiring board can be manufactured in a form in which a plurality of processes other than the mounting process are applied to a large area. Therefore, the production efficiency can be remarkably improved in the production of a printed wiring board containing components.

  FIG. 3 is a schematic diagram showing in cross section another example of the multilayer (six layers) wiring board obtained as described above. 3, parts corresponding to those in FIGS. 1 and 2 are denoted by the same reference numerals. In the case shown in this figure, both the frame part of the wiring board material 10 that is the core part and the part that has been cut out once and returned for component mounting are used as part of the final product. This is different from the above example.

  Such an application is useful when, for example, the component mounting / assembling device can be applied only to an area smaller than the size of the printed wiring board as a final small piece. That is, the present invention can be applied to a form in which a plurality of portions to be cut out are provided on the inside corresponding to the small piece.

  As shown in FIG. 3, in this case, a continuous pattern cannot be formed for the wiring layer 3 and the wiring layer 4 among the wiring layers 1 to 6. This is because the board portion of the wiring board material 10 on which these patterns are originally formed is once cut out during the manufacturing process. With respect to such discontinuity of the wiring pattern, as shown in A or B of the figure, for the wiring layer 3, the conductive means (electrical connection means) between the wiring layer 3 and the wiring layer 2 and the wiring of the wiring layer 2. Depending on the pattern, the wiring layer 4 can be dealt with by the conductive means between the wiring layer 4 and the wiring layer 5 and the wiring pattern of the wiring layer 5, and the pattern design can be made substantially continuous.

  In the case shown in FIG. 3, for example, the parts 10c and 10d shown in FIG. 1B and the peripheral part of the wiring board material 10A form a small piece as one product. Similarly, the parts 10a and 10b and the wiring board material 10A It is the form made into the small piece as the product same as the said small piece with the peripheral part of. This form is the same in that a printed wiring board can be manufactured by imposing a plurality of sheets on a large area (in this example, two sheets are used, but three or more sheets are also possible). Therefore, it is possible to expand the target, such as to be able to use equipment that can only be mounted and assembled in a smaller area, and to significantly improve the manufacturing efficiency in the production of a printed wiring board incorporating a component.

  The process described above needs to consider the following points. One is that the wiring board material 10A as a frame and the portions 10a, 10b, 10c, and 10d once cut out become core portions, and the core portions and other wiring layers are aligned in a stacked manner. It is necessary that the portions 10a, 10b, 10c, and 10d are previously aligned with respect to the wiring board material 10A in advance. If the portions 10a, 10b, 10c, and 10d are not aligned with respect to the wiring board material 10A, the wiring layers stacked on the portions 10a, 10b, 10c, and 10d and the portions 10a, 10b, 10c, and 10d Will cause a mismatch in the positions of

  Further, after each portion 10a, 10b, 10c, 10d is aligned with respect to the wiring board material 10A as a frame, this state is continued until another layer is laminated and no relative displacement occurs. It is necessary to maintain during this period.

  As for the former (positioning), one method is to use a wiring board material such as a double-sided wiring board as another layer to be laminated on the core board. For example, in this case, a wiring pattern formed on the surface of a wiring board material that is another layer is used as the reference position mark. The alignment of the wiring board material 10A with cutout to the wiring pattern can be performed in the same manner as the alignment of the wiring board material 10 that has not been cut out. For example, using a wiring board material that is another layer or an end face of a wiring board material 10A that is cut out as a reference surface, a method of aligning the outer shape with the abutting surface, or a wiring pattern that becomes a reference position mark by X-rays This is a method of adjusting the position of the wiring board material 10A that is seen through and cut out.

  In this way, after the wiring board material as another layer and the cutout wiring board material 10A are aligned, each portion 10a, 10b, 10c, Fit 10d while aligning. For such alignment, for example, using a mounter, a wiring pattern to be removed from the cut-out portion is read by an image camera attached to the mounter, and each portion 10a, 10b, 10c, 10d is placed on the suction head so as to match the read information. Just mount it. In order to facilitate such a process, each of the portions 10a, 10b, 10c, and 10d is preferably slightly smaller than the cut-out portion of the wiring board material 10A (this also applies to the following alignment method). is there.).

  At this stage, the prepreg is not provided between the wiring board material to be another layer and cannot be laminated as it is. As a procedure, the above-described alignment is performed, and the state is fixed by a method described later, and then the wiring board material 10A, the prepreg, and the wiring board material to be another layer are laminated and integrated. Can do. Therefore, the wiring board material to be another layer for the above alignment may be a dummy without using the actual wiring board material.

  FIG. 4 is a perspective view showing a process example of aligning each portion 10a, 10b, 10c, and 10d with respect to the wiring board material 10A, which is different from the above, and is a manufacturing apparatus according to an embodiment of the present invention ( The disclosure of the part of the alignment device). In this process example, a plurality of pins 22a,..., 22l provided upright at predetermined positions on the mounting table (plate material) 21 are used for alignment between the cut-out wiring board material 10A and each portion 10a and the like ( (See FIG. 4 (a)).

  Specifically, among the pins provided upright on the mounting table 21, the portions 22a to 22d are for positioning the wiring board material 10A that is cut out, and the other portions 22e to 22l are each the portions 10a. 10b, 10c, 10d for alignment. Accordingly, also in this case, the cutout wiring board material 10A and the portions 10a, 10b, 10c, and 10d are indirectly aligned by the mounting table 21 and the pins 22a,.

  First, as shown in FIG. 4B, the double-sided wiring board 18, the prepreg 17, and the wiring board material 10 </ b> A with cutout are placed on the mounting table 21. At this time, reference holes are provided at predetermined positions of the double-sided wiring board 18, the prepreg 17, and the wiring board material 10A corresponding to the positions of the pins 22a to 22d, and the pins 22a to 22d are fitted into the reference holes. Combine.

  Next, as shown in FIG. 4 (c), each portion 10a, 10b, 10c, 10d (with the component 20 mounted) is placed on the placement table 21 at a position where the pins 22a,. To do. At this time, a reference hole is provided at a predetermined position of each portion 10a, 10b, 10c, 10d corresponding to the position of the pins 22e,..., 22l, and the pins 22e,. Combine. The state shown in FIG. 4C obtained in this way is a state in which the wiring board material 10A and the portions 10a, 10b, 10c, and 10d are aligned via the pins 22a,. That is, the pins 22a,..., 22l function as marks, and the fitting to the pins 22a,.

  Of the pins on the mounting table 21, the portions 22a to 22d and the other portions 22e to 22l may not be the numbers shown in FIG. If there are at least two places, the necessary alignment can be performed. Further, in preparation for moving the aligned state from the mounting table 21 to another device or the like, the shape, material, etc. are made so that the pins 22a,. You may choose. After fixing as an eyelet, the pins 22a,..., 22l are removed from the mounting table 21.

  Furthermore, in the case shown in FIG. 4, the double-sided wiring board 17 and the prepreg 18 are placed under the wiring board material 10A, but the wiring board material 10A and the portions 10a, 10b, 10c, and 10d are simply If only positioning is performed, it is not necessary to place the double-sided wiring board 17 and the prepreg 18. In the case shown in FIG. 4, the stacking / integration after alignment is considered.

  FIG. 5 is a perspective view showing an example of a process for aligning each portion 10a, 10b, 10c, 10d with respect to the wiring board material 10A, which is different from the above, and is a manufacturing method according to another embodiment of the present invention. Includes disclosure of the device (part of its alignment device). In this process example, marks marked on the both are used for positioning the cut-out wiring board material 10A and the portions 10a, 10b, 10c, and 10d.

  First, as shown in FIG. 5A, the double-sided wiring board 18, the prepreg 17, and the wiring board material 10 </ b> A with cutout are placed on the mounting table 26. This placement does not have to be highly accurate with respect to the placement table 26. The alignment between them can be performed in advance, for example, by aligning the outer shape with these end surfaces as reference surfaces. On the wiring board material 10A, reference marks M1 to M4 are marked at predetermined positions.

  Next, as shown in FIG. 5B, the wiring board material 10A is optically imaged by the image camera 32 provided on the mounting table 26, and the coordinates of the reference marks M1 to M4 are recognized. Then, based on the recognized coordinates, a portion 10d sucked by the suction head 31 (the same applies to 10a to 10c) is fitted into the cutout portion of the wiring board material 10A.

  More specifically, before the portion 10d is sucked and held by the suction head 31, for example, the portion 10d is imaged by the image camera 32, and the reference marks Ma and Mb marked on the surface are captured and those marks are captured. Adhere based on the position. On the drive side of the suction head 31, the positional relationship between the reference marks M1 to M4 and the reference marks Ma and Mb is stored in advance as data (reference data).

  Then, taking the suction position based on the reference marks Ma and Mb into consideration, the suction head 31 that sucks the portion 10d is moved to a position derived from the coordinates of the reference marks M1 to M4 and the reference data, and the above-described fitting is performed. When the operation is performed, the cut-out wiring board material 10A and the portion 10d are aligned.

  Incidentally, the suction head 31 is configured to be able to move in the vertical and horizontal (XY) directions, rotate around the vertical axis, and move up and down, and is similar to, for example, the suction head provided in the mounter. Further, the reference marks M1 to M4 and the reference marks Ma and Mb do not have to be marked as marks. For example, a part of the wiring pattern may be used. In addition, after the fitting operation as described above, the reference marks M1 to M4 and the reference marks Ma and Mb can be captured again by the image camera 32 to check whether or not the alignment is accurate. As a result of the confirmation, when there is a predetermined deviation or more, each of the portions 10a, 10b, 10c, and 10d may be again adsorbed by the adsorption head 31 and finely adjusted based on the deviation.

  Furthermore, the reference marks M1 to M4 on the wiring board material 10A with cutouts and the reference marks Ma and Mb on the part 10d may not be the numbers shown in FIG. If there are at least two places, the necessary alignment can be performed. This is because the position (XY coordinates) and posture (rotational position on the XY plane) can be detected by two marks.

  Next, a method for maintaining the above-described alignment state until the state in which other layers are stacked and integrated and no relative displacement occurs will be described below. FIG. 6 is a diagram for explaining a method for fixing the state in which the portions 10a, 10b, 10c, and 10d are fitted and aligned with the cut-out portions of the wiring board material 10A having cut-out, and is another embodiment of the present invention. The disclosure of the function of the manufacturing apparatus (part of the member supply device) according to the embodiment is included. In the figure, the components already described are denoted by the same reference numerals, and reference numeral 111 is a wiring pattern. 6A is a top view, and FIGS. 6B and 6C are cross-sectional views.

  In the example shown in FIG. 6, the gap between the cut-out portion of the wiring board material 10A and each of the portions 10a, 10b, 10c, and 10d is used for fixing each other. One example thereof is to apply and fix an adhesive resin 41 in these gaps as described with reference to FIGS. 6 (a) and 6 (b). For the adhesive resin 41, for example, a thermosetting resin such as an epoxy resin can be used. For application to the gap, a device capable of discharging a paste-like object from the discharge head to the details ( For example, a device having the same function as a device for discharging a paste-like object such as a dispenser can be used. Note that such an ejection head can be considered as being provided and moved at the same position as the suction head 31 shown in FIG. 5B, for example.

  As another example, as described with reference to FIGS. 6A and 6C, the solder 42 is applied and fixed to the gaps. The solder 42 can be applied to the gap by, for example, discharging a solder paste from a paste-like object discharge device similar to the above. After being discharged, heat is applied and reflowed. In this case, a metal portion to be bonded to the solder is necessary for the cut-out portion of the wiring board material 10A and the cross-sectional portions of the respective portions 10a, 10b, 10c, and 10d. The wiring patterns 43 and 44 can be used.

  FIG. 7 is a diagram for explaining an example different from the above for fixing the state in which the portions 10a, 10b, 10c, and 10d are fitted and aligned with the cut-out portions of the wiring board material 10A having cut-outs. The same reference numerals are given to the components already described in FIG. FIG. 7A is a top view and FIG. 7B is a cross-sectional view.

  The example shown in FIG. 7 does not use the gap between the cut-out portion of the wiring board material 10A and each of the portions 10a, 10b, 10c, and 10d, and affixes and fixes the adhesive tape 51 on the surfaces across the both. Is. According to this method, the precision of the position required for application of the adhesive resin and solder paste as described above is not necessary. For attaching the adhesive tape 51, an adhesive tape discharge mechanism can be used.

  In this example, since the wiring board material 10A and a part on the surface of each of the parts 10a, 10b, 10c, and 10d are used for tape application, it is necessary to secure the space in advance. In this space, for example, if a layout rule is determined such that a wiring pattern is not formed, a part 10d (10a, 10b, 10c) side is finally cut out from the adhesive tape 51, whereby the part of the adhesive tape 51 is removed from the final product. It is easy to prevent it from being included.

  In the above explanation, the explanation was made on the premise that the original wiring board material is returned to the original one after being cut out after being cut out. However, naturally, the wiring board material to be fitted is correctly positioned (the cut out position). It does not mean that it must be returned to). It is self-evident that what has been cut out may be reversed. In addition, it is obvious that the wiring board material used as a frame and the wiring board material to be fitted may be made by completely different procedures and processes.

The process figure which shows roughly the printed wiring board manufacturing process with which the manufacturing apparatus which concerns on each embodiment of this invention becomes useful in a perspective view. FIG. 2 is a continuation diagram of FIG. 1, and is a process diagram schematically showing a printed wiring board manufacturing process in perspective or cross-section in which the manufacturing apparatus according to each embodiment of the present invention is useful. Sectional drawing which shows the modification of the cross-sectional structure shown in FIG.2 (b). The figure which shows in perspective the example of a process which aligns the part 10a etc. with which components were mounted with respect to the wiring board raw material 10A shown in FIG. FIG. 5 is a perspective view showing an example of a process different from FIG. 4 for aligning a part 10a and the like on which components are mounted with respect to a wiring board material 10A. FIG. 2 is a diagram for explaining a method for fixing a state in which a part 10a or the like that has been mounted with a component is fitted into a cutout portion of a wiring board material 10A that has a partial cutout illustrated in FIG. The figure explaining another method for fixing the state which the part 10a etc. in which components were mounted in the cutout part of the wiring board raw material 10A with a partial cutout shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Wiring board material, 10A ... Wiring board material with partial cutout, 10a, 10b, 10c, 10d ... Partial cutout of wiring board material, 11a, 11b, 11c, 11d ... Cutout line, 12 ... Component mounting area, 15, 17 ... Prepreg, 16, 18 ... Wiring board material, 20 ... Parts, 21 ... Mounting table, 22a, 22b, 22c, 22d, 22e, 22f, 22g, 22h, 22i, 22j, 22k, 22l ... Pin, 26 DESCRIPTION OF REFERENCE SYMBOLS: Mounting table, 31 ... Adsorption head, 32 ... Image camera, M1, M2, M3, M4, Ma, Mb ... Reference mark, 41 ... Adhesive resin, 42 ... Solder, 43, 44 ... Wiring pattern, 51 ... Adhesive tape, 111... Wiring pattern.

Claims (3)

A second wiring board material that is smaller than the cutout space portion of the first wiring board material that is partially cut out in the plane is replaced with the first wiring board material and the second wiring board material. Doo and write no position alignment device fitted to a state that is aligned respectively relative to the reference position,
The first wiring board material and the second wiring board material and said fixing member to secure the state of being respectively aligned the first wiring board material and the second wiring board with respect to the reference position An apparatus for manufacturing a printed wiring board, comprising: a member supply device that supplies a boundary portion with a material. The alignment device includes a mounting table for mounting the first wiring board material and the second wiring board material, and a plurality of pins provided upright at a fixed position on the mounting table. Have
The state in which the first wiring board material and the second wiring board material are aligned with respect to the reference position is provided through the first wiring board material on the mounting table. A part of the plurality of pins is fitted in the two or more reference holes formed, and the two or more reference holes provided so as to penetrate the second wiring board material are included in the plurality of pins. To be achieved by fitting another part of the
The printed wiring board manufacturing apparatus according to claim 1. The alignment device optically images the first wiring board material on the mounting table for mounting the first wiring board material and the second wiring board material; A first recognition unit for recognizing coordinates of at least two fiducial marks marked on the first wiring board material; and an optical image of the second wiring board material for imaging on the second wiring board material. A second recognizing unit for recognizing the coordinates of at least two fiducial marks marked, and the coordinates of the at least two fiducial marks marked on the first wiring board material and the second wiring board material. A storage unit for storing a positional relationship with the coordinates of the at least two reference marks, and a suction head capable of sucking and moving the second wiring board material;
The state in which the first wiring board material and the second wiring board material are aligned with respect to the reference position is based on the desired positional relationship accumulated in the accumulation unit. In consideration of the coordinates of the at least two reference marks recognized by one recognition unit and the coordinates of the at least two reference marks recognized by the second recognition unit, the suction wiring uses the second wiring The board material can be moved and reached on the table.
The printed wiring board manufacturing apparatus according to claim 1.

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