JP4133475B2 - Manufacturing method of liquid crystal display panel - Google Patents

Manufacturing method of liquid crystal display panel Download PDF

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Publication number
JP4133475B2
JP4133475B2 JP2003069419A JP2003069419A JP4133475B2 JP 4133475 B2 JP4133475 B2 JP 4133475B2 JP 2003069419 A JP2003069419 A JP 2003069419A JP 2003069419 A JP2003069419 A JP 2003069419A JP 4133475 B2 JP4133475 B2 JP 4133475B2
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mother
silicon substrate
glass substrate
liquid crystal
image display
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Expired - Fee Related
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JP2003069419A
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JP2004279630A (en
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正人 半田
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シチズンミヨタ株式会社
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Description

【0001】
【発明の属する技術分野】
本発明は液晶表示パネルの製造方法に関するものである。
【0002】
【従来の技術】
液晶表示装置は2枚のマザー基板の一方に複数個の画像表示領域駆動電極を形成し、もう一方のマザー基板に該画像表示領域に対応する共通電極を形成した後、各画像表示領域毎にシール部材を設けて両マザー基板を位置合わせして貼付し、その後個々の画像表示領域に分割する製造方法がある。個々に分割されたものを液晶表示パネルといい、シール部材の一部に形成された液晶注入口から液晶を注入し、液晶注入口を封口することで液晶表示パネルが完成する。
【0003】
2枚のマザー基板の組み合わせはいろいろあるが、ガラス基板とガラス基板、シリコン基板とガラス基板、プラスチック基板とプラスチック基板等が使用されており、本発明はシリコン基板とガラス基板の組み合わせによる液晶表示パネルの製造方法に関するものである。
【0004】
マザーシリコン基板には複数の画像表示領域が形成され、マザーガラス基板にはマザーシリコン基板に形成された画像表示領域に対応する領域に共通電極が形成される。マザーシリコン基板またはマザーガラス基板の各画像表示領域外周に液晶注入口を形成してシール部材が設けられ、マザーシリコン基板とマザーガラス基板は貼付される。その後個々の液晶表示パネルに分断されるのは前述の通りである。
【0005】
シリコン基板はスクライブでの分割が困難なため、ダイシング法が用いられている。ガラス基板はスクライブによる分割が可能であり、安価なスクライブ法が採用されていた。最初にマザーシリコン基板をダイシングしてブレークし、次にマザーガラス基板をスクライブしてブレークしている。シリコン基板とガラス基板を貼り合わせ、ガラス基板をダイシングし、次にシリコン基板をダイシングし、洗浄・乾燥後個別の液晶表示パネルに分割する液晶表示装置の製造方法が開示されている。(例えば、特許文献1)
【0006】
【特許文献1】
特開平7−248477号公報(第4−5頁、図3)
【0007】
【発明が解決しようとする課題】
ガラス基板をスクライブ法により分割すると、スクライブされたガラスのエッジ部からのチッピングが発生し、ガラス面を傷つけたり後工程でのマテハンの不安定要素となっていた。また、個々の液晶表示パネルに分割する際衝撃を加えるため、シリコン基板に形成された素子が破損することがある。ガラス基板をダイシング法で分割する場合も、ディスク状の砥石を回転させて分割ラインを形成するので切断部の形状がU状となり、分割する際にも衝撃を加えるのでスクライブと同様の問題が発生していた。
【0008】
本発明はマザーガラス基板やマザーシリコン基板の分割の際に発生するチッピングを防止し、チッピングによるガラスの傷発生防止や後工程のマテハンを安定化させることを目的としている。同時にシリコン基板に形成してある素子の破損を防止することを目的としている。
【0009】
【課題を解決するための手段】
少なくとも、複数の画像表示領域を形成したマザーシリコン基板と該マザーシリコン基板に対応するマザーガラス基板を各画像表示領域毎にシール部材を設けて貼付する工程と、各画像表示領域毎にマザーシリコン基板とマザーガラス基板を分割する工程を有する液晶表示パネルの製造方法において、マザーガラス基板はV溝状にダイシングしてからさらにV溝底部をスクライブして分割する液晶表示パネルの製造方法とする。
【0010】
少なくとも、複数の画像表示領域を形成したマザーシリコン基板と該マザーシリコン基板に対応するマザーガラス基板を各画像表示領域毎にシール部材を設けて貼付する工程と、各画像表示領域毎にマザーシリコン基板とマザーガラス基板を分割する工程を有する液晶表示パネルの製造方法において、マザーガラス基板およびマザーシリコン基板はV溝状にダイシングしてからさらにV溝底部をスクライブして分割する液晶表示パネルの製造方法とする。
【0011】
【発明の実施の形態】
図1はマザーシリコン基板の画像表示領域の外周にシール部材を塗布した上面図であり、図2はマザーシリコン基板とマザーガラス基板を貼付した側面図である。マザーシリコン基板1に複数個形成された画像表示領域2の外周に液晶注入口3を残してシール部材4をスクリーン印刷等で塗布し、マザーガラス基板5を貼付し、シール部材を硬化させる。
【0012】
図3は本発明を説明するための図であり、マザーガラス基板にV字状のダイシングをした断面図である。従来、ダイシングはディスク状の薄い砥石を使用してダイシングライン(断面形状はU)を形成していたが、本発明ではダイシングラインの断面形状がV字状になるようにした。例えば厚さ700μmのガラス基板に対しVの開き角が90度になるような溝深さ70μmのダイシングライン6を形成する。
【0013】
図4は本発明を説明するための図であり、V字状溝底部をスクライブしている断面図である。ダイシングライン6のV字状溝底部にスクライブの刃先7を合わせて(この時スクライブの刃先角はV溝の開口角より小さい角度であることは言うまでもない)スクライブする。スクライブの圧力により、マザーガラス基板5は残肉部がライン8で分割される。マザーガラス基板5から分割するかマザーシリコン基板1から分割するかは単なる選択であるが、図4の状態では、マザーシリコン基板1は従来技術によりダイシングされた状態であるため、まだ分割されていないので、マザーガラス基板5が分割されてもばらばらになることはない。しかし、マザーガラス基板5をスクライブする前にマザーシリコン基板1をダイシングしておかねばならない。マザーシリコン基板1を先に分割する場合は、その前にマザーガラス基板5をダイシングしておくことも同様である。これはダイシングでは冷却液を使用するので、分割すると冷却液が液晶注入口から液晶表示パネルの中に侵入してしまうからである。
【0014】
図5は分割して完成した液晶表示パネルの断面図である。ガラス基板5の角はダイシングにより面取り状態となっていて、チッピングの発生を防止できている。
【0015】
図6は請求項2記載の発明の製造方法により完成した液晶表示パネルの断面図である。ガラス基板5、シリコン基板1共V溝状にダイシングしてあるので面取り効果があると共に、それぞれV溝状底部をスクライブして分割することにより、分割時の衝撃が必要なくなり、シリコン基板1に形成された素子を破壊することがない。
【0016】
【発明の効果】
本発明によるとダイシングした面が面取り面となるため、角部に発生するチッピングが防止され、ガラス傷の発生が防止できる。よって後工程でのマテハンも楽にできるようになる。
【0017】
本発明によると分割するための衝撃が必要なくなり、シリコン基板に形成されている素子の破損を防止でき、製造歩留りを上げることができ、液晶表示パネルを安価に提供することができる。
【図面の簡単な説明】
【図1】マザーシリコン基板の画像表示領域の外周にシール部材を塗布した上面図
【図2】マザーシリコン基板とマザーガラス基板を貼付した側面図
【図3】本発明を説明するための図であり、マザーガラス基板にV字状のダイシングをした断面図
【図4】本発明を説明するための図であり、V字状溝底部をスクライブしている断面図
【図5】分割して完成した液晶表示パネルの断面図
【図6】請求項2記載の発明の製造方法により完成した液晶表示パネルの断面図
【符号の説明】
1 マザーシリコン基板
2 画像表示領域
3 液晶注入口
4 シール部材
5 マザーガラス基板
6 V溝
7 スクライブ刃先
8 分割ライン
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a liquid crystal display panel.
[0002]
[Prior art]
In the liquid crystal display device, a plurality of image display region driving electrodes are formed on one of two mother substrates, and a common electrode corresponding to the image display region is formed on the other mother substrate. There is a manufacturing method in which a seal member is provided, both mother substrates are aligned and pasted, and then divided into individual image display areas. Individually divided ones are referred to as a liquid crystal display panel, and liquid crystal is injected from a liquid crystal injection port formed in a part of the sealing member, and the liquid crystal injection port is sealed to complete the liquid crystal display panel.
[0003]
There are various combinations of two mother substrates, but a glass substrate and a glass substrate, a silicon substrate and a glass substrate, a plastic substrate and a plastic substrate, etc. are used. The present invention is a liquid crystal display panel using a combination of a silicon substrate and a glass substrate. It is related with the manufacturing method.
[0004]
A plurality of image display regions are formed on the mother silicon substrate, and a common electrode is formed on the mother glass substrate in a region corresponding to the image display region formed on the mother silicon substrate. A liquid crystal injection port is formed in the outer periphery of each image display area of the mother silicon substrate or the mother glass substrate, and a seal member is provided, and the mother silicon substrate and the mother glass substrate are attached. After that, it is divided into individual liquid crystal display panels as described above.
[0005]
Since a silicon substrate is difficult to be divided by scribe, a dicing method is used. The glass substrate can be divided by scribing, and an inexpensive scribing method has been adopted. First, the mother silicon substrate is diced to break, and then the mother glass substrate is scribed to break. A manufacturing method of a liquid crystal display device is disclosed in which a silicon substrate and a glass substrate are bonded together, the glass substrate is diced, then the silicon substrate is diced, and after cleaning and drying, the liquid crystal display device is divided into individual liquid crystal display panels. (For example, Patent Document 1)
[0006]
[Patent Document 1]
Japanese Patent Laid-Open No. 7-248477 (page 4-5, FIG. 3)
[0007]
[Problems to be solved by the invention]
When the glass substrate is divided by the scribing method, chipping from the edge portion of the scribed glass occurs, which damages the glass surface or becomes an unstable element of material handling in the subsequent process. Further, since an impact is applied when the liquid crystal display panels are divided, the elements formed on the silicon substrate may be damaged. Even when the glass substrate is divided by the dicing method, the disc-shaped grindstone is rotated to form the dividing line, so the shape of the cutting part becomes U-shaped, and the same problem as scribe occurs because an impact is also applied when dividing. Was.
[0008]
An object of the present invention is to prevent chipping that occurs when a mother glass substrate or a mother silicon substrate is divided, to prevent damage to the glass due to chipping, and to stabilize material handling in the subsequent process. At the same time, the object is to prevent damage to the elements formed on the silicon substrate.
[0009]
[Means for Solving the Problems]
At least a mother silicon substrate having a plurality of image display areas formed thereon and a mother glass substrate corresponding to the mother silicon substrate provided with a seal member for each image display area, and a mother silicon substrate for each image display area In the method of manufacturing a liquid crystal display panel having a step of dividing the mother glass substrate, the mother glass substrate is diced into a V-groove shape, and then the bottom of the V-groove is scribed to divide the liquid crystal display panel.
[0010]
At least a mother silicon substrate having a plurality of image display areas formed thereon and a mother glass substrate corresponding to the mother silicon substrate provided with a seal member for each image display area, and a mother silicon substrate for each image display area Manufacturing method of liquid crystal display panel, wherein the mother glass substrate and the mother silicon substrate are diced into V-grooves, and further scribed and divided at the bottom of the V-groove. And
[0011]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a top view in which a seal member is applied to the outer periphery of the image display area of the mother silicon substrate, and FIG. 2 is a side view in which the mother silicon substrate and the mother glass substrate are attached. A seal member 4 is applied by screen printing or the like, leaving a liquid crystal injection port 3 on the outer periphery of the image display region 2 formed in plural on the mother silicon substrate 1, and a mother glass substrate 5 is pasted to cure the seal member.
[0012]
FIG. 3 is a view for explaining the present invention, and is a cross-sectional view obtained by V-shaped dicing on a mother glass substrate. Conventionally, dicing has used a disc-shaped thin grindstone to form a dicing line (the cross-sectional shape is U), but in the present invention, the dicing line has a V-shaped cross-sectional shape. For example, a dicing line 6 having a groove depth of 70 μm is formed so that the opening angle of V is 90 degrees with respect to a glass substrate having a thickness of 700 μm.
[0013]
FIG. 4 is a view for explaining the present invention, and is a sectional view in which a V-shaped groove bottom is scribed. The scribing blade edge 7 is aligned with the bottom of the V-shaped groove of the dicing line 6 (at this time, it goes without saying that the cutting edge angle of the scribing is smaller than the opening angle of the V groove). The remaining portion of the mother glass substrate 5 is divided by the line 8 by the scribe pressure. Whether to divide from the mother glass substrate 5 or from the mother silicon substrate 1 is merely a choice, but in the state of FIG. 4, the mother silicon substrate 1 is diced according to the prior art and is not yet divided. Therefore, even if the mother glass substrate 5 is divided, it does not fall apart. However, the mother silicon substrate 1 must be diced before the mother glass substrate 5 is scribed. When the mother silicon substrate 1 is divided first, the mother glass substrate 5 may be diced before that. This is because the cooling liquid is used in dicing, and if divided, the cooling liquid enters the liquid crystal display panel from the liquid crystal inlet.
[0014]
FIG. 5 is a cross-sectional view of a liquid crystal display panel completed by dividing. The corners of the glass substrate 5 are chamfered by dicing, and the occurrence of chipping can be prevented.
[0015]
FIG. 6 is a sectional view of a liquid crystal display panel completed by the manufacturing method according to the second aspect of the present invention. Both the glass substrate 5 and the silicon substrate 1 are diced into V-grooves, so that there is a chamfering effect, and each V-groove bottom is scribed and divided to eliminate the need for impact during division, so that the silicon substrate 1 is formed. There is no destruction of the device.
[0016]
【The invention's effect】
According to the present invention, since the diced surface becomes a chamfered surface, chipping generated at the corners is prevented, and the generation of glass scratches can be prevented. Therefore, material handling in the later process can be done easily.
[0017]
According to the present invention, an impact for dividing is not necessary, damage to elements formed on a silicon substrate can be prevented, a manufacturing yield can be increased, and a liquid crystal display panel can be provided at low cost.
[Brief description of the drawings]
FIG. 1 is a top view in which a seal member is applied to the outer periphery of an image display area of a mother silicon substrate. FIG. 2 is a side view in which a mother silicon substrate and a mother glass substrate are attached. Sectional view with V-shaped dicing on the mother glass substrate. FIG. 4 is a diagram for explaining the present invention, and is a sectional view in which the bottom of the V-shaped groove is scribed. FIG. FIG. 6 is a cross-sectional view of a liquid crystal display panel completed by the manufacturing method according to claim 2.
1 Mother Silicon Substrate 2 Image Display Area 3 Liquid Crystal Injection Port 4 Seal Member 5 Mother Glass Substrate 6 V-Groove 7 Scribe Blade 8 Split Line

Claims (2)

少なくとも、複数の画像表示領域を形成したマザーシリコン基板と該マザーシリコン基板に対応するマザーガラス基板を各画像表示領域毎にシール部材を設けて貼付する工程と、各画像表示領域毎にマザーシリコン基板とマザーガラス基板を分割する工程を有する液晶表示パネルの製造方法において、マザーガラス基板はV溝状にダイシングしてからさらにV溝底部をスクライブして分割することを特徴とする液晶表示パネルの製造方法。At least a mother silicon substrate having a plurality of image display areas formed thereon and a mother glass substrate corresponding to the mother silicon substrate provided with a seal member for each image display area, and a mother silicon substrate for each image display area And a step of dividing the mother glass substrate, wherein the mother glass substrate is diced into a V-groove shape, and then the bottom of the V-groove is scribed to divide the liquid crystal display panel. Method. 少なくとも、複数の画像表示領域を形成したマザーシリコン基板と該マザーシリコン基板に対応するマザーガラス基板を各画像表示領域毎にシール部材を設けて貼付する工程と、各画像表示領域毎にマザーシリコン基板とマザーガラス基板を分割する工程を有する液晶表示パネルの製造方法において、マザーガラス基板およびマザーシリコン基板はV溝状にダイシングしてからさらにV溝底部をスクライブして分割することを特徴とする液晶表示パネルの製造方法。At least a mother silicon substrate having a plurality of image display areas formed thereon and a mother glass substrate corresponding to the mother silicon substrate provided with a seal member for each image display area, and a mother silicon substrate for each image display area And a mother glass substrate, wherein the mother glass substrate and the mother silicon substrate are diced into V-grooves and further scribed and divided at the bottom of the V-groove. Manufacturing method of display panel.
JP2003069419A 2003-03-14 2003-03-14 Manufacturing method of liquid crystal display panel Expired - Fee Related JP4133475B2 (en)

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JPS6195544A (en) * 1984-10-17 1986-05-14 Hitachi Ltd Pelletizing method
JP3010325B2 (en) * 1992-02-21 2000-02-21 キヤノン株式会社 Liquid crystal panel manufacturing method
JPH07248477A (en) * 1994-03-14 1995-09-26 Sharp Corp Production of liquid crystal display device
JPH0837168A (en) * 1994-07-25 1996-02-06 Sumitomo Electric Ind Ltd Method and apparatus for dicing semiconductor wafer
JPH08320460A (en) * 1995-05-26 1996-12-03 Matsushita Electric Ind Co Ltd Production of liquid crystal panel and device for scribing glass substrate
JPH09292616A (en) * 1996-04-25 1997-11-11 Sony Corp Production of liquid crystal display device
JPH09309736A (en) * 1996-05-20 1997-12-02 Optrex Corp Glass substrate cutter and its cutting
JPH1064855A (en) * 1996-08-14 1998-03-06 Toshiba Corp Method for manufacturing semiconductor device
JP2000247670A (en) * 1999-02-25 2000-09-12 Seiko Epson Corp Method for cutting glass substrate, cutting tool, cutting device and production of liquid crystal device
JP4119070B2 (en) * 2000-03-22 2008-07-16 シチズンミヨタ株式会社 Manufacturing method of liquid crystal panel
JP2002093956A (en) * 2000-09-11 2002-03-29 Sony Corp Electronic circuit device and its manufacturing method
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