JP4158227B2 - 微小凹凸の検査方法および検査装置 - Google Patents
微小凹凸の検査方法および検査装置 Download PDFInfo
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- JP4158227B2 JP4158227B2 JP13264398A JP13264398A JP4158227B2 JP 4158227 B2 JP4158227 B2 JP 4158227B2 JP 13264398 A JP13264398 A JP 13264398A JP 13264398 A JP13264398 A JP 13264398A JP 4158227 B2 JP4158227 B2 JP 4158227B2
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- LHKBPQGZMDMRHE-POHAHGRESA-N C/C(/C1CC1)=C/CC1CCCC1 Chemical compound C/C(/C1CC1)=C/CC1CCCC1 LHKBPQGZMDMRHE-POHAHGRESA-N 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13264398A JP4158227B2 (ja) | 1998-04-27 | 1998-04-27 | 微小凹凸の検査方法および検査装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13264398A JP4158227B2 (ja) | 1998-04-27 | 1998-04-27 | 微小凹凸の検査方法および検査装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11311510A JPH11311510A (ja) | 1999-11-09 |
| JPH11311510A5 JPH11311510A5 (enExample) | 2005-09-22 |
| JP4158227B2 true JP4158227B2 (ja) | 2008-10-01 |
Family
ID=15086129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13264398A Expired - Fee Related JP4158227B2 (ja) | 1998-04-27 | 1998-04-27 | 微小凹凸の検査方法および検査装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4158227B2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10122313A1 (de) * | 2001-05-08 | 2002-11-21 | Wolfgang P Weinhold | Verfahren und Vorrichtung zur berührungsfreien Untersuchung eines Gegenstandes, insbesondere hinsichtlich dessen Oberflächengestalt |
| JP4575202B2 (ja) * | 2005-03-24 | 2010-11-04 | 日本板硝子株式会社 | 透明板状体の欠点検査方法及び欠点検査装置 |
| JP2007271510A (ja) * | 2006-03-31 | 2007-10-18 | Tsubakimoto Chain Co | 外観検査方法及び外観検査装置 |
| US7567344B2 (en) * | 2006-05-12 | 2009-07-28 | Corning Incorporated | Apparatus and method for characterizing defects in a transparent substrate |
| JP4960161B2 (ja) * | 2006-10-11 | 2012-06-27 | 日東電工株式会社 | 検査データ処理装置及び検査データ処理方法 |
| KR101249168B1 (ko) | 2009-12-18 | 2013-03-29 | 주식회사 포스코 | 냉간압연에서의 품질이상 예지 시스템과 그 방법 |
| JP5768224B2 (ja) * | 2010-03-26 | 2015-08-26 | パナソニックIpマネジメント株式会社 | 欠陥検出装置および欠陥検出方法 |
| JP2014145656A (ja) * | 2013-01-29 | 2014-08-14 | Nikka Kk | 微粒子付着状態可視化方法、および微粒子付着状態可視化装置 |
| EP3561447B1 (en) * | 2017-01-25 | 2023-11-22 | National Institute of Advanced Industrial Science and Technology | Image processing method |
| JP7110777B2 (ja) * | 2017-07-20 | 2022-08-02 | 日立金属株式会社 | 金属薄板検査装置および金属薄板の検査方法 |
| JP7135297B2 (ja) * | 2017-10-27 | 2022-09-13 | 株式会社ニコン | 検査装置、検査システム、および検査方法 |
| CN110672621B (zh) * | 2019-10-10 | 2021-03-05 | 清华大学 | 基于光照亮度调整的汽车涂装表面缺陷图像质量优化方法 |
| JP7634343B2 (ja) * | 2020-01-15 | 2025-02-21 | 株式会社Uacj | 検査方法、検査装置および圧延装置の制御方法 |
| CN111351795A (zh) * | 2020-02-27 | 2020-06-30 | 杨孝兰 | 一种基于特殊结构光的镜面物体及透明物体检测方法 |
| CN111443040A (zh) * | 2020-05-14 | 2020-07-24 | 成都德图福思科技有限公司 | 反光透光复合材料表面激光打码蚀痕的成像系统及方法 |
| JP7390278B2 (ja) * | 2020-12-16 | 2023-12-01 | 株式会社日立ハイテクソリューションズ | 外観検査方法、外観検査装置、構造体に対する加工方法および装置 |
-
1998
- 1998-04-27 JP JP13264398A patent/JP4158227B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11311510A (ja) | 1999-11-09 |
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