JPS58194391A - Method of producing board circuit device - Google Patents
Method of producing board circuit deviceInfo
- Publication number
- JPS58194391A JPS58194391A JP57077839A JP7783982A JPS58194391A JP S58194391 A JPS58194391 A JP S58194391A JP 57077839 A JP57077839 A JP 57077839A JP 7783982 A JP7783982 A JP 7783982A JP S58194391 A JPS58194391 A JP S58194391A
- Authority
- JP
- Japan
- Prior art keywords
- board
- wiring board
- base material
- circuit device
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、基板回路装置の製造方法に係り、−１ｉ Ｗ
仮母材から打ち抜された復古母材に圧入嵌合さｔｌた配
線基板に端子を固設することにより、基４ｍ ＩＵ材と
配線基板との結合強度が高い状態で配線しｌこ回路部品
を挿入できる基板回路装置の製造り法を提供することを
目的とする。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a substrate circuit device, and includes -1i W
By fixing the terminals to the wiring board that is press-fitted into the restored base material punched out from the temporary base material, the circuit components can be wired with high bonding strength between the base 4m IU material and the wiring board. An object of the present invention is to provide a method for manufacturing a board circuit device into which a wafer can be inserted.
従来の基板回路装置の製造方法としては、例えば、第１
図に示した様に基板母材ｌから配線基板２を打ち抜き、
ｌＰ回路部品４を挿入後第２図に示した様に配線基板２
を再度基板母材１に圧入嵌合し、その状態で半田ディツ
プを行なう方法があった０しかしながら、この方法に於
いては基板１ひ材ｌから離した状態の配線基板２に回路
部品を挿入しなければならず、その際、別に配線基板２
の保持方法を必要とし、従って特に自動化の際に工程が
簡略化されないという欠点があった。父、この場合一度
母材ｌから打ち抜いた配線基板２を再度母材ｌに圧入嵌
合してから回路部材４を挿入する方法も考えられるが母
材１と配線基板２との圧入嵌合による結合が充分な強度
を保つことは困難であり、大量生産の際、特に配線基板
２への回路部品４の挿入時に母材ｌから配線基板２が脱
落することがあった。As a conventional method for manufacturing a board circuit device, for example, the first
As shown in the figure, punch out the wiring board 2 from the board base material l,
After inserting the IP circuit component 4, the wiring board 2 is inserted as shown in FIG.
There was a method in which the circuit components were again press-fitted into the board base material 1 and soldering was performed in that state. However, in this method, the circuit components were inserted into the wiring board 2 that was separated from the board 1 At that time, separate wiring board 2
Therefore, there was a drawback that the process could not be simplified especially when automated. In this case, it is possible to press-fit the wiring board 2 punched out from the base material 1 again into the base material 1 and then insert the circuit member 4, but this method is based on press-fitting the base material 1 and the wiring board 2. It is difficult to maintain sufficient bonding strength, and during mass production, the wiring board 2 sometimes falls off from the base material 1, especially when inserting the circuit component 4 into the wiring board 2.
本発明は旧紀欠点を除去したものであり、以下図面ξ共
に本発明に係る基板回路装置の′ｌＩ７造方法の実施例
を説明する。The present invention eliminates the drawbacks of the old model, and an embodiment of the method for manufacturing a board circuit device according to the present invention will be described below with reference to the drawing ξ.
第３図は本発明になる基板回路装置の製造方法を示す斜
視図である０図中端子孔６が設けられた配線基板２は、
一旦多数個取りの配線基板母材ｌから打ち抜き形成し、
この配線基板２を母材ｌに内度圧入嵌合し、配線基板２
の縁部に端子５を固設するのであるが、端子５の固設は
第４図の要部拡大料ｆＭ図に示す様に配線基板２の縁部
近傍の端ト孔６ａに端子５の較めて固設する。その際端
子５は基板２から母材ｌに延出しており、端子５の凸部
５２は母材ｌの孔７に係合して端子５の位置決めを行な
っている。この端子５の固設け、配線基板２が１す材ｌ
から抜は落ちるのを防ぎ母材ｌと配？Ｍ基板２との結合
を強めている。その後、配線本代２に回路部品４を挿入
しこれを半田ディツプして該゛回路部品４＆び端子５を
半田付固着するがこの際、母材ｌと配線基板２との結合
が強い為、配線填板２が脱落することはない。ここで配
線基板２の外郭２ａは多くの凹凸を有している。これは
ｔ：す材ｌと配線基板２との接触部分を大きくしてさら
に結合強度を高める為である。最後に配線基＋ｙ ＝を
母材ｌから上方へ取り外して基板回路装置を得ろ。FIG. 3 is a perspective view showing the manufacturing method of the board circuit device according to the present invention. In FIG. 0, the wiring board 2 provided with the terminal hole 6 is
Once formed by punching from a multi-piece wiring board base material l,
This wiring board 2 is press-fitted into the base material l, and the wiring board 2
The terminal 5 is fixed to the edge of the wiring board 2, as shown in the enlarged view of the main part in FIG. Compare and install. At this time, the terminal 5 extends from the substrate 2 to the base material l, and the protrusion 52 of the terminal 5 engages with the hole 7 of the base material l to position the terminal 5. This terminal 5 is fixedly provided, and the wiring board 2 is made of one material.
Prevent the removal from falling and align with the base material l? The bond with the M substrate 2 is strengthened. After that, insert the circuit component 4 into the wiring material 2 and dip it with solder to solder and fix the circuit component 4 and the terminal 5. At this time, since the bond between the base material 1 and the wiring board 2 is strong, The wiring filling board 2 will not fall off. Here, the outer shell 2a of the wiring board 2 has many irregularities. This is to increase the contact area between the t: plate 1 and the wiring board 2 to further increase the bonding strength. Finally, remove the wiring base +y = upward from the base material l to obtain the board circuit device.
、□：λ５図に示した本発明に係る基板回路装置の製造
方法の他の実施例は、配線基板母材ｌから打ち抜き後再
度圧入嵌合した配＃基板２に端子５を先の実施例と同様
に固設した後、回路部品・１を挿入すると共に配線基板
２と母材ｌとの間に形成した脚部孔２１にケース２０の
脚部２０ａを嵌合させ基板回路装置にケース２０を組付
けてから、回路部品４、端子５、ケース２０の脚部２０
ａを半田付固着して配線基板２を母材ｌから取り外し、
ケース付基板回路装置を得る方法である。, □:λ5 Another embodiment of the method for manufacturing a board circuit device according to the present invention shown in FIG. After fixing in the same manner as above, insert the circuit component 1 and fit the legs 20a of the case 20 into the leg holes 21 formed between the wiring board 2 and the base material l, and attach the case 20 to the board circuit device. After assembling the circuit components 4, terminals 5, and legs 20 of the case 20,
Solder and fix a, remove the wiring board 2 from the base material l,
This is a method of obtaining a board circuit device with a case.
尚、上記実施例中基板に端子を固設する工程は基板を打
ち抜き形成した後、再度圧入嵌合する前に行なっても同
様の効果を有する。In the above embodiment, the same effect can be obtained even if the step of fixing the terminals to the substrate is performed after the substrate is punched out and before the terminals are press-fitted again.
上述の如く、不発明に係る基板回路装置の一！８！遣方
法によれば、配線基板を母材によってその縁部を支持し
回路部品を挿入している為、配＄１ｄ／４板の縁部近傍
まで回路部品を挿入でき配線基板を有効に活用でき、配
線基板を打ち抜いた母材を再度配線基板の支持に利用し
ている為、部品が合理的に １活用され、又複雑形状
の配線基板であっても支持でき、多数の配線基板を１枚
の母（オに支持し部品挿入、半田付等の処理全行ない得
る為、自動化の際工程が簡略化され、基板から母材へ延
出した状態で端子を椿仮に固設し回路部品の基板への挿
入を何なっている為、基板と母材の結合強度が高い状態
で回路部品の挿入を行なえ基板が母材から脱落すること
がない等の利点を有する。As mentioned above, one of the uninvented board circuit devices! 8! According to this method, the edge of the wiring board is supported by the base material and the circuit components are inserted, so the circuit components can be inserted up to the edge of the 1d/4 board and the wiring board can be used effectively. Since the base material punched out of the wiring board is reused to support the wiring board, parts can be used rationally, and even complex-shaped wiring boards can be supported, allowing many wiring boards to be supported on one board. Because all processes such as component insertion and soldering can be carried out by supporting the motherboard (on the board), the process is simplified during automation. Since the circuit components are inserted into the base material in a certain manner, circuit components can be inserted while the bonding strength between the board and the base material is high, and the board has the advantage that it will not fall off from the base material.
第１図、第２図は従来の基板回路装置の製造方法を示す
図、第３図、第４図は本発明に係る基板回路装置の・ρ
遣方法の実施例を示す図、第５図は本発明ｌ・こ係る基
板回路装置の製造方法の池の実施１り１］を小す１Δで
ある。
ｌ 配線基板母材、２ 配線基板、４ 回路部品、５女
１ｍｌ子、５１−Ｍめ用突起、６．６ａ 端子孔
特許出願人
ミツミ電模株式会社
第１図1 and 2 are diagrams showing a conventional method for manufacturing a board circuit device, and FIGS. 3 and 4 are diagrams showing a method for manufacturing a board circuit device according to the present invention.
FIG. 5 is a diagram showing an embodiment of the method of manufacturing the substrate circuit device according to the present invention. l Wiring board base material, 2 Wiring board, 4 Circuit components, 5 Female 1ml child, 51-M protrusion, 6.6a Terminal hole patent applicant Mitsumi Denmo Co., Ltd. Figure 1
Claims (1)
程と、この配線基板を再度該母材に圧入嵌合する■−程
と、端子を６ｇ基板から平行に延出した状態ｆ 、＋６
Ｉ＋！板に固設する工程と、該基板に回路部品を仲人
する工程と、該回路部品と該端子を半田付同右する９、
［程とからなる基板回路装置の製造方法。11', punching and forming a wiring board from a wiring board base material;
Step 1: Press-fit this wiring board into the base material again.
I+! 9, a step of fixing the circuit components to the board, a step of attaching the circuit components to the board, and a step of soldering the circuit components and the terminals;
[A method for manufacturing a substrate circuit device comprising steps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57077839A JPS58194391A (en) | 1982-05-10 | 1982-05-10 | Method of producing board circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57077839A JPS58194391A (en) | 1982-05-10 | 1982-05-10 | Method of producing board circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58194391A true JPS58194391A (en) | 1983-11-12 |
| JPS6335119B2 JPS6335119B2 (en) | 1988-07-13 |
Family
ID=13645211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57077839A Granted JPS58194391A (en) | 1982-05-10 | 1982-05-10 | Method of producing board circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58194391A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135767A (en) * | 2007-12-27 | 2008-06-12 | Dainippon Printing Co Ltd | Manufacturing method of printed wiring board, and printed wiring board |
| JP2008263225A (en) * | 2008-07-07 | 2008-10-30 | Dainippon Printing Co Ltd | Manufacturing device of printed wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS579519A (en) * | 1968-11-21 | 1982-01-19 | Gen Electric | Controller for thickness of tandem type rolling mill |
-
1982
- 1982-05-10 JP JP57077839A patent/JPS58194391A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS579519A (en) * | 1968-11-21 | 1982-01-19 | Gen Electric | Controller for thickness of tandem type rolling mill |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135767A (en) * | 2007-12-27 | 2008-06-12 | Dainippon Printing Co Ltd | Manufacturing method of printed wiring board, and printed wiring board |
| JP2008263225A (en) * | 2008-07-07 | 2008-10-30 | Dainippon Printing Co Ltd | Manufacturing device of printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6335119B2 (en) | 1988-07-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04147579A (en) | Through hole connection type electronic device and its mounting method | |
| JPS58194391A (en) | Method of producing board circuit device | |
| JPH05343878A (en) | Manufacture of high-density circuit module | |
| JPH08203629A (en) | Printed wiring device | |
| US3283060A (en) | Dip-soldered module and method of making the same | |
| US3237282A (en) | Printed board wiring | |
| JPS5810391Y2 (en) | Printed circuit board with lug terminals | |
| JPS6130745B2 (en) | ||
| JPS58190098A (en) | Method of producing board circuit device | |
| JP2801743B2 (en) | Electronic component manufacturing method | |
| JPH0227575Y2 (en) | ||
| JP3010295U (en) | Eyelet | |
| JP2923087B2 (en) | Printed circuit board solder joint structure and printed circuit board solder joint method | |
| JPH0563100U (en) | Electronic parts with shield case | |
| JPH0786714A (en) | Structure for mounting hybrid ic | |
| JPH02148710A (en) | Method of inserting and mounting circuit component with lead terminal | |
| JPH0786086A (en) | Electronic component for printed board mounting and its fixing method | |
| JPH0528053U (en) | Lead frame | |
| JPH0142591B2 (en) | ||
| JPS5961571U (en) | Printed board | |
| JPS62184683U (en) | ||
| JPS59218793A (en) | Method of mounting dip type ic | |
| JPH0736476B2 (en) | Method of manufacturing circuit module | |
| JPH1032382A (en) | Terminal structure of hybrid ic | |
| JPH0633367U (en) | Board and terminal mounting structure |