JP4153898B2 - 高周波電力増幅器モジュール - Google Patents

高周波電力増幅器モジュール Download PDF

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Publication number
JP4153898B2
JP4153898B2 JP2004150427A JP2004150427A JP4153898B2 JP 4153898 B2 JP4153898 B2 JP 4153898B2 JP 2004150427 A JP2004150427 A JP 2004150427A JP 2004150427 A JP2004150427 A JP 2004150427A JP 4153898 B2 JP4153898 B2 JP 4153898B2
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JP
Japan
Prior art keywords
transistor
output terminal
input terminal
power amplifier
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004150427A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004289869A (ja
JP2004289869A5 (https=
Inventor
修 加賀谷
健治 関根
英一 長谷
喜市 山下
静雄 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2004150427A priority Critical patent/JP4153898B2/ja
Publication of JP2004289869A publication Critical patent/JP2004289869A/ja
Publication of JP2004289869A5 publication Critical patent/JP2004289869A5/ja
Application granted granted Critical
Publication of JP4153898B2 publication Critical patent/JP4153898B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Microwave Amplifiers (AREA)
  • Amplifiers (AREA)
JP2004150427A 2004-05-20 2004-05-20 高周波電力増幅器モジュール Expired - Fee Related JP4153898B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004150427A JP4153898B2 (ja) 2004-05-20 2004-05-20 高周波電力増幅器モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004150427A JP4153898B2 (ja) 2004-05-20 2004-05-20 高周波電力増幅器モジュール

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP04104599A Division JP3667136B2 (ja) 1998-07-06 1999-02-19 高周波電力増幅器モジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008136687A Division JP2008228347A (ja) 2008-05-26 2008-05-26 高周波電力増幅器モジュール

Publications (3)

Publication Number Publication Date
JP2004289869A JP2004289869A (ja) 2004-10-14
JP2004289869A5 JP2004289869A5 (https=) 2005-10-06
JP4153898B2 true JP4153898B2 (ja) 2008-09-24

Family

ID=33297075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004150427A Expired - Fee Related JP4153898B2 (ja) 2004-05-20 2004-05-20 高周波電力増幅器モジュール

Country Status (1)

Country Link
JP (1) JP4153898B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018078686A1 (ja) * 2016-10-24 2018-05-03 三菱電機株式会社 高周波増幅器

Also Published As

Publication number Publication date
JP2004289869A (ja) 2004-10-14

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