JP4161318B2 - はんだボールの製造方法 - Google Patents
はんだボールの製造方法 Download PDFInfo
- Publication number
- JP4161318B2 JP4161318B2 JP2004292482A JP2004292482A JP4161318B2 JP 4161318 B2 JP4161318 B2 JP 4161318B2 JP 2004292482 A JP2004292482 A JP 2004292482A JP 2004292482 A JP2004292482 A JP 2004292482A JP 4161318 B2 JP4161318 B2 JP 4161318B2
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- Prior art keywords
- solder ball
- molten metal
- mass
- surface shape
- dendrite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Description
Claims (5)
- るつぼ内の、Snの融点を降下させる元素1種または2種以上を合計で0.5〜60質量%含有し残部がSn及び不可避不純物からなる溶湯に、圧力と振動を付与して、前記るつぼの底部に設けたオリフィスから溶湯を押出し、0.11MPa以上の気圧のガス雰囲気中に滴下し、該滴下した溶湯を前記ガス雰囲気中で球状に急冷凝固させて得ることを特徴とするはんだボールの製造方法。
- はんだボールは、2〜6質量%Agを含有し、さらに0.1〜2.0質量%Cuと0.1〜10.0%Biの1種または2種を含有し、残部がSn及び不可避不純物からなることを特徴とする請求項1に記載のはんだボールの製造方法。
- 滴下した溶湯を、不活性ガス、還元ガスあるいはこれらの混合ガス雰囲気で球状に急冷凝固させることを特徴とする請求項1または2に記載のはんだボールの製造方法。
- 滴下した溶湯を、窒素ガス雰囲気で球状に急冷凝固させることを特徴とする請求項3に記載のはんだボールの製造方法。
- 球状に急冷凝固させたはんだボールは、その球の中心を含む断面で観察した際に、最も大きい1個のデンドライトの面積率が80%以下であることを特徴とする請求項1ないし4のいずれかに記載のはんだボールの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004292482A JP4161318B2 (ja) | 2004-10-05 | 2004-10-05 | はんだボールの製造方法 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2004292482A JP4161318B2 (ja) | 2004-10-05 | 2004-10-05 | はんだボールの製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000200599A Division JP3649384B2 (ja) | 2000-03-14 | 2000-07-03 | はんだボールおよびその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005290686A Division JP2006102816A (ja) | 2005-10-04 | 2005-10-04 | はんだボールおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005066699A JP2005066699A (ja) | 2005-03-17 |
JP4161318B2 true JP4161318B2 (ja) | 2008-10-08 |
Family
ID=34420337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004292482A Expired - Lifetime JP4161318B2 (ja) | 2004-10-05 | 2004-10-05 | はんだボールの製造方法 |
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JP (1) | JP4161318B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102296208A (zh) * | 2011-08-17 | 2011-12-28 | 天津百瑞杰焊接材料有限公司 | 用于制作温度保险丝的熔断芯的无铅低温合金及其制备方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5003551B2 (ja) * | 2008-03-26 | 2012-08-15 | 三菱マテリアル株式会社 | ペースト用Pb−Snはんだ合金粉末およびPb−Snはんだ合金ボール |
JP5379402B2 (ja) * | 2008-05-12 | 2013-12-25 | 株式会社弘輝 | 鉛フリーSn−Ag系半田合金及び半田合金粉末 |
JP5609774B2 (ja) * | 2011-05-27 | 2014-10-22 | 株式会社弘輝 | 5元系合金粒子 |
MY195230A (en) * | 2017-04-10 | 2023-01-11 | Metallo Belgium | Improved Process for the Production of Crude Solder |
CN111545765A (zh) * | 2020-04-17 | 2020-08-18 | 太极半导体(苏州)有限公司 | 一种球径均一且球形度好的锡球制备方法 |
-
2004
- 2004-10-05 JP JP2004292482A patent/JP4161318B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102296208A (zh) * | 2011-08-17 | 2011-12-28 | 天津百瑞杰焊接材料有限公司 | 用于制作温度保险丝的熔断芯的无铅低温合金及其制备方法 |
Also Published As
Publication number | Publication date |
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JP2005066699A (ja) | 2005-03-17 |
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