JP4151528B2 - AlN単結晶の製造方法 - Google Patents
AlN単結晶の製造方法 Download PDFInfo
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- JP4151528B2 JP4151528B2 JP2003315653A JP2003315653A JP4151528B2 JP 4151528 B2 JP4151528 B2 JP 4151528B2 JP 2003315653 A JP2003315653 A JP 2003315653A JP 2003315653 A JP2003315653 A JP 2003315653A JP 4151528 B2 JP4151528 B2 JP 4151528B2
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- aln
- single crystal
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- 239000013078 crystal Substances 0.000 title claims description 85
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims description 44
- 229910045601 alloy Inorganic materials 0.000 claims description 40
- 239000000956 alloy Substances 0.000 claims description 40
- 239000000155 melt Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 238000002425 crystallisation Methods 0.000 claims description 16
- 230000008025 crystallization Effects 0.000 claims description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 12
- 150000002739 metals Chemical class 0.000 claims description 9
- 239000012298 atmosphere Substances 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 5
- 229910052706 scandium Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052727 yttrium Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 239000007791 liquid phase Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 100
- 239000007788 liquid Substances 0.000 description 26
- 238000010587 phase diagram Methods 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 229910002804 graphite Inorganic materials 0.000 description 9
- 239000010439 graphite Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 7
- 125000004429 atom Chemical group 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000004090 dissolution Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 229910002056 binary alloy Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000001534 heteroepitaxy Methods 0.000 description 3
- 238000005121 nitriding Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 229910018509 Al—N Inorganic materials 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000010583 slow cooling Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 241000284466 Antarctothoa delta Species 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910014291 N—Cu Inorganic materials 0.000 description 1
- QQHSIRTYSFLSRM-UHFFFAOYSA-N alumanylidynechromium Chemical compound [Al].[Cr] QQHSIRTYSFLSRM-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000005092 sublimation method Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
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- Crystals, And After-Treatments Of Crystals (AREA)
Description
0.01≦Cb/Ca≦0.1 、0.13≦Cd/Ca≦0.32、0.2 ≦Cc/(Ca+Cb)≦1
の関係を満たす組成を有するabcd系合金の融液を窒素雰囲気下で調製する。そして、窒素雰囲気下に保持したまま、このabcd系合金の融液を冷却するか、および/またはそれから前記成分aとbの少なくともいずれかを蒸発させることによって、AlN単結晶をSiC単結晶基板上に晶出させる。
0.01≦Cb/Ca≦0.1 、0.13≦Cd/Ca≦0.32、0.2 ≦Cc/(Ca+Cb)≦1。
Claims (4)
- 成分aがCr、Mn、Fe、Co、CuおよびNiから選択された1種以上の金属、成分bがSc、Ti、V、Y、ZrおよびNbから選択された1種以上の金属、成分cがAl、成分dがSiであるabcd系合金であって、成分aのモル濃度Ca、成分bのモル濃度Cb、成分cのモル濃度Ccおよび成分dのモル濃度Cdが、
0.01≦Cb/Ca≦0.1 、0.13≦Cd/Ca≦0.32、0.2 ≦Cc/(Ca+Cb)≦1
の関係を満たす組成を有するabcd系合金の融液を窒素雰囲気下で調製し、窒素雰囲気を保持したまま、前記abcd系合金の融液を冷却するか、および/またはそれから前記成分aとbの少なくともいずれかを蒸発させることによって、AlN単結晶をSiC単結晶基板上にエピタキシャルに晶出させることを特徴とする、AlN単結晶の製造方法。 - 前記AlN単結晶が晶出するときに前記abcd系合金の融液中でAlNの過飽和状態が生じている、請求項1記載のAlN単結晶の製造方法。
- 前記abcd系合金の融液の調製を、予め窒素以外の不活性雰囲気下で溶製した合金塊を窒素雰囲気下で再溶解することにより行う、請求項1または2に記載のAlN単結晶の製造方法。
- 窒素雰囲気下で調製された前記abcd系合金の融液の温度が、その合金の液相線以上かつ2000℃以下の温度であり、この融液を窒素雰囲気を保持したまま、該合金の液相線と固相線との間の所定温度まで徐冷するか、またはこの所定温度まで冷却した後その温度に等温保持する、ことによりAlN単結晶の晶出を行う、請求項1〜3のいずれかに記載のAlN単結晶の製造方法。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11427926B2 (en) | 2016-09-29 | 2022-08-30 | Lg Chem, Ltd. | Silicon-based molten composition and method for manufacturing silicon carbide single crystal using the same |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4591183B2 (ja) * | 2005-04-26 | 2010-12-01 | 住友金属工業株式会社 | AlN単結晶の製造方法 |
JP4720672B2 (ja) * | 2006-08-14 | 2011-07-13 | 住友金属工業株式会社 | 窒化アルミニウム単結晶の製造方法 |
JP4595909B2 (ja) * | 2006-08-14 | 2010-12-08 | 住友金属工業株式会社 | 窒化アルミニウム単結晶の製造方法 |
JP4933922B2 (ja) * | 2007-03-12 | 2012-05-16 | 住友電工ハードメタル株式会社 | 被覆複合焼結体、切削工具および切削方法 |
JP5896470B2 (ja) * | 2012-11-16 | 2016-03-30 | 国立大学法人名古屋大学 | AlN単結晶の製造方法 |
JP6534030B2 (ja) * | 2014-08-28 | 2019-06-26 | 国立大学法人名古屋大学 | AlN単結晶の作製方法 |
US11249234B2 (en) * | 2019-07-29 | 2022-02-15 | Moxtek, Inc. | Polarizer with composite materials |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11427926B2 (en) | 2016-09-29 | 2022-08-30 | Lg Chem, Ltd. | Silicon-based molten composition and method for manufacturing silicon carbide single crystal using the same |
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