JP2009069731A - Method of manufacturing electrooptical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electrooptical device preventing a terminal part from being damaged due to chipping of a substrate. <P>SOLUTION: The manufacturing method of the liquid crystal device 20 has steps of: (a) dropping a liquid crystal 29 onto a mother substrate 11, (b) bonding a counter mother substrate 12 on the mother substrate 11 to manufacture a composite substrate 10, (c) removing a terminal part facing piece facing a terminal part 24 among the counter mother substrates 12, (d) performing scribing along a scheduled cutting line 13 parallel to a direction of arranging the terminal part 24 in plane view in the surface opposite to the surface facing the mother substrate 11, and (e) and (f) breaking the mother substrate 11 by applying force to an end part along the terminal part 24 in the counter mother substrate 12 positioned on the side opposite to the scheduled cutting line 13 via the terminal part 24 in plane view. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  One embodiment according to the present invention relates to a method of manufacturing an electro-optical device.

  A liquid crystal device as an example of the electro-optical device includes an element substrate and a counter substrate that are disposed to face each other, and liquid crystal that is disposed between the element substrate and the counter substrate. In one configuration of the liquid crystal device, the element substrate is larger than the counter substrate, and a terminal portion that is electrically connected to an external circuit is exposed at a portion of the element substrate that protrudes from the counter substrate. There is something.

  The following method is known as one of the methods for manufacturing the liquid crystal device. That is, a method of first bonding a plurality of counter substrates on a wafer-like mother substrate including a plurality of element substrates in a state where terminal portions of the element substrates are exposed, and then breaking the mother substrate to take out individual liquid crystal devices. (See Patent Document 1). Alternatively, the liquid crystal device can be manufactured by the following method. That is, after dropping liquid crystal on a mother substrate, a wafer-like counter mother substrate including a plurality of counter substrates is bonded together. Then, a portion of the counter mother substrate that opposes the terminal portion is removed, and then the mother substrate and the counter mother substrate are broken to the size of each liquid crystal device.

  8A and 8B are cross-sectional views showing a part of the steps of the manufacturing method. FIG. 8A shows a state in which the opposing mother substrate 12 (or the opposing substrate 22) is bonded to the opposing surface of the mother substrate 11 via the sealing material 27. FIG. A liquid crystal 29 is sealed between the mother substrate 11 and the counter mother substrate 12. Further, the portion of the counter mother substrate 12 facing the terminal portion 24 is removed, and the terminal portion 24 and the data line driving circuit 23 are exposed on the facing surface of the mother substrate 11. In the method for manufacturing the liquid crystal device described above, in the state of FIG. 8A, there is a step of breaking the mother substrate 11 along the planned cutting line 13 parallel to the arrangement direction of the terminal portions 24 (extending in the direction perpendicular to the paper surface). included.

JP 2006-98631 A

  However, when breaking along the planned cutting line 13, the cut surface 33 of the mother substrate 11 may be bent in a direction away from the terminal portion 24. As a result, as shown in FIG. 8B, a protruding portion remains at the end of the mother substrate 11 after the break. This protruding portion is easily chipped by receiving an external force, and the terminal portion 24 may be damaged when the small piece 21a including the protruding portion is chipped. Due to these problems, there is a problem that the yield decreases.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] A first substrate including a plurality of components of an electro-optical device, and a terminal portion of the component being exposed to a facing surface of the first substrate via a sealing material. An arrangement of the terminal portions in a plan view of a surface of the first substrate opposite to the facing surface with respect to a composite substrate having a second substrate bonded to the facing surface of the first substrate. Step A of scribing along a planned cutting line parallel to the direction, and along the terminal portion of the second substrate located on the opposite side of the planned cutting line across the terminal portion in plan view And a step B of applying a force to the end portion to break the first substrate.

  According to such a method, in step B, the first substrate is a cut surface that bends toward the terminal portion as it approaches the opposing surface starting from the planned cutting line, or the surface of the first substrate starting from the planned cutting line. Break along a cutting plane substantially perpendicular to As a result, in the first substrate after the break, no protruding portion remains in the vicinity of the terminal portion. Therefore, it is possible to make it difficult for the terminal portion to be damaged due to the chipping of the first substrate.

  Application Example 2 In the method of manufacturing the electro-optical device, the cutting position on the facing surface of the first substrate in the step B is between the planned cutting line and the terminal portion in plan view. A method for manufacturing a positioned electro-optical device.

  According to such a method, it is possible to break the first substrate without damaging the terminal portion in the step B.

  Application Example 3 In the method of manufacturing the electro-optical device, the step of dropping liquid crystal on the facing surface of the first substrate before the step A and the surface of the first substrate on the facing surface The second substrate including a plurality of components of the electro-optical device is bonded to the liquid crystal in a space formed by the first substrate, the second substrate, and the sealing material. And a step of removing a portion of the second substrate that faces the terminal portion of the second substrate.

  According to such a method, when the second substrate has a size including the components of the plurality of electro-optical devices, the electro-optical device is unlikely to be damaged due to the terminal portion being damaged due to the chip of the first substrate. Can be manufactured.

  Application Example 4 In the method of manufacturing the electro-optical device, the second size having a size corresponding to the single electro-optical device is formed on the facing surface of the first substrate before the step A. And bonding the substrate through the sealing material with the terminal portion exposed to the facing surface, and liquid crystal in a space formed by the first substrate, the second substrate, and the sealing material. And a step of injecting the electro-optical device.

  According to such a method, in the case where the second substrate has a size corresponding to a single electro-optical device, the electro-optical device in which the terminal portion is not easily damaged due to the chipping of the first substrate is prevented. Can be manufactured.

  Hereinafter, an embodiment of a method for manufacturing an electro-optical device will be described with reference to the drawings. In the drawings shown below, the dimensions and ratios of the components are appropriately different from the actual ones in order to make the components large enough to be recognized on the drawings.

(First embodiment)
FIG. 1A is a plan view of the composite substrate 10, and FIG. 1B is a side view of the composite substrate 10. The composite substrate 10 has a configuration in which a substantially disc-shaped mother substrate 11 as a first substrate and a substantially disc-shaped counter mother substrate 12 as a second substrate are bonded to face each other. A surface of the mother substrate 11 that faces the counter mother substrate 12 is referred to as a counter surface. The mother substrate 11 and the opposing mother substrate 12 have substantially the same shape in plan view, and both have a thickness of about 1.2 mm. Here, the plan view means viewing from the normal direction of the mother substrate 11. The mother substrate 11 and the counter mother substrate 12 are configured using a quartz wafer as a base. Further, the mother substrate 11 and the counter mother substrate 12 are provided with orientation flats at the ends.

  The composite substrate 10 is one form of a fluidized substrate in the manufacturing process of the liquid crystal device 20 (FIG. 2) as an electro-optical device. As shown in FIG. 1A, a plurality of components corresponding to a single liquid crystal device 20 are formed on the composite substrate 10 so as to be arranged in a matrix over a plurality of rows and a plurality of columns. Therefore, each of the mother substrate 11 and the counter mother substrate 12 includes a plurality of components of the liquid crystal device 20. Here, the components formed on the mother substrate 11 are, for example, TFT (Thin Film Transistor) elements, scanning lines, data lines, data line driving circuits 23 (FIG. 2), terminal portions 24 (FIG. 2), pixel electrodes, The constituent elements formed on the counter mother substrate 12 such as an alignment film are, for example, a common electrode and an alignment film. In this specification, the row direction in which the components of the liquid crystal device 20 are arranged is defined as the X axis, the column direction is defined as the Y axis, and the normal direction of the mother substrate 11 is defined as the Z axis.

  In FIG. 1A, scheduled cutting lines 13, 14 a, 14 b, and 15 where breaks (cutting) are performed in the manufacturing process of the liquid crystal device 20 are drawn with solid lines. Of these, the mother substrate 11 is broken at the planned cutting lines 13 and 15, and the opposing mother substrate 12 is broken at the planned cutting lines 14 a, 14 b and 15. More specifically, the opposing mother board 12 is first broken at the planned cutting lines 14a and 14b, and the terminal portion opposing pieces 17 are removed. Next, the mother substrate 11 is broken along the planned cutting line 13, and the composite substrate 10 is divided into a plurality of strip-shaped composite substrates 40. Finally, both the mother substrate 11 and the counter mother substrate 12 are broken along the planned cutting line 15, and the individual liquid crystal devices 20 are taken out. Note that the position of the planned cutting line 15 in plan view may be different between the mother substrate 11 and the opposing mother substrate 12 as necessary.

  2A and 2B are diagrams illustrating the liquid crystal device 20, in which FIG. 2A is a plan view and FIG. 2B is a cross-sectional view taken along line AA in FIG. The liquid crystal device 20 includes a rectangular element substrate 21 cut out from the mother substrate 11 and a rectangular counter substrate 22 cut out from the counter mother substrate 12. A counter substrate 22 is bonded to the opposing surface of the element substrate 21 with a sealant 27 interposed therebetween. The sealing material 27 is arranged in a frame shape so as to substantially match the contour shape of the counter substrate 22. In a space formed by the element substrate 21, the counter substrate 22, and the sealing material 27, a liquid crystal 29 as an electro-optical material is sealed. The layer thickness of the liquid crystal 29 is about several μm.

  The element substrate 21 is slightly larger than the counter substrate 22 in plan view. A data line driving circuit 23 and a terminal portion 24 are provided along one side of the element substrate 21 (side corresponding to the planned cutting line 13) on the opposite surface of the element substrate 21 in a region protruding from the counter substrate 22. The scanning line driving circuit 25 is formed along two sides that intersect the side. Therefore, the data line driving circuit 23, the terminal unit 24, and the scanning line driving circuit 25 are exposed to the outside. Among these, the terminal part 24 is arranged so as to be parallel to the planned cutting line 13. In other words, the planned cutting line 13 is parallel to the arrangement direction of the terminal portions 24. Although the counter substrate 22 does not exist at a position facing the data line driving circuit 23 and the terminal portion 24, this portion is the terminal portion facing piece 17 of the counter mother substrate 12 that is removed in the manufacturing process (FIG. 1A). ) Corresponds to the part where the position was located. In addition, at the four corners of the counter substrate 22, vertical conductive members 26 are provided for electrical conduction between the element substrate 21 and the counter substrate 22.

  Although not shown in FIG. 2, a pixel electrode for applying a driving voltage to the liquid crystal 29 and a circuit element electrically connected to the pixel electrode are provided on the opposite surface (surface on the liquid crystal 29 side) of the element substrate 21. Is formed. The circuit element includes a TFT element electrically connected to the pixel electrode, a scanning line for applying a drive signal to the TFT element, a data line, a capacitor element, and the like. The circuit elements are driven by signals supplied from the data line driving circuit 23 and the scanning line driving circuit 25. The data line driving circuit 23 and the scanning line driving circuit 25 are electrically connected to the terminal portion 24. An external circuit such as an FPC (Flexible Printed Circuit) connected to a driver IC or the like is mounted on the terminal unit 24, and signals for operating the data line driving circuit 23 and the scanning line driving circuit 25 are input from the outside. . An alignment film for aligning the liquid crystal 29 is formed on the surface of the pixel electrode on the liquid crystal 29 side.

  A common electrode facing the pixel electrode is formed on the surface of the counter substrate 22 on the liquid crystal 29 side. An alignment film for aligning the liquid crystal 29 is formed on the liquid crystal 29 side surface of the common electrode.

  The alignment state of the liquid crystal 29 changes according to the driving voltage applied between the pixel electrode and the common electrode. The liquid crystal 29 can change the polarization state of the transmitted light according to the alignment state. The liquid crystal device 20 is an electro-optical device that performs display by modulating incident light using the polarization conversion function of the liquid crystal 29. The liquid crystal device 20 can be used as a light valve mounted on a projector as an electronic device, for example.

  Next, a method for manufacturing the liquid crystal device 20 will be described with reference to FIGS. 3 is a flowchart showing a method for manufacturing the liquid crystal device 20, and FIGS. 4A to 4F are cross-sectional views in each manufacturing process of the liquid crystal device 20. Hereinafter, it demonstrates along the flowchart of FIG.

  The method for manufacturing the liquid crystal device 20 according to the present embodiment includes steps P1 to P6. First, the mother substrate 11 and the counter mother substrate 12 are manufactured prior to the process P1. The manufacturing process of the mother substrate 11 includes, for example, a process of forming circuit elements, data line driving circuits 23, terminal portions 24, pixel electrodes, alignment films, and the like corresponding to the plurality of liquid crystal devices 20 on a quartz wafer, and an alignment film. And a rubbing process. The manufacturing process of the counter mother substrate 12 includes, for example, a process of forming common electrodes, alignment films and the like corresponding to the plurality of liquid crystal devices 20 on a quartz wafer, and a process of rubbing the alignment film. Further, the sealing material 27 is formed on the mother substrate 11 or the counter mother substrate 12 by a dispenser coating method or the like. In the present embodiment, a frame-shaped sealing material 27 that substantially matches the contour shape of the counter substrate 22 is formed on the counter surface of the mother substrate 11.

  In the process P1, the liquid crystal 29 is dropped on the opposing surface of the mother substrate 11 (FIG. 4A). For example, droplets of the liquid crystal 29 are ejected to the region surrounded by the frame-shaped sealing material 27 on the opposing surface of the mother substrate 11 using the droplet ejection device 50.

  In step P2, the opposing mother substrate 12 is bonded to the opposing surface of the mother substrate 11 via the sealing material 27 to manufacture the composite substrate 10 (FIG. 4B). As a result, the liquid crystal 29 is sealed in the space formed by the mother substrate 11, the opposing mother substrate 12, and the sealing material 27. As an example, the process P2 includes a process of performing alignment (arament) between the mother substrate 11 and the counter mother substrate 12, a process of bonding the mother substrate 11 and the counter mother substrate 12 under vacuum, and a sealing material 27. Curing.

  In the series of steps up to step P2, the liquid crystal 29 may be dropped onto the counter mother substrate 12 and the mother substrate 11 may be bonded to the counter mother substrate 12. Further, the sealing material 27 may be formed on the counter mother substrate 12 and then bonded.

  In the process P3, the terminal portion 24 is exposed by removing the portion of the counter mother substrate 12 that faces the terminal portion 24, that is, the terminal portion facing piece 17 (FIG. 1A) (FIG. 4C). )). In the present embodiment, a portion of the counter mother substrate 12 that faces the terminal portion 24 and the data line driving circuit 23 is a terminal portion facing piece 17, which is removed to expose the terminal portion 24 and the data line driving circuit 23. I am letting. The process P3 can be performed by the following procedure as an example. First, the opposing mother substrate 12 is scribed and broken along the planned cutting line 14b, and then the opposing mother substrate 12 is diced along the planned cutting lines 14a and 14b. At this time, dicing is stopped halfway in the thickness direction of the opposing mother substrate 12. In this state, the terminal portion facing piece 17 is removed by suction while blowing air to the terminal portion facing piece 17. The width of the terminal portion facing piece 17 in the Y direction, that is, the distance between the planned cutting line 14a and the planned cutting line 14b is about 1.5 mm. Through this step, all the row of terminal portion facing pieces 17 arranged in the X direction shown in FIG. 1A are removed. As a result, the mother substrate 11 including the components of the liquid crystal device 20 and the opposing surface of the mother substrate 11 via the sealing material 27 with the terminal portion 24 of the above-described components exposed to the opposing surface of the mother substrate 11. The composite substrate 10 having the counter mother substrate 12 bonded together is obtained.

  When the opposing mother substrate 12 is broken, the composite substrate 10 is placed on a support base (not shown) made of a metal plate or an elastic material such as resin or rubber. The support base has a predetermined thickness and a predetermined hardness, and is configured to bend when pressed. In order to ensure a sufficient amount of bending, the support base may be a three-layer structure including, for example, two relatively thin metal plates and an elastic member interposed between these metal plates. By installing the composite substrate 10 on such a support base, the composite substrate 10 itself is also easily bent when subjected to force, so that the break can be easily performed. Also in the case of the break in the process P5 and process P6 mentioned later, it carries out in the state which installed the composite substrate 10 or the strip-shaped composite substrate 40 on the said support stand.

  The process P3 can be performed by various procedures other than the above-described procedure. For example, after the opposing mother substrate 12 is scribed and broken along the scheduled cutting lines 14a and 14b, the terminal portion opposing pieces 17 may be removed by hand.

  In the process P4, scribing is performed along the planned cutting line 13 parallel to the arrangement direction of the terminal portions 24 in plan view on the surface opposite to the facing surface of the mother substrate 11 (FIG. 4D). Process P4 corresponds to process A. The planned cutting line 13 is a line that defines the outer shape of the side where the terminal portion 24 is formed in the element substrate 21 (FIG. 4F) in the completed liquid crystal device 20. Therefore, the planned cutting line 13 is set between the terminal portion 24 of a certain liquid crystal device 20 and the sealing material 27 of the liquid crystal device 20 adjacent thereto in plan view. The process P4 includes, for example, a process of cutting the surface of the mother substrate 11 along the planned cutting line 13 with a diamond cutter or the like. A diamond cutter having fine irregularities formed on the blade portion may be used. By scribing using a diamond cutter having such a structure, a deeper cut can be formed in the mother substrate 11, so that bending of the cut surface when the mother substrate 11 is subsequently broken is suppressed. Is possible. Although the planned cutting line 13 is drawn so as to overlap the planned cutting line 14a in plan view in FIG. 1A, it may be set at a position different from the planned cutting line 14a in plan view.

  In step P5, the mother substrate 11 is broken along the planned cutting line 13 (FIG. 4E). Process P5 corresponds to process B. More specifically, in step P5, by applying a force to the end portion along the terminal portion 24 of the opposed mother substrate 12 located on the opposite side of the planned cutting line 13 across the terminal portion 24 in plan view, The mother substrate 11 is broken. An arrow in FIG. 4E indicates a portion where a force is applied to the counter mother substrate 12. According to such a procedure, the mother substrate 11 is broken along the cut surface 32 that bends toward the terminal portion 24 as it approaches the opposing surface starting from the planned cutting line 13. In other words, by applying a force to the end portion of the counter mother board 12 along the terminal section 24, the terminal section 24 side becomes closer to the counter surface starting from the planned cutting line 13 with respect to the mother board 11. A stress that cuts along the curved cutting surface 32 can be applied.

  FIG. 5A is a more detailed cross-sectional view showing the cut surface 32 of the mother substrate 11 in the process P5. As described above, as the cutting surface 32 of the mother substrate 11 is bent toward the opposing surface, the cutting position on the opposing surface of the mother substrate 11 is the cutting line 13 (position u) and the terminal in plan view. It will be located between the ends (position v) of the portion 24.

  The mother substrate 11 that has been broken in this way is divided at the cut surface 32 to form a strip-shaped composite substrate 40 (FIGS. 4 (f) and 1 (a)). FIG. 5B is a cross-sectional view of the vicinity of the terminal portion 24 at this time. As shown in this figure, as a result of the break along the cut surface 32 that bends toward the terminal portion 24 side, in the vicinity of the terminal portion 24 of the mother board 11 after the break, for example, a protruding shape as shown in FIG. The part of will not remain. For this reason, it is possible to make it difficult to cause a problem that the terminal portion 24 of the mother board 11 is damaged due to the lack of the portion including the protruding portion.

  Note that the cutting position on the opposing surface of the mother substrate 11 at the time of the break may be located anywhere between the position u and the position v in plan view. The cut surface 32a in FIG. 5 (c) shows an example of a cut surface in which the cut position on the opposite surface is closest to the position u, and the cut surface 32b has the cut position on the opposite surface closest to the position v. The example of the cut surface which becomes will be shown. The cut surface 32a is a cut surface that is substantially perpendicular to the surface of the mother substrate 11 with the planned cutting line 13 as a starting point.

  In addition, as in the present embodiment, the terminal portion facing piece 17 is removed in the process P3 before the strip-shaped composite substrate 40 is formed for the following reason. In other words, when the strip-shaped composite substrate 40 is in the state first, the length of the strip-shaped composite substrate 40 varies depending on being cut out from the disc-shaped composite substrate 10, so that the subsequent processes are automated. This is because it becomes difficult.

  In step P6, the strip composite substrate 40 obtained in step P5 is broken into pieces. More specifically, the individual liquid crystal devices 20 are cut out by scribing and breaking the mother substrate 11 and the counter mother substrate 12 along the planned cutting line 15 (FIG. 1a).

  The liquid crystal device 20 is manufactured through the above steps. In such a manufacturing method, since a projecting portion does not occur in the vicinity of the terminal portion 24 of the mother substrate 11 (element substrate 21), a defect due to a defect in the projecting portion is unlikely to occur. For this reason, the liquid crystal device 20 can be manufactured with a high yield. Further, in the liquid crystal device 20 obtained by the above manufacturing method, since no protruding portion remains in the vicinity of the terminal portion 24 of the element substrate 21, the terminal portion 24 is damaged due to the lack of the protruding portion. Such troubles are unlikely to occur. Therefore, according to the manufacturing method, a highly reliable liquid crystal device 20 that is less likely to be defective due to chipping of the element substrate 21 can be obtained.

(Second Embodiment)
Next, the second embodiment will be described. The second embodiment differs from the first embodiment in a part of the process of the manufacturing method of the liquid crystal device 20. Other steps of the manufacturing method of the liquid crystal device 20 and the configuration of the manufactured liquid crystal device 20 are the same as those in the first embodiment. Below, it demonstrates centering around difference with 1st Embodiment.

  FIG. 6 is a flowchart illustrating a manufacturing method of the liquid crystal device 20 according to the second embodiment, and FIGS. 7A to 7E are cross-sectional views in each manufacturing process of the liquid crystal device 20. Hereinafter, it demonstrates along the flowchart of FIG.

  The manufacturing method of the liquid crystal device 20 according to the present embodiment includes steps S1 to S5. In the present embodiment, the liquid crystal device 20 is manufactured using a small-sized counter substrate 22 instead of the wafer-like counter mother substrate 12 in the first embodiment. Therefore, in the present embodiment, the counter substrate 22 corresponds to the second substrate.

  First, prior to step S1, the mother substrate 11 and the counter substrate 22 are manufactured. The configuration and manufacturing method of the mother substrate 11 are the same as those in the first embodiment. The counter substrate 22 is a substrate having a configuration similar to that of the counter substrate 22 included in the liquid crystal device 20 of the first embodiment. The manufacturing process of the counter substrate 22 includes a process of forming a common electrode, an alignment film, and the like on a quartz substrate having a size corresponding to a single liquid crystal device 20, and a process of rubbing the alignment film. Further, a sealing material 27 is formed on the opposing surface of the mother substrate 11 by a dispenser coating method or the like. Here, the sealing material 27 is arranged in a frame shape having an opening so as to substantially match the contour shape of the counter substrate 22. The opening of the sealing material 27 later becomes a liquid crystal injection port. The sealing material 27 may be formed on the counter substrate 22.

  In step S1, the composite substrate 10 is manufactured by attaching the counter substrate 22 to the counter surface of the mother substrate 11 via the sealing material 27 (FIG. 7A). At this time, the counter substrate 22 is bonded in a state where the terminal portion 24 of the mother substrate 11 and the data line driving circuit 23 are exposed on the counter surface. As a result, the mother substrate 11 including the components of the liquid crystal device 20 and the opposing surface of the mother substrate 11 via the sealing material 27 with the terminal portion 24 of the above-described components exposed to the opposing surface of the mother substrate 11. Thus, the composite substrate 10 having the bonded counter substrate 22 is obtained. For example, the step S1 includes a step of performing alignment (arament) between the mother substrate 11 and the counter substrate 22, a step of bonding the mother substrate 11 and the counter substrate 22, and a step of curing the sealing material 27. including.

  In step S2, liquid crystal 29 is injected into the space formed by the mother substrate 11, the counter substrate 22, and the sealing material 27 (FIG. 7B). More specifically, first, the liquid crystal 29 is supplied to an opening (liquid crystal inlet) provided in the sealing material 27 under vacuum. Thereby, the liquid crystal 29 is injected into the space formed by the mother substrate 11, the counter substrate 22, and the sealing material 27. Thereafter, the liquid crystal injection port is sealed with a UV curable resin or the like. In this way, the liquid crystal 29 is sealed in the space formed by the mother substrate 11, the counter substrate 22, and the sealing material 27.

  In step S3, scribing is performed along the planned cutting line 13 parallel to the arrangement direction of the terminal portions 24 in a plan view on the surface opposite to the facing surface of the mother substrate 11 (FIG. 7C). Step S3 is performed similarly to step P4 of the first embodiment.

  In step S4, the mother substrate 11 is broken along the planned cutting line 13 (FIG. 7D). More specifically, in step S4, a force is applied to an end portion along the terminal portion 24 of the counter substrate 22 located on the opposite side of the planned cutting line 13 with the terminal portion 24 interposed therebetween in plan view. Breaking the substrate 11 is performed. An arrow in FIG. 7D indicates a portion where a force is applied to the counter substrate 22. The process S4 is performed in the same manner as the process P5 of the first embodiment with respect to other points. As a result, the mother substrate 11 is broken along the cut surface 32 that bends toward the terminal portion 24 as it approaches the opposing surface starting from the planned cutting line 13. The mother substrate 11 that has been broken in this manner is divided at the cut surface 32 to form a strip-shaped composite substrate 40 (FIGS. 7E and 1A). At this time, no projecting portion remains in the vicinity of the terminal portion 24 of the mother substrate 11 after the break. Therefore, it is possible to make it difficult to cause a problem that the terminal portion 24 of the mother board 11 is damaged due to the lack of the portion including the protruding portion.

  In step S5, the strip-like composite substrate 40 obtained in step S4 is broken into pieces. In this embodiment, since the counter substrate 22 is in a state of being separated into pieces, it is sufficient to cut the mother substrate 11 along the planned cutting line 15 (FIG. 1A) in step S5.

  The liquid crystal device 20 is manufactured through the above steps. As described above, the liquid crystal device 20 can be manufactured at a high yield by the manufacturing method including the step of bonding the individual counter substrate 22 to the mother substrate 11 by the same effect as that of the first embodiment. Further, it is possible to obtain a highly reliable liquid crystal device 20 in which defects due to chipping of the element substrate 21 hardly occur.

(A) is a top view of a composite substrate, (b) is a side view of a composite substrate. It is a figure which shows a liquid crystal device, (a) is a top view, (b) is sectional drawing in the AA in (a). 5 is a flowchart showing a method for manufacturing the liquid crystal device according to the first embodiment. (A) to (f) is a cross-sectional view in each manufacturing process of a liquid crystal device. (A) is sectional drawing which shows the cut surface of a mother board | substrate, (b) is sectional drawing of the terminal part vicinity after a break, (c) is sectional drawing which shows the example of a cut surface. 9 is a flowchart showing a method for manufacturing a liquid crystal device according to a second embodiment. (A) to (e) are cross-sectional views in each manufacturing process of the liquid crystal device. (A), (b) is sectional drawing which shows a part of process of the manufacturing method of the conventional liquid crystal device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Composite board | substrate, 11 ... Mother board | substrate as 1st board | substrate, 12 ... Counter mother board | substrate as 2nd board | substrate, 13, 14a, 14b, 15 ... Planned cutting line, 17 ... Terminal part opposing piece, 20 ... Electricity Liquid crystal device as an optical device, 21 ... element substrate, 22 ... counter substrate, 23 ... data line driving circuit, 24 ... terminal portion, 25 ... scanning line driving circuit, 26 ... vertical conduction material, 27 ... sealing material, 29 ... liquid crystal , 32 ... cut surface, 40 ... strip-shaped composite substrate, 50 ... droplet discharge device.

Claims (4)

A first substrate including a plurality of components of the electro-optical device; and the terminal of the first substrate through a sealing material in a state where a terminal portion of the components is exposed to the opposing surface of the first substrate. For a composite substrate having a second substrate bonded to the facing surface, cutting parallel to the arrangement direction of the terminal portions in a plan view of the surface of the first substrate opposite to the facing surface Step A for scribing along the planned line,
Breaking the first substrate by applying a force to an end portion along the terminal portion of the second substrate located on the opposite side of the planned cutting line across the terminal portion in plan view. A method of manufacturing an electro-optical device. A method of manufacturing the electro-optical device according to claim 1,
The method of manufacturing an electro-optical device, wherein the cutting position of the first substrate in the step B on the facing surface is located between the planned cutting line and the terminal portion in plan view. A method of manufacturing an electro-optical device according to claim 1 or 2,
Before step A,
Dropping a liquid crystal on the facing surface of the first substrate;
The second substrate including a plurality of components of the electro-optical device is bonded to the opposing surface of the first substrate via the sealing material, and the first substrate, the second substrate, and the Sealing the liquid crystal in a space formed by a sealing material;
And a step of removing a portion of the second substrate that faces the terminal portion. A method of manufacturing an electro-optical device according to claim 1 or 2,
Before step A,
The second substrate having a size corresponding to a single electro-optical device is disposed on the facing surface of the first substrate with the terminal portion exposed to the facing surface through the sealant. A process of bonding,
And a step of injecting liquid crystal into a space formed by the first substrate, the second substrate, and the sealing material.

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