JP4168776B2 - 発光装置及びそれを用いた照明装置 - Google Patents

発光装置及びそれを用いた照明装置 Download PDF

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Publication number
JP4168776B2
JP4168776B2 JP2003036722A JP2003036722A JP4168776B2 JP 4168776 B2 JP4168776 B2 JP 4168776B2 JP 2003036722 A JP2003036722 A JP 2003036722A JP 2003036722 A JP2003036722 A JP 2003036722A JP 4168776 B2 JP4168776 B2 JP 4168776B2
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JP
Japan
Prior art keywords
light
phosphor
emitting device
light emitting
light emitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003036722A
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English (en)
Japanese (ja)
Other versions
JP2003306675A5 (enrdf_load_stackoverflow
JP2003306675A (ja
Inventor
孝俊 瀬戸
直人 木島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to JP2003036722A priority Critical patent/JP4168776B2/ja
Publication of JP2003306675A publication Critical patent/JP2003306675A/ja
Publication of JP2003306675A5 publication Critical patent/JP2003306675A5/ja
Application granted granted Critical
Publication of JP4168776B2 publication Critical patent/JP4168776B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2003036722A 2002-02-15 2003-02-14 発光装置及びそれを用いた照明装置 Expired - Fee Related JP4168776B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003036722A JP4168776B2 (ja) 2002-02-15 2003-02-14 発光装置及びそれを用いた照明装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-38705 2002-02-15
JP2002038705 2002-02-15
JP2003036722A JP4168776B2 (ja) 2002-02-15 2003-02-14 発光装置及びそれを用いた照明装置

Publications (3)

Publication Number Publication Date
JP2003306675A JP2003306675A (ja) 2003-10-31
JP2003306675A5 JP2003306675A5 (enrdf_load_stackoverflow) 2006-02-02
JP4168776B2 true JP4168776B2 (ja) 2008-10-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003036722A Expired - Fee Related JP4168776B2 (ja) 2002-02-15 2003-02-14 発光装置及びそれを用いた照明装置

Country Status (1)

Country Link
JP (1) JP4168776B2 (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4617890B2 (ja) * 2004-01-16 2011-01-26 三菱化学株式会社 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置
EP1715023B1 (en) 2004-01-16 2012-10-24 Mitsubishi Chemical Corporation Phosphor and including the same, light emitting apparatus, illuminating apparatus and image display
JP4617889B2 (ja) * 2004-01-16 2011-01-26 三菱化学株式会社 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置
US20070247051A1 (en) * 2004-09-07 2007-10-25 Sumitomo Chemical Company, Limited Phosphor, Phosphor Paste and Light-Emitting Device
KR20060034055A (ko) * 2004-10-18 2006-04-21 엘지이노텍 주식회사 형광체 및 이를 이용한 발광소자
KR100666265B1 (ko) * 2004-10-18 2007-01-09 엘지이노텍 주식회사 형광체 및 이를 이용한 발광소자
JP2006137851A (ja) * 2004-11-12 2006-06-01 Sumitomo Chemical Co Ltd ケイ酸塩蛍光体粉末およびその製造方法
DE102007060198A1 (de) * 2007-12-14 2009-06-18 Osram Gesellschaft mit beschränkter Haftung Konversions-LED
JP5770192B2 (ja) * 2010-09-07 2015-08-26 宇部マテリアルズ株式会社 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置
JP5736272B2 (ja) * 2011-08-09 2015-06-17 宇部マテリアルズ株式会社 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置
JP6187342B2 (ja) * 2014-03-20 2017-08-30 宇部興産株式会社 酸窒化物蛍光体粉末およびその製造方法
KR102001718B1 (ko) * 2016-11-30 2019-07-18 세종대학교산학협력단 산화물계 형광체

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS646087A (en) * 1987-06-30 1989-01-10 Hitachi Ltd Synthesis of fluophor
JP2002042525A (ja) * 2000-07-26 2002-02-08 Toyoda Gosei Co Ltd 面状光源
DE10036940A1 (de) * 2000-07-28 2002-02-07 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Lumineszenz-Konversions-LED
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置

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Publication number Publication date
JP2003306675A (ja) 2003-10-31

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