JP4167711B2 - 確実な放熱手段を備えた電子機器 - Google Patents
確実な放熱手段を備えた電子機器 Download PDFInfo
- Publication number
- JP4167711B2 JP4167711B2 JP2006501869A JP2006501869A JP4167711B2 JP 4167711 B2 JP4167711 B2 JP 4167711B2 JP 2006501869 A JP2006501869 A JP 2006501869A JP 2006501869 A JP2006501869 A JP 2006501869A JP 4167711 B2 JP4167711 B2 JP 4167711B2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- electronic device
- support plate
- support
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 title description 2
- 238000001816 cooling Methods 0.000 claims abstract description 31
- 238000003825 pressing Methods 0.000 claims abstract description 25
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 7
- 230000005484 gravity Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0204—Mounting supporting structures on the outside of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
Description
2 ハウジング
3 ハウジングシェル
4 ハウジング蓋
5 平型回路部品
6 接続端子
7 電力用電子部品
8 接触ピン
9 ハウジング内室
11 ねじガイド
12 取付ねじ
13 冷却体
14 蓋面
15 側壁
16 端面壁
18 補強リブ
19 基底板
20 側壁
21 端面壁
22 係止突起
23 係止開口
24 支持突起
25 支持輪郭部
26 支持板
27 載置面
28 ねじ穴
29 ねじ頭
30 側壁
31 放射方向突出部
32 ストッパ
Claims (11)
- ハウジングシェル(3)及びハウジング蓋(4)を含む複数分割型ハウジング(2)と、少なくとも1つの電力用電子部品(7)を装着した支持板(26)を備え、
前記ハウジングシェル(3)の基底板(19)が前記支持板(26)に結合され、それによりハウジングシェル(3)を介して、支持板(26)を冷却体(13)に押圧する押圧力が、支持板(26)に働き、
前記ハウジング蓋(4)は前記支持板(26)を冷却体(13)の載置面(27)に押圧しつつ前記ハウジング(2)を前記冷却体(13)に取り付けるための装着装置(11,12)を備え、
さらに前記ハウジング蓋(4)から前記ハウジングシェル(3)へと前記基底板(19)の方向に向けられた押圧力(F)の伝達のために少なくとも1つの支持部材(24,25,31,32)が設けられている電子機器(1)。 - 前記ハウジングシェル(3)及び前記ハウジング蓋(4)が互いに係止されていることを特徴とする請求項1に記載の電子機器(1)。
- 前記装着装置(11,12)は少なくとも2つの取付ねじ(12)、及び前記ハウジング蓋(4)の対応する各ねじガイド(11)を含み、各ねじガイド(11)はハウジング内室(9)を貫通していることを特徴とする請求項1又は2に記載の電子機器(1)。
- 前記ハウジング(2)の側壁(15,20)に支持部材(24,25)が配置されていることを特徴とする請求項1ないし3のいずれか1項に記載の電子機器(1)。
- 前記支持部材(24,25)は第1ハウジング部(3)の側壁(20)に形成された支持突起(24)を含み、この支持突起(24)は第2ハウジング部(4)の側壁(15)内の対応する支持輪郭部(25)に係止されていることを特徴とする請求項4に記載の電子機器(1)。
- 前記支持突起(24)がバックテーパ式に構成されていることを特徴とする請求項5に記載の電子機器(1)。
- 前記ハウジングシェル(3)及び前記ハウジング蓋(4)の少なくとも一方が補強リブ(18)を備えていることを特徴とする請求項1ないし6のいずれかに記載の電子機器(1)。
- 前記支持部材(31,32)が前記ハウジング蓋(4)のねじガイド(11)の放射方向突出部(31)を含み、この放射方向突出部(31)は前記ハウジングシェル(3)の対応するストッパ(32)と協働することを特徴とする請求項2ないし7のいずれか1項に記載の電子機器(1)。
- 前記支持板(26)が前記基底板(19)の上方のハウジング外室内に突出していることを特徴とする請求項1ないし8のいずれか1項に記載の電子機器(1)。
- 前記ねじガイド(11)は、ハウジング長手方向(17)に見て、前記支持板(26)の各長手方向端部に対し直接又はわずかな間隔をもって配置されていることを特徴とする請求項2ないし9のいずれか1項に記載の電子機器(1)。
- 前記ハウジングシェル(3)の基底板(19)が前記支持板(26)に対する閉じたフレームを形成していることを特徴とする請求項1ないし10のいずれか1項に記載の電子機器(1)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03004554A EP1453366A1 (de) | 2003-02-28 | 2003-02-28 | Elektronisches Gerät mit sicherer Wärmeableitung |
PCT/EP2004/001494 WO2004077908A1 (de) | 2003-02-28 | 2004-02-17 | Elektronisches gerät mit sicherer wärmeableitung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006519484A JP2006519484A (ja) | 2006-08-24 |
JP4167711B2 true JP4167711B2 (ja) | 2008-10-22 |
Family
ID=32748835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006501869A Expired - Lifetime JP4167711B2 (ja) | 2003-02-28 | 2004-02-17 | 確実な放熱手段を備えた電子機器 |
Country Status (12)
Country | Link |
---|---|
US (1) | US7515421B2 (ja) |
EP (2) | EP1453366A1 (ja) |
JP (1) | JP4167711B2 (ja) |
KR (1) | KR100801337B1 (ja) |
CN (1) | CN100425111C (ja) |
AT (1) | ATE348503T1 (ja) |
DE (1) | DE502004002295D1 (ja) |
DK (1) | DK1597951T3 (ja) |
HK (1) | HK1087302A1 (ja) |
LT (1) | LT5393B (ja) |
TW (1) | TWI325296B (ja) |
WO (1) | WO2004077908A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7773379B2 (en) * | 2007-10-23 | 2010-08-10 | Tyco Electronics Corporation | Module assembly having heat transfer plate |
TWI400032B (zh) * | 2008-02-05 | 2013-06-21 | Delta Electronics Inc | 散熱模組及其支撐件 |
DE102008063104A1 (de) * | 2008-12-24 | 2010-07-01 | Robert Bosch Gmbh | Elektronisches Steuergerät |
DE102014222951B4 (de) * | 2014-11-11 | 2016-07-28 | Würth Elektronik eiSos Gmbh & Co. KG | Befestigungselement zur Befestigung an einer Leiterplatte sowie Befestigungsvorrichtung und Verfahren zum beabstandeten Verbinden von Leiterplatten mit einem derartigen Befestigungselement |
CN109803520B (zh) * | 2019-03-06 | 2020-08-07 | 蚌埠崧欣电子科技有限公司 | 一种室外用led电源控制器 |
USD957353S1 (en) * | 2020-06-08 | 2022-07-12 | Ninigbo Addlux Electric Co., Ltd. | Switch for light bulb holder |
Family Cites Families (32)
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US3961666A (en) * | 1972-11-24 | 1976-06-08 | Sony Corporation | Heat dispersion device for use in an electronic apparatus |
DE2530157A1 (de) * | 1975-07-05 | 1977-02-03 | Bosch Gmbh Robert | Elektronisches steuergeraet |
US4039900A (en) * | 1976-03-18 | 1977-08-02 | Ault, Inc. | Plug in regulating power supply |
FR2580137A1 (en) * | 1985-04-05 | 1986-10-10 | Omron Tateisi Electronics Co | Assembly of electronic components |
US4821051A (en) * | 1988-09-01 | 1989-04-11 | Eastman Kodak Company | Optical printhead having thermal expansion stress relief |
US5280191A (en) * | 1989-12-26 | 1994-01-18 | At&T Bell Laboratories | Lightwave packaging for pairs of optical devices having thermal dissipation means |
US5003429A (en) * | 1990-07-09 | 1991-03-26 | International Business Machines Corporation | Electronic assembly with enhanced heat sinking |
US5065280A (en) * | 1990-08-30 | 1991-11-12 | Hewlett-Packard Company | Flex interconnect module |
US5175613A (en) * | 1991-01-18 | 1992-12-29 | Digital Equipment Corporation | Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips |
US5132874A (en) * | 1991-10-04 | 1992-07-21 | Alcatel Network Systems, Inc. | Thermo-switch apparatus |
US5305185A (en) * | 1992-09-30 | 1994-04-19 | Samarov Victor M | Coplanar heatsink and electronics assembly |
US5313097A (en) * | 1992-11-16 | 1994-05-17 | International Business Machines, Corp. | High density memory module |
US5426565A (en) * | 1993-03-26 | 1995-06-20 | Sundstrand Corporation | Electronic package clamping arrangement |
DE4310446C1 (de) * | 1993-03-31 | 1994-05-05 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
US5402313A (en) * | 1993-05-21 | 1995-03-28 | Cummins Engine Company, Inc. | Electronic component heat sink attachment using a canted coil spring |
US5473510A (en) * | 1994-03-25 | 1995-12-05 | Convex Computer Corporation | Land grid array package/circuit board assemblies and methods for constructing the same |
JP3281220B2 (ja) | 1994-12-14 | 2002-05-13 | 株式会社東芝 | 回路モジュールの冷却装置 |
US5590026A (en) * | 1995-07-31 | 1996-12-31 | Borg-Warner Automotive, Inc. | Apparatus for dissipating heat from an integrated circuit |
US5673172A (en) * | 1996-01-05 | 1997-09-30 | Compaq Computer Corporation | Apparatus for electromagnetic interference and electrostatic discharge shielding of hot plug-connected hard disk drives |
US5835350A (en) * | 1996-12-23 | 1998-11-10 | Lucent Technologies Inc. | Encapsulated, board-mountable power supply and method of manufacture therefor |
US5907474A (en) * | 1997-04-25 | 1999-05-25 | Advanced Micro Devices, Inc. | Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package |
US6065530A (en) * | 1997-05-30 | 2000-05-23 | Alcatel Usa Sourcing, L.P. | Weatherproof design for remote transceiver |
US5880930A (en) * | 1997-06-18 | 1999-03-09 | Silicon Graphics, Inc. | Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism |
US6043981A (en) * | 1997-11-13 | 2000-03-28 | Chrysler Corporation | Heat sink assembly for electrical components |
FR2771594B1 (fr) * | 1997-11-21 | 1999-12-31 | Schneider Electric Sa | Variateur electronique de vitesse |
US6147869A (en) * | 1997-11-24 | 2000-11-14 | International Rectifier Corp. | Adaptable planar module |
JP2000269671A (ja) | 1999-03-19 | 2000-09-29 | Toshiba Corp | 電子機器 |
CN2411649Y (zh) * | 1999-12-18 | 2000-12-20 | 郑州恒科实业有限公司 | 水冷式热态电子设备保护装置 |
US6549409B1 (en) * | 2000-08-21 | 2003-04-15 | Vlt Corporation | Power converter assembly |
JP2003031978A (ja) | 2001-07-13 | 2003-01-31 | Auto Network Gijutsu Kenkyusho:Kk | コントロールユニット及びその製造方法 |
DE10213648B4 (de) * | 2002-03-27 | 2011-12-15 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
US6936919B2 (en) * | 2002-08-21 | 2005-08-30 | Texas Instruments Incorporated | Heatsink-substrate-spacer structure for an integrated-circuit package |
-
2003
- 2003-02-28 EP EP03004554A patent/EP1453366A1/de not_active Withdrawn
-
2004
- 2004-02-17 CN CNB2004800050683A patent/CN100425111C/zh not_active Expired - Lifetime
- 2004-02-17 JP JP2006501869A patent/JP4167711B2/ja not_active Expired - Lifetime
- 2004-02-17 US US10/546,997 patent/US7515421B2/en active Active
- 2004-02-17 EP EP04711599A patent/EP1597951B1/de not_active Expired - Lifetime
- 2004-02-17 KR KR1020057015962A patent/KR100801337B1/ko active IP Right Grant
- 2004-02-17 WO PCT/EP2004/001494 patent/WO2004077908A1/de active IP Right Grant
- 2004-02-17 DE DE502004002295T patent/DE502004002295D1/de not_active Expired - Lifetime
- 2004-02-17 AT AT04711599T patent/ATE348503T1/de active
- 2004-02-17 DK DK04711599T patent/DK1597951T3/da active
- 2004-02-25 TW TW093104750A patent/TWI325296B/zh not_active IP Right Cessation
-
2006
- 2006-06-07 LT LT2006046A patent/LT5393B/lt not_active IP Right Cessation
- 2006-06-21 HK HK06107092A patent/HK1087302A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK1087302A1 (en) | 2006-10-06 |
EP1597951A1 (de) | 2005-11-23 |
TWI325296B (en) | 2010-05-21 |
US20060164810A1 (en) | 2006-07-27 |
DK1597951T3 (da) | 2007-04-23 |
KR20050106047A (ko) | 2005-11-08 |
DE502004002295D1 (de) | 2007-01-25 |
KR100801337B1 (ko) | 2008-02-11 |
ATE348503T1 (de) | 2007-01-15 |
CN1754411A (zh) | 2006-03-29 |
JP2006519484A (ja) | 2006-08-24 |
LT5393B (lt) | 2007-01-25 |
WO2004077908A1 (de) | 2004-09-10 |
LT2006046A (en) | 2006-11-27 |
EP1597951B1 (de) | 2006-12-13 |
CN100425111C (zh) | 2008-10-08 |
US7515421B2 (en) | 2009-04-07 |
EP1453366A1 (de) | 2004-09-01 |
TW200423854A (en) | 2004-11-01 |
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