JP4105269B2 - 膜形成方法 - Google Patents
膜形成方法 Download PDFInfo
- Publication number
- JP4105269B2 JP4105269B2 JP00882198A JP882198A JP4105269B2 JP 4105269 B2 JP4105269 B2 JP 4105269B2 JP 00882198 A JP00882198 A JP 00882198A JP 882198 A JP882198 A JP 882198A JP 4105269 B2 JP4105269 B2 JP 4105269B2
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- film
- semiconductor wafer
- dropping
- coating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 53
- 230000015572 biosynthetic process Effects 0.000 title description 2
- 239000004065 semiconductor Substances 0.000 claims description 143
- 239000002904 solvent Substances 0.000 claims description 130
- 239000011248 coating agent Substances 0.000 claims description 69
- 238000000576 coating method Methods 0.000 claims description 69
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 54
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexyloxide Natural products O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 53
- 239000000243 solution Substances 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 43
- 238000004528 spin coating Methods 0.000 claims description 16
- 230000003111 delayed effect Effects 0.000 claims description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 8
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 4
- 235000014655 lactic acid Nutrition 0.000 claims description 4
- 239000004310 lactic acid Substances 0.000 claims description 4
- 125000002243 cyclohexanonyl group Chemical group *C1(*)C(=O)C(*)(*)C(*)(*)C(*)(*)C1(*)* 0.000 claims description 3
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical group COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 claims description 3
- 230000000977 initiatory effect Effects 0.000 claims description 2
- 239000011259 mixed solution Substances 0.000 claims description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
- -1 γ-ptyrolactone Natural products 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 description 32
- 239000000428 dust Substances 0.000 description 11
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 230000002209 hydrophobic effect Effects 0.000 description 7
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical group C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- PFJFNQUFMTYCHB-UHFFFAOYSA-N C[SiH2]N[SiH3] Chemical compound C[SiH2]N[SiH3] PFJFNQUFMTYCHB-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00882198A JP4105269B2 (ja) | 1997-01-31 | 1998-01-20 | 膜形成方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-18424 | 1997-01-31 | ||
| JP1842497 | 1997-01-31 | ||
| JP00882198A JP4105269B2 (ja) | 1997-01-31 | 1998-01-20 | 膜形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10275772A JPH10275772A (ja) | 1998-10-13 |
| JPH10275772A5 JPH10275772A5 (enExample) | 2005-08-04 |
| JP4105269B2 true JP4105269B2 (ja) | 2008-06-25 |
Family
ID=26343414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00882198A Expired - Fee Related JP4105269B2 (ja) | 1997-01-31 | 1998-01-20 | 膜形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4105269B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002343704A (ja) * | 2001-05-17 | 2002-11-29 | Nec Corp | 塗付膜形成方法およびその装置 |
| JP4669715B2 (ja) * | 2005-02-23 | 2011-04-13 | 株式会社康井精機 | 複合材料シートの製造装置 |
| JP5183562B2 (ja) * | 2009-04-27 | 2013-04-17 | 東京エレクトロン株式会社 | 塗布膜形成装置及び塗布膜形成方法 |
| JP6418130B2 (ja) * | 2015-10-20 | 2018-11-07 | 株式会社Sumco | 半導体ウェーハの加工方法 |
| JP6704258B2 (ja) * | 2016-02-03 | 2020-06-03 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体 |
-
1998
- 1998-01-20 JP JP00882198A patent/JP4105269B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10275772A (ja) | 1998-10-13 |
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