JP4142307B2 - Component mounting method and component mounting apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a detection method, a detection apparatus, and a component mounting apparatus that detect an amount of reflected light when a position of a detection target is irradiated with an optical sensor and determine the presence or absence of the detection target according to the detection result.
[0002]
[Prior art]
Conventionally, in a component mounting device in which any one of a plurality of suction nozzles held in the nozzle replacement device is selected and attached to the component mounting head, the presence or absence of the suction nozzle held in the nozzle replacement device is detected. As a method for this, white marking has been performed on the suction nozzle, and the presence or absence of the suction nozzle has been determined by detecting the marking portion with a reflective optical sensor. In addition, when a component is mounted on a board, a NG mounting pattern on a bright-colored board is used as a method for detecting that no component mounting is performed on a pattern that is NG among a plurality of mounting patterns in the board. Whether the pattern is to be mounted by performing black marking on the NG, performing bright marking on the NG mounting pattern on the dark substrate, and detecting these marking portions with an optical sensor. I have made a judgment.
[0003]
At the time of the determination, the optical sensor that detects the presence or absence of the suction nozzle detects a white mark, and therefore requires a positive logic optical sensor. In addition, since the optical sensor for detecting the bat pattern (mark) provided on the substrate determines whether to use positive logic or negative logic depending on the type of the substrate, light that can be switched between positive logic and negative logic with a switch. Detection has been performed by using a sensor and changing the setting of the switch depending on the type of substrate.
[0004]
A specific example of the detection method in the conventional component mounting apparatus will be described below.
FIG. 14 is a side view showing a transfer head in a conventional component mounting apparatus.
The transfer head 1 is configured to be movable on the XY plane (on a plane perpendicular to the paper surface of FIG. 14) and to be able to individually lift and rotate the eight mounted component mounting heads 3a to 3h. Yes. The transfer head 1 is equipped with an optical sensor 5 for detecting a nozzle and an optical sensor 7 capable of logical switching for detecting an NG mounting pattern set on a substrate. The component mounting apparatus detects the presence or absence of the suction nozzle by detecting, using the optical sensor 5 for detecting the nozzle, the white portion of the suction nozzle housed in a nozzle exchange device (not shown) before the start of production. Check if it is the same as the nozzle setting set in the component mounting device, and if it is different, stop the error.
[0005]
After the nozzle check is completed, the transfer head 1 appropriately attaches the suction nozzle 9 to the component mounting heads 3a to 3h, detects the NG mark for each mounting pattern, and performs the mounting operation only for the determination OK pattern. . After the determination of the NG mark, the transfer head 1 moves to the component supply unit, sucks the electronic components with the component mounting heads 3a to 3h, and recognizes the suction posture of each electronic component with the component recognition unit (not shown). Then, the posture is corrected based on the recognition result, and the sucked electronic components are sequentially mounted at a predetermined mounting position of the board carried in from the loader unit and positioned at the predetermined position.
[0006]
[Problems to be solved by the invention]
However, the mounting method performed in the above-described conventional component mounting apparatus needs to include two types of optical sensors for detecting nozzles and NG mounting patterns in the transfer head. This was a factor that increased the cost of the apparatus. Further, regarding the optical sensor for detecting the NG mounting pattern, it is necessary to detect the black mark for the NG mounting pattern of the bright substrate and the bright mark for the dark substrate. When detecting a white mark, it is necessary to switch the sensor logic switch to positive logic, and when detecting a black mark, it is necessary to switch the switch to negative logic. For this reason, when the board to be produced is changed, it is necessary to change the sensor setting of the component mounting apparatus in addition to the change of the production program, the electronic component, and the cassette, thereby reducing the production workability. Furthermore, since it is rare for an operator who operates the component mounting apparatus to change settings other than the operation screen and the component set, changing the sensor settings is easy to forget, and there is a risk of lowering the production reliability. It was.
[0007]
The present invention has been made in view of the above situation, and it is necessary to reduce the cost by combining two types of optical sensors, and the operator needs to directly operate the sensor setting switch provided in the apparatus. It is an object of the present invention to provide a detection method, a detection apparatus, and a component mounting apparatus that are free from defects, thereby improving production workability and making it difficult to forget setting and improving production reliability.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, according to a first aspect of the present invention, there is provided a component mounting method according to the present invention, wherein an arbitrary one of a plurality of suction nozzles is selectively attached to a component mounting head, The component is sucked and held, transferred together with the component mounting head, and the component is mounted at a predetermined position on the substrate. On the other hand, the mark on the substrate is detected by a detection device attached to the component mounting head. A component mounting method configured to be able to change whether the component is mounted or not mounted according to the presence or absence of the component, wherein the detection device detects light Position of the mark Detects the amount of reflected light when the light is irradiated, and can be switched between a positive logic mode in which the output is turned on when the amount is greater than or equal to a predetermined amount of light and a negative logic mode in which the output is turned on when the amount of reflected light is less than the predetermined amount of light When the mark on the substrate is detected by the detection device, the detection device changes the positive logic / negative logic mode according to the brightness of the surface of the detection target registered in advance to detect the presence / absence of the mark. It is characterized by.
[0009]
this Component mounting method Thus, two types of conventionally required optical sensors for detecting a nozzle and an optical sensor for detecting a mounting pattern can be combined into one, and the number of parts can be reduced to reduce the apparatus cost. In addition, based on the brightness of the surface of the detection target registered in advance, it becomes possible to switch between positive logic and negative logic by operation on the operation screen, and it is not necessary for the operator to directly operate the switch of the device and change the sensor setting. Forgetting to set is less likely to occur, improving production reliability.
[0010]
The component mounting apparatus according to claim 2, wherein an arbitrary one of a plurality of suction nozzles is selectively attached to the component mounting head, and the component is sucked and held by the attached suction nozzle. The component is mounted and mounted at a predetermined position on the substrate, while the detection device attached to the component mounting head detects the mark on the substrate and mounts or mounts the component according to the presence or absence of the mark. A component mounting apparatus configured to be able to change whether or not the detection device is a light detection target Position of the mark The amount of reflected light when the light is irradiated is detected, and a positive logic mode in which the output is turned on when the amount of light is greater than or equal to a predetermined amount of light and a negative logic mode in which the output is turned on when the amount of reflected light is less than the predetermined amount of light can be switched One photosensor and a sensor control unit connected to the photosensor are configured to switch between the positive logic mode and the negative logic mode of the photosensor and determine the presence or absence of the detection target according to the detection result, When the mark on the substrate is detected by the detection device, the sensor control unit changes the positive logic / negative logic mode for the optical sensor according to the brightness of the surface of the detection target registered in advance. The presence or absence of a mark is detected.
[0011]
this Component mounting equipment Then, by providing an optical sensor capable of logical switching by remote operation from the sensor control unit, a positive logic or negative logic switching signal is sent from the sensor control unit to the optical sensor according to the brightness of the detection target registered in advance. Thus, the determination process between the positive logic and the negative logic according to the detection target can be performed in a lump with an optical sensor that operates according to any one of the logics.
[0012]
The component mounting apparatus according to claim 3, wherein an arbitrary one of a plurality of suction nozzles is selectively attached to the component mounting head, and the component is sucked and held by the attached suction nozzle, thereby the component mounting head. The component is mounted and mounted at a predetermined position on the substrate, while the detection device attached to the component mounting head detects the mark on the substrate and mounts or mounts the component according to the presence or absence of the mark. A component mounting apparatus configured to be able to change whether or not the detection device is a light detection target Position of the mark And a sensor control unit connected to the photosensor, which detects an amount of reflected light when the light is irradiated and outputs an on / off signal corresponding to the amount of the reflected light, and the detection device When detecting a mark on the substrate by the positive logic, the sensor control unit determines the presence of the detection target by an ON signal from the optical sensor according to the brightness of the surface of the detection target registered in advance. And the presence / absence of the mark is determined by switching between a negative logic for determining the presence of the detection target by an OFF signal from the optical sensor.
[0013]
this Component mounting equipment Then, instead of switching the logic of the optical sensor, the signal received from the optical sensor is switched according to the brightness of the detection target registered in advance and switched between when it is inverted by the sensor control unit and when it is not inverted. Even when an optical sensor that can be logically switched by remote operation is not used, switching between positive logic and negative logic according to a detection target can be performed by one optical sensor.
[0014]
According to a fourth aspect of the present invention, there is provided the component mounting apparatus according to the second or third aspect, and the presence / absence of the suction nozzle set in the nozzle change unit by setting positive logic or negative logic in the detection apparatus. And the detected suction nozzle is attached to the component mounting head, and on the substrate by the detection device. mark Detected mark And a control device that performs control so that mounting of the component is not performed.
[0015]
In this component mounting apparatus, the detection device according to claim 2 or claim 3 is provided, the presence or absence of the suction nozzle and the NG mark on the substrate are detected by the detection device, and the control device is based on the detection result, The suction nozzle is attached to the component mounting head, and control is performed so that the component is not mounted when an NG mark is detected. In other words, conventionally, it is possible to perform the determination of the presence / absence of the suction nozzle and the determination of whether or not to mount the components with one optical sensor, which conventionally required two types of optical sensors.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a detection method, a detection apparatus, and a component mounting apparatus according to the present invention will be described in detail with reference to the drawings.
1 is a perspective view showing a schematic configuration of a component mounting apparatus according to the present invention, FIG. 2 is a side view of the transfer head of FIG. 1, FIG. 3 is an operation explanatory view of the transfer head, and FIG. 4 is shown in FIG. It is a block diagram showing the control system of the mounted component mounting apparatus.
[0017]
As shown in FIG. 1, a transport unit including a pair of guide rails 39 is provided on the base of the component mounting apparatus 100 across the loader unit 33, the board holding unit 35, and the unloader unit 37. The circuit board 41 is conveyed from the loader unit 33 on one end side to the substrate holding unit 35 and the unloader unit 37 on the other end side by the synchronous drive of the conveyance belt provided on the guide rail 39.
[0018]
Y-axis robots 43 and 43 are provided on the base, and an X-axis robot 45 is suspended between the two Y-axis robots 43 and 43, and the X-axis robot 45 is driven by the Y-axis robots 43 and 43. Can advance and retreat in the Y-axis direction. In addition, a transfer head 47 is attached to the X-axis robot 45 so that the transfer head 47 can move back and forth in the X-axis direction, thereby enabling the transfer head 47 to move in the XY plane. ing.
[0019]
The transfer head 47 mounted on the XY robot 49 including the X-axis robot 45 and the Y-axis robots 43 and 43 and freely moving on the XY plane is supplied with electronic components such as a resistor chip and a chip capacitor. A desired electronic component is sucked from the component supply unit 59 via the suction nozzle 52 shown in FIG. 2 attached to the component mounting head 51 and can be mounted at the component mounting position of the circuit board 41. Such an electronic component mounting operation is controlled based on a preset mounting program.
[0020]
An optical sensor 53 is mounted on the transfer head 47, and the optical sensor 53 detects a reflected light amount of light irradiated to a position to be detected. A sensor control unit, which will be described later, is connected to the optical sensor 53, and the sensor control unit determines the presence or absence of a detection target according to the detection result from the optical sensor 53. The optical sensor 53 is positioned at an arbitrary position together with the transfer head 47 moved by the XY robot 49, and the mark of the suction nozzle 52 that is the detection target, and the production management mark (position correction mark) of the circuit board 41 that is also the detection target. Mark, NG mark, etc.).
[0021]
In addition, on the side of the guide rail 39, a two-dimensional positional shift (suction posture) of the electronic component sucked by the component mounting head 51 is detected, and the quality of the electronic component sucked by the component mounting head 51 ( For example, a component recognition sensor 57 for determining a defect such as a bent lead) is provided. The detected displacement is used to generate data to be corrected on the transfer head 47 side so as to be canceled at the time of mounting. The component recognition sensor 57 is arranged below the head movement path, and a plurality of components are held by suction by the component mounting head 51 during high-speed movement from the component supply unit 59 to the mounting position without stopping the transfer head 47. The electronic parts are imaged at once.
[0022]
As shown in FIG. 2, the transfer head 47 is configured as a multiple head in which a plurality (eight in the illustrated example) of component mounting heads 51 are connected side by side. Each transfer head 47 holds the suction nozzle 52 in a replaceable manner, and the nozzle replacement of the transfer head 47 is performed by a nozzle change unit 61 provided on the side of the guide rail 39. The transfer head 47 moves the component mounting head 51 up and down by an actuator such as an air cylinder, and the nozzle change unit 61 detects the presence or absence of the suction nozzle 52 using an optical sensor 53 as will be described in detail later. 52 is exchanged.
[0023]
When the circuit board 41 carried in from the loader unit 33 is transported to a predetermined mounting position, the transfer head 47 is moved in the XY plane by the XY robot 49 and, as shown in FIG. The electronic parts are picked up, moved onto the part recognition sensor 57, and the picked-up state of the electronic parts is confirmed, and the pass / fail judgment and the correction operation are performed. Thereafter, electronic components are mounted at predetermined positions on the circuit board 41. At this time, the transfer head 47 detects the mark attached to the circuit board 41 by using the optical sensor 53 as will be described in detail later, and mounts the electronic component while determining whether the pattern is mountable. To do.
[0024]
In this way, the component mounting apparatus 100 completes the mounting of the electronic component on the circuit board 41 by repeating the adsorption of the electronic component and the mounting on the circuit board 41. The component mounting apparatus 100 unloads the circuit board 41 that has been mounted from the mounting position to the unloader unit 37, loads the new circuit board 41 into the loader unit 33, and repeats the above operation.
[0025]
A component mounting apparatus 100 having a basic operation function for mounting the electronic component has a control device 65 shown in FIG. A loader unit 33, a substrate holding unit 35, an unloader unit 37, an XY robot 49, a component supply unit 59, and a component recognition sensor 57 are connected to the control device 65. Further, a database unit 71, a transfer head 47, and a notification device 73 are connected to the control device 65. The database unit 71 has a component library 75, an NC program 77, substrate data 79, and nozzle data 81. Yes.
[0026]
The component mounting head 51, the detection device 83, and the like are connected to the transfer head 47. The detection device 83 is connected to the optical sensor 53 and the sensor control unit 85. The optical sensor 53 has a positive logic mode for changing the output from the OFF state to the ON state when the reflected light from the detection target is greater than or equal to a predetermined light amount, and the output from the OFF state to the ON state when the reflected light from the detection target is less than the predetermined light amount. The negative logic mode to be changed can be switched freely. The sensor control unit 85 can send a signal for changing the positive logic / negative logic mode to the optical sensor 53 according to the brightness of the surface of the detection target registered in advance in the database unit 71.
[0027]
The notification device 73 is configured to issue an alarm or display a message on the display device when the nozzle change unit 61 cannot detect the suction nozzle 52 or when the production control mark cannot be detected.
[0028]
Further, a display device (not shown) for operation is mounted on the component mounting apparatus 100 or is connected separately, and the operating condition setting screen 86 shown in FIG. 5 is displayed on the display device. ing. This setting screen is provided with setting items 87 for determination mark detection determination conditions. In this setting item 87, the above-described positive logic mode and negative logic mode are set to the light sensor ON button 89 and the light sensor OFF button 91, respectively. Switching can be set by selecting.
[0029]
Next, the operation of the component mounting apparatus configured as described above will be described in detail focusing on the operation of the detection apparatus.
FIG. 6 is a perspective view showing the state of detection of the suction nozzle by the optical sensor, and FIG. 7 is an enlarged perspective view of the suction nozzle. When the production starts, when the component mounting apparatus 100 performs nozzle detection, the control device 65 first places the transfer head 47 at the position of the suction nozzle 52 installed in the nozzle change unit 61 as shown in FIG. It moves and checks the consistency between the nozzle position recorded in the nozzle data 81 and the nozzle position actually set in the nozzle change unit 61. As a nozzle presence check method, as shown in FIG. 7, a white-marked portion 52a of the suction nozzle 52 is detected by the optical sensor 53 installed in the transfer head 47, and the optical sensor 53 is in an ON state. When there is a nozzle, it is determined that there is no nozzle when the optical sensor 53 is in the OFF state. Here, since the optical sensor used at the time of the nozzle presence / absence check needs a positive logic optical sensor, the logic switching signal from the sensor control unit 85 is turned OFF, and the optical sensor 53 is used as the positive logic optical sensor. In this embodiment, as shown in FIG. 7, the marking portion of the suction nozzle 52 is replaced with a white filter 52a for removing foreign matter provided in the suction air conduit.
[0030]
Next, the conditions that the sensor control unit 85 determines when detecting the nozzle will be described in more detail with reference to FIG. FIG. 8 is an explanatory diagram showing a determination state of the presence or absence of the suction nozzle by the control unit.
When the suction nozzle 52 is present at the detection position, the detection target is a bright color (white), the amount of reflected light increases, the sensor output is turned on, and the sensor control unit 85 determines that the suction nozzle is present. Further, when the suction nozzle 52 is not present, since the detection target does not exist at the detection position, the amount of reflected light is reduced, the optical sensor output is turned off, and the sensor control unit 85 determines that there is no suction nozzle.
[0031]
Here, if there is a difference between the nozzle position data recorded in the nozzle data 81 and the nozzle position stored in the nozzle change unit 61, the component mounting apparatus 100 stops the error and issues a warning by the notification apparatus 73. , Stop without continuing the subsequent processing. On the other hand, when the nozzle presence / absence check ends normally, the component mounting apparatus 100 carries the circuit board 41 from the loader unit 33 and positions it at a predetermined position.
[0032]
Next, it is determined whether or not the loaded substrate has an NG mark. Specifically, depending on the circuit board 41 to be mounted, there is a case where a multi-sided board is divided into a plurality of patterns in the circuit board 41 and mounting is not performed on any of the patterns due to a substrate crack or the like. In such a case, as shown in the perspective view of the mark detection status by the optical sensor in FIG. 9, an NG mark 93 indicating that the pattern is an NG pattern is attached to the circuit board 41, and this NG mark 93 is attached. Perform detection processing.
Here, FIG. 10 is an explanatory diagram showing the determination status of the mark of the sensor control unit on the dark substrate, and FIG. 11 is an explanatory diagram showing the determination status of the mark of the sensor control unit on the bright substrate. is there.
The NG mark 93 is marked with a bright mark 93a (see FIG. 10) for the NG mounting pattern of the dark circuit board 41 and with a black color for the NG pattern of the bright circuit board 41. The mark 93b (see FIG. 11) is attached.
[0033]
Here, the bright color is a color having a relatively high brightness with respect to the surface color of the circuit board 41, and the dark color is a color having a relatively low brightness with respect to the surface color of the circuit board 41. The greater the difference in brightness, the easier the detection. Note that the saturation is not particularly meaningful in the present invention, but the circuit board 41 is actually managed by color, so in this specification, the determination by brightness is described as determination by color. Yes.
[0034]
In the present embodiment, the NG mark is detected using a negative logic photosensor for the bright circuit board 41 and a positive logic photosensor for the dark circuit board 41. Here, since the optical sensor 53 capable of switching the logic mode by the logic switching signal is used, the logic switching signal is transmitted from the sensor control unit 85 to the optical sensor 53, so that the single optical sensor 53 is obtained. Both detection methods of positive logic detection and negative logic detection can be selectively designated.
[0035]
That is, since the color (brightness) of the NG mark 93 to be detected is changed depending on the color of the circuit board 41, the mark detection of the NG pattern on the circuit board 41 is detected based on the color of the circuit board 41. Determine whether to detect with negative logic. Therefore, whether to detect the mark 93 with positive logic or the negative logic with the color of the circuit board 41 is set in advance on the setting screen 86.
[0036]
For example, as shown in FIG. 10, since the detection of the mark 93a set on the dark circuit board 41 is detection of the bright mark 93a, the sensor switching signal is set to ON, and as shown in FIG. The detection of the set mark 93b sets the sensor switching signal to OFF. As another method, a method is used in which substrate color data is set in the substrate data 79 for inputting the substrate size and the like, and the sensor logic to be used is automatically set according to the input substrate color. Also good.
The component mounting apparatus 100 performs the mounting process only for the normal pattern determined to be OK by the mark determination, and after the normal pattern mounting process is completed, the next circuit board 41 is produced.
[0037]
Next, a procedure when both positive logic and negative logic can be detected by transmitting a logic switching signal from the sensor control unit 85 to the optical sensor 53 will be described.
As shown in FIG. 10, when the dark circuit board 41 is produced, the color used for the NG mark 93 is a bright color. Therefore, the sensor switching signal (logic switching flag) is output as OFF, and the positive logic Used as a sensor. Therefore, when the NG mark 93a is detected, the optical sensor is turned on, the sensor control unit 85 determines that it is an NG mark, and the control device 65 does not mount a pattern corresponding to the NG mark. When the optical sensor is turned off, the NG mark 93a is not detected, so the control device 65 mounts the corresponding pattern.
[0038]
As shown in FIG. 11, when the bright circuit board 41 is produced, the color used for the NG mark 93b is a dark color, so the sensor switching signal is output as ON and used as a negative logic sensor. Therefore, when the NG mark 93b is detected, the amount of reflected light is small, but the optical sensor is turned on. The sensor control unit 85 determines this as the NG mark 93b, and the control device 65 mounts a pattern corresponding to the NG mark 93b. Do not do. When the amount of reflected light is large and the optical sensor is turned off, the NG mark 93b is not detected, and the control device 65 mounts the corresponding pattern.
[0039]
As described above, according to the detection method according to the present embodiment, the two types of conventionally required optical sensors for detecting the nozzle and the optical sensor for detecting the mounting pattern can be combined into one, and the number of parts can be reduced. It is possible to reduce the device cost by reducing the number of devices. Further, based on the brightness of the surface of the detection target registered in advance, the positive logic and the negative logic can be easily switched by the operation of the setting screen 86, and the operator directly operates the device switch to change the sensor setting. This eliminates the need for forgetting to set and improves production reliability.
[0040]
In addition, according to the detection device 83 of the component mounting apparatus 100, by providing the optical sensor 53 that can be logically switched by remote operation from the sensor control unit 85, positive logic or negative depending on the brightness of the detection target registered in advance. By transmitting a logic switching signal from the sensor control unit 85 to the optical sensor 53, a single optical sensor 53 can be configured with a logical setting suitable for the detection target.
[0041]
Next, another embodiment of the detection apparatus according to the present invention will be described. In addition, the same code | symbol is attached | subjected to the member same as the member shown in FIGS. 1-11, and the overlapping description shall be abbreviate | omitted.
In the detection apparatus according to the present embodiment, the optical sensor includes one optical sensor that outputs an on / off signal corresponding to the amount of reflected light to the sensor control unit. The optical sensor used in this embodiment may not be switchable between the positive logic mode and the negative logic mode. That is, any one of a positive logic optical sensor and a negative logic optical sensor may be used (in this embodiment, a positive logic optical sensor is used). However, the sensor control unit has a positive logic that determines whether the detection target is present by the ON signal from the optical sensor and the presence of the detection target by the OFF signal from the optical sensor, based on the brightness of the surface of the detection target registered in advance. It can be determined by switching between negative logic for determining. Other configurations are the same as those of the detection device 83 described above.
[0042]
FIG. 12 is a flowchart showing the operation procedure of the detection apparatus. Hereinafter, description will be given based on this flowchart. In the detection method using the detection apparatus according to the present embodiment, first, it is determined whether the operation performed by the component mounting apparatus 100 is a nozzle presence check or an NG mark determination (step 1, hereinafter abbreviated as S1). . If it is a nozzle presence check, the logic inversion flag is set to OFF, and the logic inversion in the sensor control unit 85 is not performed (S2).
[0043]
When the operation performed by the component mounting apparatus 100 is the determination of the NG mark 93, it is determined whether or not the logical determination is made based on the color of the circuit board 41 to be detected or the preset setting of whether to invert the logic I do. When the bright circuit board 41 is produced, or when the logic judgment set in the data is OFF, the process proceeds to S2 and the logic inversion is not performed. When the dark color circuit board 41 is produced, or when the logic judgment set in the data is ON, the process proceeds to S4 and the logic is inverted (S3).
[0044]
In S4, the logic inversion flag is turned ON and the logic inversion in the sensor control unit 85 is performed. When the logic inversion flag is ON, the sensor control unit 85 inverts the signal received from the optical sensor 53. The above process is repeated for each circuit board 41.
[0045]
That is, when the dark circuit board 41 is produced, a bright color is used for the NG mark, so that the logic inversion of the sensor control unit 85 is not performed. The optical sensor 53 is turned on when the NG mark 93 is detected (the amount of reflected light is large). When receiving the ON signal, the sensor control unit 85 determines that an NG mark exists (positive logic), and the control device 65 does not mount a pattern corresponding to the NG mark. When the optical sensor is in the OFF state (the amount of reflected light is small), it is determined that the NG mark is not detected, and the control device 65 mounts the corresponding pattern.
[0046]
Further, when producing a bright circuit board 41, a dark color is used for the NG mark 93, so that the logic of the sensor control unit 85 is inverted. The optical sensor 53 is turned off when the NG mark 93 is detected (the amount of reflected light is small). However, since the sensor control unit 85 is set to be logically inverted, it is interpreted as an ON state. That is, the sensor control unit 85 receives the OFF signal and determines that an NG mark exists, and the control device 65 does not mount a pattern corresponding to the NG mark. When the optical sensor 53 is turned on (the amount of reflected light is large), the sensor control unit 85 is set to be logically inverted, so it is determined that the NG mark 93 has not been detected, and the control device 65 corresponds to the corresponding pattern. Is implemented.
As described above, whether to invert the sensor logic or invert the logic in the sensor control unit according to the substrate color is set, and the sensor logic is switched.
[0047]
According to the detection device according to the present embodiment, instead of switching the logic of the optical sensor 53, the signal received from the optical sensor 53 is inverted by the sensor control unit 85 according to the brightness of the detection target registered in advance. Even when not using an optical sensor that can be logically switched by remote operation by switching to the case of non-inversion, the determination process between the positive logic and the negative logic suitable for the detection target is any one of the logics. It becomes possible to do with the optical sensor.
[0048]
In the above-described embodiment, the example in which the suction nozzle 52 is detected by detecting the filter 52a is shown. However, the filter 52a becomes dirty as the usage time elapses, and as shown in FIG. 13, the brightness level decreases with time. For this reason, the lightness level to be lowered is set in stages (level 1, level 2... Level n), and for example, when the lightness of level 2 is detected, an alarm or message is issued from the notification device 73. You may comprise. With such a configuration, it is possible to grasp the replacement time of the filter 52a itself, reduce maintenance work, and the filter 52a becomes dirty and cannot be detected by the optical sensor 53. It is possible to prevent erroneous detection with and without a nozzle that is detected as having no suction nozzle.
[0049]
【The invention's effect】
As explained in detail above, according to the present invention Component mounting method and component mounting apparatus According to the above, a positive logic that turns on the output of the optical sensor when the reflected light is greater than or equal to a predetermined amount of light and a negative logic that turns on the output of the optical sensor when the reflected light is less than the predetermined amount of light are registered in advance. Since the detection is performed by one light sensor by switching according to the brightness of the surface to be detected, conventionally, the two types of nozzle detection light sensor and mounting pattern detection light sensor can be combined, The device cost can be reduced by reducing the number of parts.
In addition, since positive logic and negative logic can be switched by operation on the operation screen based on the brightness of the detection target surface registered in advance, there is no need to change the optical sensor setting by directly operating the switch on the device. It is possible to improve the reliability of production.
[0050]
Further, according to the component mounting apparatus of the present invention, the above-described detection device is provided, the presence or absence of the suction nozzle and the NG mark on the substrate are detected by this detection device, and based on the detection result, the control device The nozzle is attached to the component mounting head, and the component is controlled not to be mounted when an NG mark is detected. In other words, conventionally, it is possible to perform the determination of the presence / absence of the suction nozzle and the determination of whether or not to mount the components with one optical sensor, which conventionally required two types of optical sensors.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a schematic configuration of a component mounting apparatus according to the present invention.
FIG. 2 is a side view of the transfer head of FIG.
FIG. 3 is an operation explanatory diagram of a transfer head.
4 is a block diagram showing a control system of the component mounting apparatus shown in FIG.
FIG. 5 is an explanatory diagram of an operation screen of the component mounting apparatus shown in FIG. 1;
FIG. 6 is a perspective view showing a state of detection of the suction nozzle by the optical sensor.
FIG. 7 is an enlarged perspective view of a suction nozzle.
FIG. 8 is an explanatory diagram showing a determination state of the presence or absence of a suction nozzle by a sensor control unit.
FIG. 9 is a perspective view showing a mark detection situation by an optical sensor.
FIG. 10 is an explanatory diagram showing a determination state of the presence / absence of a mark by a sensor control unit on a dark substrate.
FIG. 11 is an explanatory diagram showing a determination status of the presence / absence of a mark by a sensor control unit on a bright substrate.
FIG. 12 is a flowchart showing an operation procedure of the detection apparatus.
FIG. 13 is an explanatory diagram showing a difference in filter brightness of the suction nozzle.
FIG. 14 is a side view of a transfer head in a conventional component mounting apparatus.
[Explanation of symbols]
41 ... Circuit board
51. Component mounting head
52 ... Suction nozzle
52a ... Filter (detection target)
53 ... Optical sensor
65 ... Control device
83. Detection device
85 ... Sensor control unit
93 ... mark (detection target)
100: Component mounting apparatus

Claims (4)

An arbitrary one of a plurality of suction nozzles is selectively attached to the component mounting head, the components are sucked and held by the attached suction nozzle, and the component mounting head is transferred to a predetermined position on the substrate. While mounting a component, the component mounting is configured such that a mark on the substrate is detected by a detection device attached to the component mounting head, and whether the component is mounted or not can be changed according to the presence or absence of the mark A method,
The detection device detects a reflected light amount when light is irradiated to the position of the mark to be detected, and outputs a positive logic mode in which the output is turned on when the light amount is equal to or greater than a predetermined light amount, and the reflected light amount is less than the predetermined light amount. Switchable between negative logic mode to turn on
When the mark on the substrate is detected by the detection device, the detection device detects the presence or absence of the mark by changing the positive logic / negative logic mode according to the brightness of the surface of the detection target registered in advance. A characteristic component mounting method. An arbitrary one of a plurality of suction nozzles is selectively attached to the component mounting head, the components are sucked and held by the attached suction nozzle, and the component mounting head is transferred to a predetermined position on the substrate. While mounting a component, the component mounting is configured such that a mark on the substrate is detected by a detection device attached to the component mounting head, and whether the component is mounted or not can be changed according to the presence or absence of the mark A device,
The detection device detects a reflected light amount when light is irradiated to the position of the mark to be detected, and outputs a positive logic mode in which the output is turned on when the light amount is equal to or greater than a predetermined light amount, and the reflected light amount is less than the predetermined light amount. One photosensor configured to be able to switch between a negative logic mode for turning on the sensor and a sensor control unit connected to the photosensor to switch the positive logic mode and the negative logic mode of the photosensor to the detection result Accordingly, the sensor control unit is configured to determine the presence or absence of the detection target, and the sensor control unit detects the light according to the brightness of the surface of the detection target registered in advance when the detection device detects a mark on the substrate. A component mounting apparatus, wherein the presence or absence of the mark is detected by changing a positive logic / negative logic mode with respect to a sensor. An arbitrary one of a plurality of suction nozzles is selectively attached to the component mounting head, the components are sucked and held by the attached suction nozzle, and the component mounting head is transferred to a predetermined position on the substrate. While mounting a component, the component mounting is configured such that a mark on the substrate is detected by a detection device attached to the component mounting head, and whether the component is mounted or not can be changed according to the presence or absence of the mark A device,
The detection device detects a reflected light amount when irradiating the position of the mark to be detected, and outputs an on / off signal corresponding to the reflected light amount; and the optical sensor And a sensor control unit connected to
When the mark on the substrate is detected by the detection device, the sensor control unit determines that the detection target is present by an ON signal from the optical sensor according to the brightness of the surface of the detection target registered in advance. A component mounting apparatus, wherein the presence / absence of the mark is determined by switching between a positive logic to be detected and a negative logic for determining that the detection target is present based on an OFF signal from the optical sensor. The component mounting apparatus according to claim 2 or claim 3,
Detecting the presence or absence of the suction nozzle set in the nozzle change unit by setting positive logic or negative logic in the detection device, attaching the detected suction nozzle to the component mounting head, and A component mounting apparatus comprising: a control device that detects a mark on a substrate and controls not to mount the component when the mark is detected.

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